Semiconductor magnetic heat sink (B3)

CN310089754SActive Publication Date: 2026-07-14HONGQI TECH (SHANGHAI) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
HONGQI TECH (SHANGHAI) CO LTD
Filing Date
2025-12-31
Publication Date
2026-07-14

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Abstract

1. Name of the product in this design: Semiconductor magnetic heat sink (B3). 2. Application of this design: This design is used for cooling fans. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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