packaged version
CN310205929SActive Publication Date: 2026-09-15NIFERON SEMICONDUCTOR (SHANGHAI) CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202630229452.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-05-11
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2041-05-11
Smart Images
Figure 000007_ABST
Abstract
1. Name of the design product: package edition. 2. Use of the design product: mainly used for substrate forming in the process of semiconductor chip packaging. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: perspective view 1.
Need to check novelty before this filing date? Find Prior Art