Bluetooth headset component (MD100)
CN310302044SActive Publication Date: 2026-11-06DONGGUAN MODU ACOUSTICS TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202630256626.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2026-05-22
- Publication Date
- 2026-11-06
- Estimated Expiration
- 2041-05-22
Smart Images
Figure 000017_ABST
Abstract
1. Name of the product in this design: Bluetooth headset assembly (MD100). 2. Purpose of this design: To store Bluetooth earphones, charge them, and play audio. 3. The key design feature of this product is its shape. 4. Images or photos that best illustrate the design key points: usage status reference diagrams. 5. Because component 3 is designed symmetrically with component 1, the front, rear, left, right, top, and bottom views of component 3 are omitted.
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