Epoxy composite film (leaf vein biomimetic high thermal conductivity recyclable)
CN310185347SActive Publication Date: 2026-09-04JIAN COLLEGE
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Patent Information
- Application Number
- CN202630201362.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-27
- Publication Date
- 2026-09-04
- Estimated Expiration
- 2041-04-27
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Figure 000007_ABST
Abstract
1. The name of the design product: epoxy composite film (vein biomimetic high thermal conductivity recyclable). 2. The use of the design product: for improving thermal conductivity, for heat management of high-power devices such as chips, power modules, etc. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1. 5. Other circumstances that need to be explained: the design product is a planar product without limited boundaries, continuous along the four sides.
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