Front center panel of semiconductor chip bonder

Abstract

1. Name of the product in this design: Front central panel of a semiconductor chip bonding machine. 2. Application of the product in question: The claimed partial design is part of a semiconductor chip bonding machine used to remove semiconductor components from wafers and transfer them to lead frames and substrates for assembly. The claimed partial design is used on the front central panel of the semiconductor chip bonding machine. 3. The key design features of this product are the shape of the solid lines. 4. The image or photograph that best illustrates the design's key points: 3D rendering 1. 5. Other situations requiring explanation: Solid lines indicate the parts that require protection, while dashed lines indicate the parts that do not require protection.

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