The main body of the semiconductor module
CN310236133SActive Publication Date: 2026-09-29FUJI ELECTRIC CO LTD
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Patent Information
- Application Number
- CN202630101926.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2026-01-20
- Filing Date
- 2026-03-09
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2041-03-09
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Body of a semiconductor module. 2. Purpose of this design: The overall purpose of this product is a semiconductor module, and its partial purpose is the main body of a semiconductor module. 3. The key design features of this product are the shape of the part for which protection is sought. 4. The image or photograph that best illustrates the design's key points: 3D view 1. 5. Other situations requiring explanation: This design requests partial design protection. The parts indicated by solid lines are the parts for which protection is requested, and the parts indicated by dashed lines are the parts for which protection is not requested.
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