Fully automated push-pull force testing system (MFM2000)
CN310126105SActive Publication Date: 2026-07-31SHENZHEN DERUIYIN PRECISION TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN DERUIYIN PRECISION TECH CO LTD
- Filing Date
- 2025-12-26
- Publication Date
- 2026-07-31
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Figure 000001_ABST
Abstract
1. Name of the product in this design: Fully Automatic Push-Pull Force Testing System (MFM2000). 2. Purpose of this design: For quality control of wafer-level advanced packaging processes in the semiconductor packaging field, to check whether the wafer-level packaging electroplating process meets the process requirements. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: the front view.
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