Server heat dissipation module

CN310106198SActive Publication Date: 2026-07-21DONGGUAN MINGHUI XINNENG ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
DONGGUAN MINGHUI XINNENG ELECTRONIC TECHNOLOGY CO LTD
Filing Date
2026-01-15
Publication Date
2026-07-21

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Abstract

1. The name of the design product: server heat dissipation module. 2. The use of the design product: used for cooling the heat generating components such as chips and power supplies in servers. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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