Laser direct write exposure tool (LDW series)
CN310273204SActive Publication Date: 2026-10-23HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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Patent Information
- Application Number
- CN202630119570.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-18
- Publication Date
- 2026-10-23
- Estimated Expiration
- 2041-03-18
Smart Images
Figure 000001_ABST
Abstract
1. The name of the design product: laser direct writing exposure equipment (LDW series). 2. The use of the design product: exposure equipment for directly etching a template or a photographic film using a laser beam. 3. The design points of the design product: the combination of shape and pattern. 4. The picture or photo that best shows the design points: front view. 5. The part of the design product that is not easy to see or cannot be seen when in use is omitted, and the top view and bottom view are omitted.
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