Wafer multi-wire sawing apparatus (DA680H)

CN310105080SActive Publication Date: 2026-07-21YANTAI LIKAI SEMICONDUCTOR TECHNOLOGY CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
YANTAI LIKAI SEMICONDUCTOR TECHNOLOGY CO LTD
Filing Date
2026-01-29
Publication Date
2026-07-21

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Abstract

1. Name of the designed product: wafer multi-wire saw equipment (DA680H). 2. Use of the designed product: for cutting materials. 3. Design points of the designed product: in shape. 4. Picture or photo that best shows the design points: front view.
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