Heat sink (magnetic semiconductor hexagonal pyramid shape for mobile phones)

CN310089711SActive Publication Date: 2026-07-14曾银平
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
曾银平
Filing Date
2025-12-26
Publication Date
2026-07-14

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Abstract

1. Name of the product in this design: Heat sink (mobile phone magnetic semiconductor hexagonal pyramid). 2. Purpose of this design: A heat dissipation product used to cool down mobile phones. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D rendering 1.
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