Memory module casing (cover)
CN310125739SActive Publication Date: 2026-07-31SHENZHEN CHUQI TECHNOLOGY CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN CHUQI TECHNOLOGY CO LTD
- Filing Date
- 2026-01-28
- Publication Date
- 2026-07-31
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Figure 000007_ABST
Abstract
1. Name of this design product: Memory module casing (shell). 2. Purpose of this product design: To be installed on the exterior of a memory module to protect the memory module and promote heat dissipation. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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