Drive module (SMD package)

Abstract

1. The name of the design product: driving module (SMD package). 2. The use of the design product: applied to the surface-mounted enhanced heat dissipation power conversion device. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view. 5. Other circumstances that need to be explained: the metal plating is a multi-layer heterogeneous metal plating system: from inside to outside, it is gold layer, nickel layer, electroplated copper layer, sputtered copper layer, and sputtered titanium layer. The metal plating includes two heat dissipation copper surfaces of the top and bottom surfaces, two ground pins connecting the top and bottom heat dissipation copper surfaces, and the mounting pins on the side edges.

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