Power semiconductor through-hole module (full bridge)
CN310124995SActive Publication Date: 2026-07-31CHONGQING CLOUDCHILD TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- CHONGQING CLOUDCHILD TECH CO LTD
- Filing Date
- 2025-12-29
- Publication Date
- 2026-07-31
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Power Semiconductor Through-hole Module (Full Bridge). 2. Application of this design: It is used for three-phase bridge topology drive control, such as electric motorcycle motor drive, electric tricycle motor drive, and other three-phase bridge drive control. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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