Sensor module and method for manufacturing a sensor module
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- ZF FRIEDRICHSHAFEN AG
- Filing Date
- 2011-01-17
- Publication Date
- 2026-07-09
AI Technical Summary
Existing sensor modules require multiple connection and supply lines for each sensor, leading to increased material and cost expenditure, space requirements, and susceptibility to errors.
A sensor module design that integrates at least two sensors in a single housing, using a common supply line and partially integrating connecting lines within the housing, reducing the need for individual supply lines and enhancing structural stability.
Reduces material and cost expenditure, minimizes space requirements, and lowers susceptibility to errors by using a common supply line and partially integrating lines within the housing.
Smart Images
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Abstract
Description
[0001] The present invention relates to a sensor module and a method for producing a sensor module, for example for detecting a speed of a transmission.
[0002] Speed sensors are used to detect a speed of a machine element. Traditionally, a single speed sensor is housed and potted in a plastic housing. If two or more individual speed sensors are used, then a total of two or more connection lines and two or more supply lines are accommodated in the system.
[0003] DE 10 2007 006 445 A1 discloses a speed sensor from a casting process and DE 10 2008 003 340 A1 discloses a sensor device with a first sensor surrounded by a first sensor housing and with a second sensor surrounded by a second sensor housing .
[0004] It is the object of the present invention to create an improved sensor module and an improved method for producing a sensor module.
[0005] Against this background, the present invention provides an improved sensor module and an improved method for manufacturing a sensor module according to the independent claims. Advantageous configurations result from the dependent claims and the following description.
[0006] According to the invention, at least two sensors, for example inductive sensors, are arranged and connected in a single housing of a sensor module. In this case, the at least two sensors can be supplied with electric current by means of a single, common supply line instead of each having their own supply line. In this case, the supply line and other connecting lines can be at least partially integrated in the housing of the sensor module.
[0007] Advantageously, at least one line can be saved by the common supply line. By saving an electrical line, the material and cost expenditure for the sensor module can be reduced. Furthermore, the space required for cabling is reduced due to the one common supply line. The at least partially integrated design of lines in the housing of the sensor module offers a lower susceptibility to errors.
[0008] The present invention creates a sensor module with the following features: a housing which has a connection area for electrically contacting the sensor module, a first receiving area for receiving a first sensor carrier and a second receiving area for receiving a second sensor carrier; a first lead having a first electrical contact in the first receiving area and a second electrical contact in the terminal area; a second lead having a first electrical contact in the second receiving area and a second electrical contact in the terminal area; and a common line having a first electrical contact in the first receiving area, a second electrical contact in the second receiving area, and a third electrical contact in the terminal area.
[0009] A sensor module can be understood to mean an assembly that can be equipped with sensors suitable for a respective area of application or already includes them. Hall sensors, for example, can be used as sensors. The sensors of the sensor module can be used to detect a rotational speed of a rotating object or a distance covered by an object that moves linearly, for example. The housing can be a plastic housing. The housing may be made by a molding technique such as an injection molding process. The housing can have a main plate with a main extension plane. The connection area can be a part of the main plate of the housing and is used for the external electrical connection of the sensor module. The connection area thus represents an external interface of the sensor module. Each contact in the connection area of the housing can be contacted by a respective strand of external cabling. The connection area can be covered on the outside by means of a protective cover, such as a chip protection. The protective cover of the connection area can be designed to be removable and clipped on, for example. The receiving areas can be partial areas of the housing that are spaced apart from one another. The receiving areas can represent indentations or recesses of the housing. Each receiving area forms a receiving space for a sensor that is at least partially surrounded by walls of the housing. The sensor can be arranged on a sensor carrier. Each receiving area includes a receiving opening through which a sensor or a sensor carrier can be inserted into the receiving area. The receiving opening can in each case be arranged in or near the main extension plane of the main plate of the sensor module. An end of the receiving area opposite the receiving opening is arranged away from the main extension plane of the main plate of the housing. The receiving areas thus extend out of the main extension plane of the main plate of the housing. When the sensor module is in the installed state, the first receiving area can be arranged adjacent to a drive section, for example, and the second receiving area can be arranged adjacent to an output section of the vehicle transmission. The sensor module includes an electrically conductive structure with the first line, the second line and the common line. The first, the second and the common line can represent connecting lines which are electrically insulated from one another. The first and the second line can each represent return lines from the receiving areas to the connecting area of the housing. The leads are made of an electrically conductive material such as copper or brass. The electrical contacts of the lines can be exposed or non-insulated areas of the lines. The electrical contacts in the receiving areas can be arranged in the vicinity of the receiving openings of the receiving area. The contacts in the receiving areas form interfaces to the sensors arranged in the receiving areas. The contacts in the connection area form interfaces to external electrical lines.
[0010] According to one embodiment, the first receiving area can have a first elongated cavity for receiving the first sensor carrier and the second receiving area can have a second elongated cavity for receiving the second sensor carrier. An elongate cavity can be understood to mean a shape of the housing, for example in the form of a hollow cylinder. A longitudinal axis of the elongated cavity runs obliquely or orthogonally with respect to the main plane of extension of the main plate of the housing. Longitudinal axes of the cavities can run parallel to one another. As a result, sensor carriers can be arranged safely and protected in the receiving areas.
[0011] A depth of the first cavity can differ from a depth of the second cavity. The depth can be understood as an extension along the longitudinal axis of a cavity. The depth may denote a maximum depth of a cavity, and thus also a maximum distance of an end portion of the cavities from the main panel of the housing. The different depths offer the advantage that the sensors can be arranged as close as possible to the structures to be monitored.
[0012] The housing can have an intermediate area with a fastening device for fastening the sensor module to an external structure. The intermediate area can be arranged between the first and the second receiving area. The intermediate area may be part of the main panel of the housing. The fastening device can be, for example, an opening in the form of a socket, eyelet or the like with or without an internal thread. The fastening device can interact with fastening means such as a screw, a bolt or a rivet in order to enable the sensor module to be fastened to the external structure. The external structure can be e.g. B. be a part of a vehicle transmission. However, other suitable fastening devices and types are also possible. In this case, the lines of the sensor module are routed around the fastening device. Such an embodiment of the present invention offers the advantage that a secure and stable attachment of the sensor module to the external structure is made possible and the internal lines cannot be damaged by the attachment.
[0013] At least one of the lines can be encased, at least partially around the circumference, by a material of the housing over its entire length lying between the contacts. The portions of the contacts of the at least one lead may be partially exposed. For example, the at least one line can be cast into the material of the housing or encapsulated or molded by the same. In this case, the at least one line can be completely or only partially surrounded by the material of the housing, both in terms of its length and in terms of its circumference. In particular, it is advantageous if all lines are sheathed in the above manner. Such an embodiment of the present invention offers the advantage that such a sheathed line is guided through the housing material and is also insulated at the same time. In addition, operational safety increases by minimizing freely routed cables or lines. The lead arrangement buried in the material of the package also provides improved package stability.
[0014] In this case, at least one of the lines can be a planar conductor track. Such an embodiment of the present invention offers the advantage that such a line shape enables space to be saved in the sensor module due to a flatter line profile.
[0015] According to one embodiment, the lines can be formed by a stamped grid that is at least partially encased by a material of the housing. A stamped grid can be understood to mean a grid-like structure produced by stamping from a plate. In this case, the stamped grid is made of an electrically conductive material, for example a metal. The contact sections of the lines represent areas of the stamped grid that are not or only partially encased by the material of the housing. Such an embodiment of the present invention offers the advantage that there is a structure for the lines that is easy to produce and at the same time gives the housing stability.
[0016] The sensor module can have a first sensor carrier, which includes a first magnetic field sensor, and a second sensor carrier, which includes a second magnetic field sensor. In this case, the first sensor carrier can be arranged in the first receiving area and electrically connected to the first contacts of the first line and the common line. The second sensor carrier can be arranged in the second receiving area and electrically connected to the first contact of the second line and to the second contact of the common line. In addition to the magnetic field sensors, the sensor carriers can also have magnets whose magnetic field changes can be detected by the sensors. The sensor carriers can be connected to the contacts by means of connection techniques such as welding, soldering, crimping or the like. Due to the presence of the sensors, the sensor module can be used, for example, as a speed sensor or displacement sensor. For this purpose, the sensors can be connected to a suitable evaluation device, which is arranged in the sensor module or outside of the sensor module. As an alternative to the magnetic field sensors, other sensors can be arranged on the sensor carriers.
[0017] The housing can have at least one additional accommodation area for accommodating at least one additional sensor carrier. The common line can have at least one additional electrical contact in the at least one additional receiving area, and at least one additional line can be provided which has an additional electrical contact in the at least one additional receiving area and a second electrical contact in the connection area. Such an embodiment of the present invention offers the advantage that the sensor module is also suitable for other detection scenarios that require three or more magnetic field sensors. In this case, the common line can also supply sensors arranged in the further receiving area or areas.
[0018] The present invention also provides a method for producing a sensor module, with the following steps: providing a first lead having first and second electrical contacts, a second lead having first and second electrical contacts, and a common lead having first, second and third electrical contacts; and Sheathing the lines at least partially around the circumference with a housing material in order to form a housing which has a connection area for making electrical contact with the sensor module, a first receiving area for receiving a first sensor carrier and a second receiving area for receiving a second sensor carrier, with the first contacts of the first line and the common line is arranged in the first receiving area, the second contacts of the second line and the common line are arranged in the second receiving area, and the third contact of the common line is arranged in the terminal area.
[0019] A sensor module according to the invention can advantageously be produced by means of the above method. In this case, the lines can be provided as stamped grids and be encapsulated or encapsulated by the housing material.
[0020] The invention is explained in more detail by way of example with reference to the accompanying drawings. Show it:
[0021] figure 1 shows a perspective view of a sensor module according to an exemplary embodiment of the present invention;
[0022] figure Figure 2 shows a schematic view of part of the sensor module figure 1;
[0023] figure 3 shows a schematic sectional view of part of the sensor module figure 1 or figure 2; and
[0024] figure 4 shows a flowchart of a method according to an embodiment of the present invention.
[0025] In the following description of preferred exemplary embodiments of the present invention, the same or similar reference symbols are used for the elements which are shown in the various figures and have a similar effect, with a repeated description of these elements being dispensed with.
[0026] figure 1 shows a perspective view of a sensor module 100according to an embodiment of the present invention. A housing is shown 110 , a connection area 112 , a first recording area 114 , a second recording area 116 and an intermediate area 118 of the housing 110 . The housing has a first line 120 with a contact 122 , a second line 130 with a contact 132 and a common line 140 with a contacts 142 , 144 . Further contacts of the lines 120 , 130 , 140 are in the connection area 112 arranged, but in figure 1 not shown. In the first recording area 114 is a first sensor carrier 150 and in the second receiving area 116 is a second sensor carrier 160 arranged. The recording area 114 has a fastening device 170 and the connection area 112 a protective cover 180 on.
[0027] The case 110 of the sensor module 100 is divided into different main sections, which are presented in the presentation of figure 1 the connection area from top to bottom 112 , the first recording area 114 , the intermediate area 118 and the second recording area 116 include. The case 110 can consist of a suitable housing material, such as a plastic, with which the lines are connected 120 , 130 , 140 forming conductor structure is surrounded. It can therefore be a plastic housing 110 act. The conductor structure can be a pressed screen. In the figure 1 shown side of the sensor module 100 has a substantially elongated plan. This can be a rear side of the sensor module 100 act, which may face an external structure on which the sensor module 100 can be attached.
[0028] The connection area 112 points at one in figure 1 not shown front, which is facing away from the back shown, three electrical contacts, via which an external contacting of the sensor module 100 he follows. The number of electrical contacts results from the number of magnetic field sensors plus one. Around the contacts of the connection area 112 The removable protective cover protects against contamination 180 detachable on the housing 110 attached, for example attached or clipped. In figure 1 is part of the protective cover 180 recognizable. So are an edge area of the protective cover 180 and a locking element of the protective cover 180 in the right section of the Connections pane 112 shown. In the left section of the Connections panel 112 is an indentation of the connection area 112 shown by the installed condition of the sensor module 100 electrical lines to the electrical contacts of the connection area 112 can be led.
[0029] The first recording area 114 is between the connection area 112 and the intermediate area 118 arranged. In the first recording area 114 is the first sensor carrier 150 recorded. The first recording area 114 includes a cavity in which the first sensor carrier 150 is plugged in. In the view of figure 1 are from the first recording area 114 only a circular receiving opening of the cavity and two electrical contacts are shown. The electrical contacts of the first receiving area 114 are at an intermediate level 118 facing side of the first receiving area 114 arranged and form an interface to contacts of the first sensor carrier 150 . From the first sensor carrier 150 is in figure 1 shows only one contact end with electrical contacts, which are connected to the electrical contacts of the first receiving area 114 are connected.
[0030] The intermediate area 118 is between the first recording area 114 and in the second recording area 118 arranged. At the intermediate area118 It is a transition area between the two recording areas 114 , 118 . In the intermediate area 118 is the fastener 170 arranged. At the in figure 1 shown embodiment of the present invention is the fastener 170 as a circular through hole through the housing 110 trained throughout. Fastening means for fastening the sensor module can pass through this passage opening 100 be guided to an external structure. In particular, a screw or the like can be used for this purpose. Thus, the fastening device 170 be designed as a socket for a screw connection. A longitudinal axis of the fastener 170 can be parallel to a longitudinal axis of the cavities of the receiving areas 114 , 116 be aligned.
[0031] In the second recording area 116 is the second sensor carrier 160 arranged. The execution of the second recording area 116 essentially corresponds to the design of the first recording area 114 . Analogous to the first recording area 116 are the electrical contacts of the second receiving area 116 at an intermediate area 118 facing side of the second receiving area 114 arranged.
[0032] In figure 1 are exposed sections 120 , 130 , 140 one partially into the case 110 integrated conductor structure of the sensor module 100 to recognize. The conductor structure includes the first line 120 with the contact 122 who is in the first recording area 114 is arranged, and with a contact, not shown, in the connection area 112 . Thus, the first line extends 120 between the connection area 112 and the first recording area 114 . The conductor structure also includes the second line 130 with the contact 132 who is in the second recording area 116 is arranged, and a contact, not shown, in the connection area 112 . Thus, the second line extends 130 between the connection area 112 and the second recording area 116 . The conductor structure also includes the common line 140 with the contact 142 in the first recording area 114 , the contact 144 in the second recording area 116 and a contact, not shown, in the connection area 112 . The common line 140 thus extends from the connection area 112 to the first recording area 114 and to the second recording area 116 . In this case, the common line 140 have a branching point at one point of their course, from which a line branch leads to one of the receiving areas 114 , 116 leads.
[0033] In figure 1 are only the electrical contacts of the lines 120 , 130 , 140 in the recording areas 114 , 116 as well as line sections adjacent to the contacts can be seen. A larger proportion of the lines 120 , 130 , 140 is in the case 110 integrated. The lines 120 , 130 , 140 can in this case be part of a stamped grid that is encapsulated with the housing material or cast into the housing material and is only exposed at the contacts and the adjacent line sections. The lines 120 , 130 , 140 can be implemented as flat conductor tracks.
[0034] The first sensor carrier 150 has two contacts, of which the in figure 1 shown on the left with the electric. Contact 142 the common line 140 is electrically conductively connected. the inside figure 1 contact shown on the right of the first sensor carrier 150 is with the electrical contact 122 the first line 120 tied together. The contacts of the sensor carrier 150are formed as elongate strips of conductive material whose lengths extend from the sensor carrier 150 towards the intermediate area 118 , and thus in the direction of the electrical contacts 122 , 142 in the first recording area 114 , are turned. When the first sensor carrier 150 properly in the first recording area 114 is included, are the contacts of the first sensor carrier 150 regarding the contacts 122 , 142 in the first recording area 114 arranged in such a way that an electrical connection between the corresponding contacts can be readily made, for example by means of welding, soldering or crimping.
[0035] The second sensor carrier 160 has two contacts, of which the in figure 1 shown on the left with the electrical contact 144 the common line 140 connected is. the inside figure 1 contact shown on the right of the second sensor carrier 160 is with the electrical contact 132 the second line 130 tied together. Apart from that, the other explanations regarding the first sensor carrier apply 150 also for the second sensor carrier 160 .
[0036] figure 2 shows a schematic, simplified view of part of the sensor module 100 out figure 1, according to an embodiment of the present invention. The representation in figure 2 shows the same side of the sensor module 100 who also in figure 1 is shown. The connection area of the sensor module 100 is in figure 2 not shown. The remaining features of the sensor module 100 out figure 1 are also in figure 2, albeit greatly simplified and schematic.
[0037] In figure 2 is the route of the lines 120 , 130 , 140 in the recording areas 114 , 116 and the intermediate area 118 shown. Here are in figure 2 in the case 110 integrated sections of the lines 120 , 130 , 140 shown as dashed lines. Thus, the entire course of the lines 120 , 130 , 140 in the fields of 114 , 116 , 118 recognizable. This is an exemplary curve that is outlined for the present exemplary embodiment, with deviations from the illustrated curve being conceivable in other exemplary embodiments.
[0038] A basic feature of the line route is that in the intermediate area 118 the lines around the fastening device 170 are led around. Another fundamental feature of the line run is a bifurcation of the common line 140 , leaving the first recording area 114 and the second recording area 116 with the common line 140 are connected.
[0039] figure 3 shows a schematic, simplified sectional view of part of the sensor module 100 out figure 1 or figure 2, according to an embodiment of the present invention. This is a longitudinal section in the direction of the course of the common line 140 between the first recording area 114 and the second recording area 116 . Here are in the in figure 3 shown sectional view of the sensor module 100 the housing 110 , the first recording area 114 , the second recording area 116 , the intermediate area 118 , the common line 140 between their contacts 142 , 144 , the first sensor carrier 150 and the second sensor carrier 160 shown. In addition, a first magnetic field sensor 355 of the first sensor carrier 150 and a second magnetic field sensor 365 of the second sensor carrier 160 shown.
[0040] In the lower section of the figure 3 shows an example of a simplified and schematically illustrated vehicle transmission. Adjacent to an end portion of the first receiving area 114a first section, for example an output section, of a transmission is arranged. Adjacent to an end portion of the second receiving area 116 a second section, for example a drive section, of the transmission is arranged.
[0041] The first recording area 114 has a first elongated cavity in which the first sensor carrier 150 is arranged. A main direction of extent of the first cavity is in figure 3 vertical. The first elongate cavity is at an intermediate region 118 adjacent end open. Of the. first sensor carrier 150 is an elongated member with an in figure 3 main extension direction shown vertically. The intermediate area 118 of the housing 110 of the sensor module 100 has a main extension plane, which in figure 3 runs horizontally. The first receiving area thus extends 114 and the first sensor carrier 150 from the main extension plane of the intermediate area 118 out in the direction of the gearbox shown as an example.
[0042] The first sensor carrier 150 has at a first end that in figure 3 shown above, an electrical contact which is connected to the contact 142 the common line 140 connected is. The first magnetic field sensor 355 is in the region of a second end of the first sensor carrier 150 arranged that the first end of the first sensor carrier 150 is opposite. Thus, the first magnetic field sensor 355 in a section of the first receiving area facing the transmission shown as an example 114 and the first sensor carrier 150 arranged.
[0043] The second recording area 116 has a second elongated cavity in which the second sensor carrier 160 is arranged. A main extension direction of the second cavity is in figure 3 vertical. The second elongate cavity is at an intermediate region 118 adjacent end open. The second sensor carrier 160 is an elongated member with an in figure 3 main extension direction shown vertically. The second receiving area thus extends 116 and the second sensor carrier 160 from the main extension plane of the intermediate area 118 out in the direction of the gearbox shown as an example. In this case, the second receiving area extends 116 and the second sensor carrier 160 compared to the first recording area 114 and the first sensor carrier 150 by a further distance from the main extension plane of the intermediate area 118 away. Thus, there is a distance between the first sensor 355 and the intermediate area 118 less than a distance between the second sensor 336 and the intermediate area 118 .
[0044] The second sensor carrier 160 has at a first end that in figure 3 shown above, an electrical contact which is connected to the contact 144 the common line 140 connected is. The second magnetic field sensor 365 is in the region of a second end of the second sensor carrier 160 arranged that the first end of the second sensor carrier 160 is opposite. Thus, the second magnetic field sensor 365 in a section of the second receiving area facing the transmission shown as an example 116 and the second sensor carrier 160 arranged.
[0045] Based on figure 1 to figure 3, a speed sensor according to an exemplary embodiment of the present invention is described below. The speed sensor consists of at least two separate speed sensor units 150 , 160 in a housing 110 . The speed sensor units 140 , 150 can by means of a jack 170 be attached to a plate.
[0046] The speed sensor consists of a stamped grid 120 , 130 , 140 , the one with the case 110 , For example made of plastic, is overmoulded. Furthermore, the speed sensor has at least two sensor carriers150 , 160 on which are located in the housing. One sensor carrier each 150 , 160 consists of the components stamped grid, magnet and sensor 355 , 365 . The stamped grid is overmoulded with plastic. The magnet is in the sensor carrier 150 , 160 plugged. the sensor 355 , 365 is on a stamped grid of the sensor carrier 150 , 160 attached, with the lead frame of the sensor carrier 150 , 160 with the lead frame 120 , 130 , 140 of the housing 110 get connected.
[0047] In the case 110 there are at least two sensor carriers 150 , 160 , where the supply cable 140 to the first sensor carrier unit 150 is guided and then on to the second sensor carrier unit 160 is continued, i.e. shared. Thus, both sensor carrier units 150 , 160 with only one common supply cable 140 tied together. The sensor carrier units 150 , 160 have different lengths.
[0048] The housing is secured with a screw 110 of the speed sensor mechanically connected to a module block.
[0049] figure 4 shows a flowchart of a method for producing a sensor module according to an embodiment of the present invention. The procedure includes one step 410 providing a first lead having first and second electrical contacts, a second lead having first and second electrical contacts, and a common lead having first, second and third electrical contacts. The method further includes a step 420 encasing the leads at least partially around their circumference with a casing material to form a casing. The step 420 The sheathing takes place in such a way that the housing has a connection area for making electrical contact with the sensor module, a first receiving area for receiving a first sensor carrier and a second receiving area for receiving a second sensor carrier. The first contacts of the first line and the common line are arranged in the first receiving area, the second contacts of the second line and the common line are arranged in the second receiving area and the third contact of the common line is arranged in the connection area.
[0050] The exemplary embodiments described and shown in the figures are only selected as examples. Different exemplary embodiments can be combined with one another completely or in relation to individual features. An exemplary embodiment can also be supplemented by features of a further exemplary embodiment. Reference List 100 sensor module 110 housing 112 connection area 114 first recording area 116 second recording area 118 intermediate area 120 first line 122 contact of the first line 130 second line 132 contact of the second line 140 common line 142 Common line contact 144 common line contact 150 first sensor carrier 160 second sensor carrier 170 fastening device 180 protective cover 355 first magnetic field sensor 365 second magnetic field sensor 410 first method step 420 first process step QUOTES INCLUDED IN DESCRIPTION
[0051] This list of the documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Patent Literature Cited
[0052] DE 102007006445 A1
[0003] DE 102008003340 A1
[0003]
Claims
[1] Sensor module ( 100 ), with the following characteristics: a case ( 110 ), which has a connection area ( 112 ) for electrical contacting of the sensor module, a first recording area ( 114 ) to accommodate a first sensor carrier ( 150 ) and a second recording area ( 116 ) to accommodate a second sensor carrier ( 160 ) exhibits; a first line ( 120 ), which makes an initial electrical contact ( 122 ) in the first recording area ( 114 ) and a second electrical contact in the connection area ( 112 ) exhibits; a second line ( 130 ), which makes an initial electrical contact ( 132 ) in the second recording area ( 116 ) and a second electrical contact in the connection area ( 112 ) exhibits; and a joint management ( 140 ), which makes an initial electrical contact (142 ) in the first recording area ( 114 ), a second electrical contact ( 144 ) in the second recording area ( 116 ) and a third electrical contact in the connection area ( 112 ) exhibits. [2] Sensor module ( 100 ) according to claim 1, wherein the first receiving area ( 114 ) a first elongated cavity for receiving the first sensor carrier ( 150 ) and the second recording area ( 116 ) a second elongated cavity for receiving the second sensor carrier ( 160 ) exhibits. [3] Sensor module ( 100 ) according to claim 2, wherein the depth of the first cavity differs from the depth of the second cavity. [4] Sensor module ( 100 ) according to one of the preceding claims, wherein the housing ( 110 ) an intermediate area ( 118 ) with a fastening device ( 170) for attaching the sensor module to an external structure, wherein the intermediate area ( 118 ) between the first ( 114 ) and the second ( 116 ) recording area is arranged. [5] Sensor module ( 100 ) according to one of the preceding claims, wherein at least one of the lines ( 120 , 130 , 140 ) over their entire length between the contacts, at least partially covered by a material of the housing ( 110 ) is encased. [6] Sensor module ( 100 ) according to one of the preceding claims, wherein at least one of the lines ( 120 , 130 , 140 ) is a planar conductor track. [7] Sensor module ( 100 ) according to one of the preceding claims, wherein the lines ( 120 , 130 , 140 ) are formed by a stamped grid that is at least partially made of a material of the housing ( 110) is encased. [8] Sensor module ( 100 ) according to one of the preceding claims, with a first sensor carrier ( 150 ), which includes a first magnetic field sensor ( 355 ) includes, and with a second sensor carrier ( 160 ), which has a second magnetic field sensor ( 365 ) comprises, wherein the first sensor carrier ( 150 ) in the first recording area ( 114 ) is arranged and with the first contact ( 122 ) the first line ( 120 ) and the first contact ( 142 ) the joint management ( 140 ) is electrically connected and wherein the second sensor carrier ( 160 ) in the second recording area ( 116 ) is arranged and with the first contact ( 132 ) the second line ( 130 ) as well as the second contact ( 144 ) the joint management ( 140 ) is electrically connected. [9] Sensor module ( 100) according to one of the preceding claims, wherein the housing ( 110 ) has at least one further recording area for receiving at least one further sensor carrier and the common line ( 140 ) has at least one further electrical contact in the at least one further receiving area, and with at least one further conductor that has a further electrical contact in the at least one further receiving area and a second electrical contact in the connection area ( 112 ) exhibits. [10] Method for manufacturing a sensor module, comprising the following steps: Provide ( 410 ) a first line with a first and a second electrical contact, a second line with a first and a second electrical contact, and a common line with a first, a second, and a third electrical contact; and Coating ( 420) the conductors at least partially with a housing material to form a housing which has a connection area for electrical contacting the sensor module, a first receiving area for receiving a first sensor carrier and a second receiving area for receiving a second sensor carrier, wherein the first contacts of the first conductor and the common conductor are arranged in the first receiving area, the second contacts of the second conductor and the common conductor are arranged in the second receiving area and the third contact of the common conductor is arranged in the connection area.