Bluetooth headset component (D09)
CN310147994SActive Publication Date: 2026-08-14DONGGUAN DUCAI ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-02
- Publication Date
- 2026-08-14
Smart Images
Figure 000023_ABST
Abstract
1. Name of the product in this design: Bluetooth headset assembly (D09). 2. Intended use of this design: for wireless communication, audio playback, headphone storage and charging, etc. 3. The key design feature of this product is its shape. 4. Images or photos that best illustrate the design key points: composite state diagrams.
Need to check novelty before this filing date? Find Prior Art