Dual-core semiconductor heat sink (dual-button model - TH27-2)
CN310223739SActive Publication Date: 2026-09-22GUANGZHOU JIUHAN INTERNET TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202630135556.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-26
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2041-03-26
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Dual-core semiconductor heat sink (dual-button model - TH27-2). 2. Purpose of this design: A heat dissipation product used to cool down mobile phones. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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