Memory module heatsink

Abstract

1. Name of this design product: Heat dissipation casing for memory modules. 2. Application of this design: The overall product is used for storing and reading / writing data in computers, electronic devices, etc., and a portion of the product is used as a heat dissipation casing for memory modules. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model. 5. Other matters requiring explanation: The key design features of this product are the shape of the solid line portion in the drawing; this design is a partial design, and the dotted line portion shown in the drawing is the part not claimed by this product design.

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