Mold core
CN310219114SActive Publication Date: 2026-09-22WUXI INSILI PRECISION TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202630205006.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-28
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2041-04-28
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Figure 000001_ABST
Abstract
1. Name of the product in this design: Mold Core. 2. Application of this design: It is used as the die core for stamping dies of electronic paper carrier tapes. The die core is made of hard alloy tungsten steel and belongs to die consumables. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the key design points: Design 1 3D view. 5. Design 1 is designated as the basic design.
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