Chip shuttle
CN310126200SActive Publication Date: 2026-07-31HANGZHOU CHANGCHUAN TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- HANGZHOU CHANGCHUAN TECH CO LTD
- Filing Date
- 2025-08-12
- Publication Date
- 2026-07-31
Smart Images
Figure 000006_ABST
Abstract
1. Name of the product in this design: Chip Shuttle. 2. Purpose of this design: to carry, transport, and position chips, and to control the temperature of the chips. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1. 5. The design details of the base surface have been shown in the various perspective drawings, so the bottom view is omitted.
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