Circuit board welding clamping mechanism
CN310257297SActive Publication Date: 2026-10-16KUNSHAN YINLINKTECH ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202630107107.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-11
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2041-03-11
Smart Images
Figure 000006_ABST
Abstract
1. The name of the design product: circuit board welding clamping mechanism. 2. The use of the design product: through the cylinder to drive the press plate rotation to complete the positioning and clamping of the circuit board, and assist in completing the welding processing of the circuit board. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
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