Adhesive unit abutment portion of semiconductor device manufacturing adhesive tape

Abstract

1. Name of the designed product: Adjoining portion of adhesive unit of adhesive tape for semiconductor device manufacturing. 2. Use of the designed product: used as an adhesive tape in the process of cutting a semiconductor wafer or die bonding of a semiconductor chip obtained by cutting; use of the partial design: used as an adjoining portion of an adhesive unit in an adhesive tape, the adhesive unit fixing a semiconductor wafer during cutting and bonding a chip to a substrate. 3. Design points of the designed product: the shape shown in the partial design. 4. Picture or photograph best indicating the design points: perspective view. 5. Other matters: dotted line indicates the boundary between the claimed part and the unclaimed part. The base material portion, the adhesive layer portion, and the PET separation portion are transparent, and the structure visible through the transparent portions is indicated by thin lines in each view. Referring to FIG. 1, the base material portion, the adhesive layer portion, and the PET separation portion of the product are shown as opaque bodies; and referring to FIGS. 2 and 3, numerals 1 to 4 respectively indicate the base material portion, the adhesive layer portion, the adhesive layer portion, and the PET separation portion.

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