Multi-layer welding ring
CN310177409SActive Publication Date: 2026-08-28HANGZHOU HUAGUANG ADVANCED WELDING MATERIALS CO LTD
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Patent Information
- Application Number
- CN202530692620.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-24
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2040-11-24
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: multi-layer solder ring. 2. The use of the design product: a solder ring filled between workpieces during brazing. 3. The design points of the design product: the shape formed by the nesting of multiple solder rings, and the color of the solder ring surface. 4. The picture or photo that best shows the design points: Design 1 perspective view. 5. Designate Design 1 as the basic design. 6. Other circumstances that need to be explained: The design of the design 1 and the design 2 includes color.
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