Metal basin cover for wafer spin coating process
CN310183135SActive Publication Date: 2026-09-01YUHONGYAN TECH (SUZHOU) CO LTD
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Patent Information
- Application Number
- CN202630114145.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-16
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2041-03-16
Smart Images
Figure 000001_ABST
Abstract
1. Name of the product in this design: Metal basin cover for wafer spin coating process. 2. Purpose of this design: During the spin coating process of the coating equipment, excess adhesive on the wafer surface will be flung off and collected and discharged by the basin cover. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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