Computer heat sink backplate

CN310089697SActive Publication Date: 2026-07-14CHENGDU UNIVERSITY OF TECHNOLOGY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
CHENGDU UNIVERSITY OF TECHNOLOGY
Filing Date
2025-12-25
Publication Date
2026-07-14

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Abstract

1. Name of this product: Computer heat dissipation backplate. 2. Purpose of this design: This design is used for heat dissipation of internal computer components. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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