Heat sink (dual-core semiconductor 3-leaf shaped pin hook type)
CN310089687SActive Publication Date: 2026-07-14曾银平
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- 曾银平
- Filing Date
- 2025-12-23
- Publication Date
- 2026-07-14
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Heat sink (dual-core semiconductor 3-leaf shaped pin hook type). 2. Purpose of this design: A heat dissipation product used to cool down mobile phones. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D rendering 1.
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