Die bonder
CN310126133SActive Publication Date: 2026-07-31SHENZHEN LIANDE SEMICON TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN LIANDE SEMICON TECH CO LTD
- Filing Date
- 2026-01-22
- Publication Date
- 2026-07-31
Smart Images
Figure 000006_ABST
Abstract
1. Name of the product in this design: Die Bonder. 2. Application of this design: for use in the packaging process. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1. 5. The bottom view is a view that is not commonly used, so the bottom view is omitted.
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