Chip (TTV heat source)
CN310087817SActive Publication Date: 2026-07-14HENAN MICRO NANO SEMICON TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- HENAN MICRO NANO SEMICON TECH CO LTD
- Filing Date
- 2026-01-27
- Publication Date
- 2026-07-14
Smart Images
Figure 000001_ABST
Abstract
1. Name of the product in this design: Chip (TTV Heat Source). 2. Purpose of this design: Chips for circuit boards. 3. The key design features of this product are the combination of shape and pattern. 4. The picture or photo that best illustrates the key design points: Design 1 front view. 5. This design is for a thin product; therefore, other views 1-3 are omitted. 6. Design 1 is designated as the basic design.
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