Ion gun (for semiconductor manufacturing equipment)
CN310265593SActive Publication Date: 2026-10-20AP SYST INC
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Patent Information
- Application Number
- CN202630238072.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2025-12-08
- Filing Date
- 2026-05-14
- Publication Date
- 2026-10-20
- Estimated Expiration
- 2041-05-14
Smart Images
Figure 000001_ABST
Abstract
1. Name of the designed product: Ion gun (for semiconductor manufacturing equipment). 2. Use of the designed product: To selectively remove a deposited film by irradiating an ion beam onto a local area of the film formed on a semiconductor wafer. 3. Design points of the designed product: In shape. 4. Picture or photograph best indicating the design points: Perspective view.
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