conductive ring

Abstract

1. Name of the product in this design: Conductive ring. 2. Purpose of this design: In the semiconductor wafer electroplating process, the design involves pressing down on the wafer and making direct contact with it, while connecting to an external power source. The cathode of this design uses the wafer as the cathode to reduce metal cations into metal atoms, which are then deposited on the wafer surface to complete the electroplating process. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design.

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