Components of a semiconductor inspection apparatus
CN310161301SActive Publication Date: 2026-08-21HAMAMATSU PHOTONICS KK +1
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Patent Information
- Application Number
- CN202630053456.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-30
- Publication Date
- 2026-08-21
- Estimated Expiration
- 2041-01-30
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Figure 000007_ABST
Abstract
1. Name of the design product: component of semiconductor inspection device. 2. Use of the design product: the product is used to fix the semiconductor wafer flat and firmly by vacuum adsorption in the semiconductor inspection device, and at the same time, infrared imaging can be carried out through the central infrared transmission window to realize defect inspection, etc. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: design 1 perspective view. 5. Design 1 is designated as the basic design.
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