Locking mechanisms of interconnect module assemblies (including interconnect modules, ring sockets, and components thereof)
CN310162377SActive Publication Date: 2026-08-21SAMTEC INC
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Patent Information
- Application Number
- CN202630051619.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-29
- Filing Date
- 2023-08-09
- Publication Date
- 2026-08-21
- Estimated Expiration
- 2038-08-09
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Figure 000001_ABST
Abstract
1. Name of the product in this design: Locking mechanism for interconnect module assembly (including interconnect module, ring socket and its components). 2. Intended use of this design: The overall intended use is for interconnect module assemblies, including interconnect modules configured to mate with ring sockets, and ring sockets configured to mate with interconnect modules. Specifically, it is used for components having interconnect modules in the form of optical transceivers, module housings of interconnect modules, components of interconnect modules in the form of electrical transceivers, components of ring sockets, lockers of ring sockets, and cable locking mechanisms for interconnect modules in the form of optical transceivers. The local design is a locking mechanism for interconnecting module components. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D rendering 1. 5. Other situations requiring explanation: The shadow rendering section is a local design theme that requires protection. Dashed lines are not part of the design for which protection is sought. A dashed line indicates that the design boundary does not constitute part of the design for which protection is sought.
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