QFN (Quadruple-Flat-N) package for multi-chip co-packing
CN310125732SActive Publication Date: 2026-07-31TOLL MICROELECTRONIC CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- TOLL MICROELECTRONIC CO LTD
- Filing Date
- 2025-12-12
- Publication Date
- 2026-07-31
Smart Images
Figure 000003_ABST
Abstract
1. Name of the product in this design: Multi-chip QFN (Quadruple-Flat-N) package. 2. Application of this design: to support the co-packaging of multiple chips and high heat dissipation. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key features: the rear view.
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