Gas ejection plate for plasma processing equipment
CN310282454SActive Publication Date: 2026-10-27HITACHI HIGH TECH CORP
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Patent Information
- Application Number
- CN202530541967.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2025-06-27
- Filing Date
- 2025-09-11
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2040-09-11
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Gas ejection plate for plasma treatment device. 2. Application of this design: This product is a gas ejection plate mainly used in plasma processing equipment for semiconductor manufacturing. Each design features internal engravings made through precision machining, which adds fine details. The internal engraving section is an engraving set inside the product by means of laser processing, for example. It can also be used as a manufacturing number for management purposes, and the rectangular engraving on the far left can also be used as a QR code, etc. 3. The key design features of this product are the shapes shown in the enlarged views. 4. The image or photograph that best illustrates the key design points: Design 1 3D view. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: In each design, the light-transmitting part of the internal engraving is shown in light gray in the reference figure. Except for the internal engraving, the entire product is transparent (as shown by the diagonal lines in the reference diagram).
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