高通量片材承载板
CN310098339SActive Publication Date: 2026-07-17SICHUAN HIGH ENTROPY TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SICHUAN HIGH ENTROPY TECHNOLOGY CO LTD
- Filing Date
- 2026-01-21
- Publication Date
- 2026-07-17
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Figure 000007_ABST
Abstract
1.本外观设计产品的名称:高通量片材承载板。2.本外观设计产品的用途:用于在高通量试验中承载待加工的片材。3.本外观设计产品的设计要点:在于产品的整体形状。4.最能表明设计要点的图片或照片:立体图1。
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