Semiconductor heat sink (G21)
CN310183824SActive Publication Date: 2026-09-01DONGGUAN MIME TECH CO LTD
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Patent Information
- Application Number
- CN202530773226.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-29
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2040-12-29
Smart Images
Figure 000007_ABST
Abstract
1. Name of the design product: semiconductor heat sink (G21). 2. Use of the design product: the design product is used for heating or cooling mobile phones or electronic products. 3. Design points of the design product: in shape. 4. Picture or photo that best indicates the design points: design 1 perspective view 1. 5. Design 1 is designated as the basic design.
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