Circuit board heat sink device
CN310155439SActive Publication Date: 2026-08-18GUANGDONG NASITER INT LIGHTNING CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202630040061.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-26
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2041-01-26
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: circuit board heat dissipation device. 2. The use of the design product: laid on the circuit board, providing heat dissipation for the circuit board and the electronic components above it. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
Need to check novelty before this filing date? Find Prior Art