Vacuum heat transfer mold
CN310146015SActive Publication Date: 2026-08-14HUNAN SIJIU TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2026-08-14
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Vacuum heat transfer mold. 2. Purpose of this design: A mold for vacuum heat transfer printing of protective cases for electronic products and other items. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design.
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