Adhesive unit for adhesive tape used in semiconductor device manufacturing

Abstract

1. Name of the product in this design: Adhesive unit for adhesive tape used in semiconductor device manufacturing. 2. Purpose of this design: to be used as an adhesive tape in processes such as dicing semiconductor wafers or bonding semiconductor chips obtained from dicing; Purpose of partial design: to be used as an adhesive unit in the adhesive tape to fix the semiconductor wafer and bond the chip to the substrate during the dicing process. 3. The key design features of this product are the shapes shown in the partial design. 4. The image or photograph that best illustrates the design's key points: a 3D model. 5. Other situations requiring explanation: The adhesive unit for which this product seeks protection includes two sets of substrate portions, adhesive layer portions, and adhesive layer portions arranged at a distance from each other. The substrate, adhesive layer, and PET separation section are transparent, and the structures visible through the transparent parts in each view are indicated by thin lines. Referring to Figure 1, the substrate, adhesive layer, and PET separation part of this product are shown as opaque bodies; referring to Figure 2, numbers 1 to 4 represent the substrate, adhesive layer, adhesive layer, and PET separation part, respectively; referring to Figure 3, numbers 1 to 4 represent the substrate, adhesive layer, adhesive layer, and PET separation part, respectively.

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