背贴手机支架(金环)
CN310096484SActive Publication Date: 2026-07-17胡禹
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- 胡禹
- Filing Date
- 2026-01-27
- Publication Date
- 2026-07-17
Smart Images
Figure 000001_ABST
Abstract
1.本外观设计产品的名称：背贴手机支架 (金环)。2.本外观设计产品的用途：该产品主要用途：用于粘贴在手机或电子产品背面，起支撑手机或电子产品的作用。3.本外观设计产品的设计要点：在于形状。4.最能表明设计要点的图片或照片：立体图。
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