Wafer defect detection apparatus

Abstract

1. The name of the design product: wafer defect detection equipment. 2. The use of the design product: for detecting open circuit, short circuit, gap, protrusion, pinhole, copper slag, recess, line width and line spacing size violation, feature point omission and violation, etching window defect of 8-inch, 12-inch wafer's rewiring layer, fan-out / fan-in, wafer-level packaging, panel-level packaging, and providing an automatic detection solution for various fan-out and fan-in products of pattern wafer, wafer-level packaging (WLP) and panel-level packaging (PLP) in the semiconductor packaging industry. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.

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