Cooling arrangement, electrical appliance and use of a cooling arrangement

Abstract

An arrangement, in particular a cooling arrangement, for cooling heat-generating components, comprising: a printed circuit board (12) on which a first and a second heat-generating component are arranged; and a heat sink (1) with air guides which at least partially delimit one or more cooling channels, wherein the heat sink (1) is thermally connected to the first heat-generating component, wherein the second heat-generating component projects at least partially into a partial area of ​​the cooling channel or into a respective partial area of ​​the several or all cooling channels, wherein the air guides are arranged on the side of the heat sink (1) facing away from the printed circuit board (12), characterized in that the first heat-generating component is arranged between the printed circuit board (12) and the heat sink (1), wherein thermal paste is arranged between the heat sink (1) and the first heat-generating component.wherein the heat sink (1) has a first recess (40) for receiving the second heat-generating component, in particular for receiving an inductor (28), wherein the heat sink (1) is designed as a continuous cast profile, wherein the heat sink (1) has a plate-like back plate (25) extending in the continuous casting direction, in particular which is designed perpendicular to the base plate, wherein the back plate (25) is thermally connected to a cooling plate, in particular to a cooling plate arranged in a control cabinet, in particular wherein the cooling plate has cooling channels through which a further cooling medium, in particular water, compressed air or oil, can be guided.

Description

The invention relates to a cooling arrangement, an electrical appliance and a use of a cooling arrangement. In electrical appliances, it is known that a heat-generating component is thermally connected to a heat sink for cooling purposes. Furthermore, it is known to direct a flow of cooling medium along the component to cool it. DE 195 38 642 A1 shows a cooling and mounting arrangement for a series of semiconductor components. DE 37 10 198 A1 shows a coolable arrangement of electronic components or assemblies. US Patent 5,940,272 A describes an electronic device with heat-radiating cooling fins. DE 10 2007 058 706 A1 shows a cooling structure for an electronic device. US Patent 6,411,514 B1 describes an inverter with a heat dissipation device. US patent 2005 0146851 A1 discloses an electronic component comprising a circuit board and a heat sink. The JP 2007 311697 A shows a cooling unit for a circuit. US Patent 5 740 013 A shows an enclosure for an electronic device with electromagnetic shielding and heat dissipation properties. From DE 39 03 615 A1 an electrical printed circuit board with electrical / electronic components is known. DE 43 25 499 C2 describes an add-on control unit. From US 2010 / 0 079 944 A1, a power electronics module with a cooling arrangement is known as the closest state of the art. A cooling flange for electronically operated small parts is known from DE 32 23 523 A1. From DE 10 2006 046 194 A1 a heat sink for cooling an electrical component is known. A power semiconductor module with a sensor component is known from DE 103 09 302 A1. The invention is therefore based on the objective of further developing a cooling arrangement, whereby the cooling is to be carried out more effectively, thereby improving environmental protection. According to the invention, the problem is solved in the arrangement according to the features specified in claim 1 or 2, in the electrical device according to the features specified in claim 16, and in the use of a heat sink according to the features specified in claim 17. Key features of the invention for the arrangement for cooling heat-generating components are that the arrangement comprises a printed circuit board on which a first and a second heat-generating component are arranged, and a heat sink with air guides which at least partially define one or more cooling channels, wherein the heat sink is thermally connected to the first heat-generating component, wherein the second heat-generating component projects at least partially into a partial area of ​​the cooling channel or into a respective partial area of ​​the several or all cooling channels, and wherein the air guides are arranged on the side of the heat sink facing away from the printed circuit board. A key advantage is that different types of heat-generating components, even when mounted on a single circuit board, can be cooled in various ways, depending on the specific properties of the component. For components with irregular, especially jagged, surfaces, such as an inductor, cooling via a flow of coolant along the component is advantageous because it reaches and cools all surface areas. In contrast, cooling via a direct thermal connection with the heat sink is particularly beneficial for flat components with a large, flat surface that can be brought into thermally conductive contact with a surface of the heat sink, such as the inverter in a converter.The inverter is manufactured as a compact, essentially cuboid-shaped unit, soldered to the circuit board's conductor tracks, and features pulse-width modulated (PWM) controlled power semiconductor switches arranged in half-bridges. The air guides act as cooling fins, allowing the heat from the heat sink to be radiated more effectively to the cooling medium flow compared to a cooling plate with a smaller surface area. Important features of the invention in the arrangement, in particular cooling arrangement, for cooling heat-generating components are that the arrangement comprises a printed circuit board on which a first heat-generating component and a second heat-generating component are arranged, in particular which is equipped with a first and a second heat-generating component, and a heat sink with air guides for guiding a cooling medium flow, wherein the heat sink is thermally connected to the first heat-generating component, wherein the air guides are arranged to guide the cooling medium flow along the second heat-generating component in order to dissipate the heat generated by the second heat-generating component to the environment. The heat sink is arranged between the cooling medium flow and the circuit board, in particular wherein the circuit board is arranged on the side of the heat sink that is facing away from the side of the heat sink facing the cooling medium flow, and / or wherein the first heat-generating component is arranged on the side of the heat sink facing away from the cooling medium flow, in particular wherein the cooling medium flow is separated from the circuit board by means of the heat sink, and / or wherein the air guides are arranged on the side of the heat sink facing away from the circuit board. A key advantage is that various heat-generating components, although mounted on a single circuit board, can be cooled in different ways, chosen according to the specific properties of each component. Cooling via a direct thermal connection to the heat sink is particularly advantageous for flat components with a large, flat surface area that can be brought into thermally conductive contact with the heat sink, such as the inverter in a converter. The inverter is manufactured as a compact, essentially cuboid-shaped unit, soldered to the circuit board traces, and features pulse-width modulated (PWM) controlled power semiconductor switches arranged in half-bridges.For components with an irregular, especially jagged, surface, such as a throttle, cooling via the flow of cooling medium along this component is advantageous, as this reaches and cools all surface areas of the component. In particular, the arrangement comprises at least a first and a second heat-generating component, wherein the first component is cooled directly and effectively by means of a thermally conductive contact connection with the heat sink, and the second component is cooled by a cooling medium flow guided along it and having such a high flow velocity that the heat is carried away by the cooling air flow and only an insignificant proportion flows to the heat sink. In an advantageous embodiment, the arrangement, and in particular the heat sink of the arrangement, has one or more cooling channels which are at least partially bounded by air guides of the heat sink, wherein one or more or all cooling channels are arranged and / or configured such that the flow of the cooling medium in the cooling channel(s), in particular during its flow along the cooling channel, dissipates heat from the first heat-generating component and, at least intermittently, dissipates heat from the second heat-generating component. It is advantageous that a single flow of the cooling medium, which is guided along the cooling channels, cools both the first and the second heat-generating component. This ensures a uniform heat distribution in the arrangement, thereby preventing overheating of individual components. Furthermore, a single temperature sensor is sufficient to determine the temperature of all components.This results in high operational reliability with minimal component costs. In an advantageous embodiment, the arrangement, and in particular the heat sink of the arrangement, has one or more cooling channels which are at least partially delimited by air guides of the heat sink, wherein the second heat-generating component projects into a section of the cooling channel or into a respective section of the multiple or all cooling channels. It is advantageous that both flat components such as the inverter and components that protrude further from the plane of the printed circuit board, such as the inductor, can be cooled by means of a heat sink, by connecting the flat components to the heat sink and the protruding components projecting into the heat sink. In this way, flat and protruding components can be brought to a uniform temperature. In a preferred embodiment, the coolant flow is separated from the printed circuit board (PCB) by means of the heat sink. The advantage of this is that the coolant flow, and in particular the contaminants contained in the coolant flow, such as dust, are kept away from the PCB, thus preventing or at least reducing malfunctions of the PCB. This, in turn, increases the operational reliability of the electronic components on the PCB. In a further advantageous embodiment, the heat sink is arranged between the coolant flow and the circuit board. The advantage here is that the coolant flow and the circuit board, in particular the sensitive electrical components mounted on the circuit board, are protected from the coolant flow, which may be contaminated with dirt particles, thereby improving operational reliability. In a further advantageous embodiment, the first heat-generating component is thermally connected to the heat sink on the side facing away from the flow of the cooling medium. According to the invention, the first heat-generating component is arranged between the circuit board (12) and the heat sink (1), in particular with thermal paste being placed between the heat sink and the first heat-generating component. It is advantageous that the heat sink can be designed without an air guide on the side facing away from the flow of the cooling medium, and in particular can be designed flat, so that this side of the heat sink can be easily and thermally connected to the first component. Applying thermal paste between the heat sink and the component reduces the thermal resistance between the component and the heat sink. In a further advantageous embodiment, the second heat-generating component projects into the cooling medium flow through a first recess in the heat sink, in particular wherein the second heat-generating component is designed as an inductor, in particular as a choke. According to the invention, the heat sink has a first recess for receiving the second heat-generating component, in particular for receiving the inductor. An advantage is that the second heat-generating component can be mounted on the same circuit board as the first heat-generating component, in particular on the same side of the circuit board. This enables simple and cost-effective assembly. In a further advantageous embodiment, the heat sink is arranged at a distance from the second heat-generating component. An advantage here is that the second component can be electrically isolated from the heat sink by means of an interposed air as an insulating medium. This prevents voltage flashovers between the component and the heat sink. The distance between the heat sink and the second heat-generating component is advantageously large enough that there is no direct contact between them, thus preventing voltage flashovers. Furthermore, the distance between the heat sink and the second heat-generating component is small enough that the coolant flow is directed from the heat sink to the second heat-generating component by means of the air guide. In a further advantageous embodiment, the heat sink has a base plate on which cooling fins are formed as air guides, in particular in one piece or in two pieces. The advantage here is that the heat sink with the cooling fins can be manufactured simply in a single operation. In a further advantageous embodiment, the heat sink features cooling fingers, in particular structures that increase the surface area. A benefit of this is that cooling fingers have a larger surface area than cooling fins, thus improving heat dissipation to the ambient air. Furthermore, isotropic heat dissipation is achievable, meaning heat dissipation performance independent of the installation position. In a further advantageous embodiment, the heat sink is made of metal, in particular aluminum, especially anodized aluminum. The advantage here is that metallic materials have good thermal conductivity compared to, for example, ceramic materials and are easy to process. Anodized aluminum, in particular, exhibits especially good heat dissipation. In a further advantageous embodiment, the first recess extends through the base plate and also into a first cooling fin, with a second cooling fin being spaced apart from the first recess. The advantage here is that the second heat-generating component can be designed to project into the cooling medium flow through the recess, and the cooling medium flow can be conducted through the remaining cooling fins, and in particular, separated from the circuit board. In a further advantageous embodiment, the first recess is a round hole, in particular a milled or drilled round hole, provided it is in the cooling sink. The advantage here is that a round hole can be produced easily and cost-effectively, especially by milling or drilling. In a further advantageous embodiment, the heat sink is designed as an extruded profile. The advantage here is that the heat sink and air guides can be manufactured simply and cost-effectively in a single operation. In a further advantageous embodiment, the first recess is a round hole, in particular a milled or drilled round bore, introduced into the continuously cast profile transversely to the continuous casting direction. The advantage here is that only a single additional work step is required to produce the recess. According to the invention, the heat sink has a plate-like rear wall extending in the direction of continuous casting, in particular which is designed perpendicular to the base plate. It is advantageous that the heat sink can be designed to be enclosed externally by means of the rear wall, and in particular that it can be attached to a suspension system by means of this rear wall. According to the invention, the rear wall is thermally connected to a cooling plate, in particular to a cooling plate arranged in a control cabinet, and in particular wherein the cooling plate has cooling channels through which a further cooling medium, in particular water, compressed air or oil, can be conveyed. An advantage of this is that the heat from the heat sink can be dissipated more effectively by means of the cooling plate than by means of pure convection. In a further advantageous embodiment, the arrangement comprises a printed circuit board, in particular a single printed circuit board, wherein the printed circuit board has a low-voltage area and a high-voltage area. The advantage here is that all the electronics of the device comprising the arrangement can be mounted simply and cost-effectively on a single printed circuit board. In a further advantageous embodiment, the heat sink is arranged in the high-voltage area. This has the advantage that components in the high-voltage area, which generally generate more heat than components in the low-voltage area, are preferentially cooled. The cooling of the low-voltage area is achieved via the housing of the electrical device containing the arrangement. In a further advantageous embodiment, an insulating material is arranged between the heat sink and the circuit board, which has at least two recesses through which the first and the second heat-generating component protrude, in particular wherein the insulating material acts as an electrical insulator, in particular having a higher electrical insulation strength and / or dielectric strength than air, in particular wherein each recess of the insulating material can be aligned with the respective recess of the heat sink, wherein the insulating material has a lower thermal conductivity than air, in particular thus improving the heat dissipation of the circuit board to the environment, in particular via a housing of the arrangement.An advantage of this design is that the heat sink, as well as the first and second heat-generating components, can be thermally insulated from other components on the circuit board. The heat generated by these other components can then be dissipated via different thermal paths. A further advantage is that the thermal insulation of these other components from the first and second heat-generating components reduces the heat radiating to them. This improves the heat dissipation of the circuit board to the surrounding environment. In a further advantageous embodiment, a frame mechanically, and in particular rigidly, connects the heat sink to the printed circuit board, particularly wherein the frame is designed as a housing part and / or wherein the frame at least partially forms part of the housing, and wherein the frame is mechanically connected to the printed circuit board, in particular rigidly. An advantage of this is that the heat sink, frame, and printed circuit board form a compact unit and can therefore be easily inserted into a housing. In a further advantageous embodiment, a cooling medium stream driven by a fan flows past a surface area of ​​the heat sink to dissipate heat to the ambient air. The advantage here is that the heat from the heat sink is dissipated to the ambient air. In another advantageous embodiment, the cooling medium flow directed by the heat sink is convectively driven and vertically oriented, particularly with the cooling fins extending vertically. An advantage of this is that the air circulation is improved by convection. In a further advantageous embodiment, the heat sink and circuit board are at least partially enclosed by a housing part, in particular a housing part made of electrically non-conductive material, wherein the housing part has circulation devices, in particular ventilation slots and / or flow channels, and / or mounting devices for a device for increasing heat dissipation to the surrounding medium, in particular a fan. It is advantageous that the arrangement is protected from environmental influences, such as dust and / or water, by the housing. Nevertheless, the heat dissipation by means of the circulation devices and / or the fan is only slightly restricted. In a further advantageous embodiment, the heat from a component located in the low-voltage area can be dissipated to the environment via the air inside the housing, which is exchanged with the surrounding medium through the circulation system. An advantage of this is that the low-voltage area and the components located thereon can be cooled independently of the heat sink. This also reduces heat transfer from the heat sink to the components located in the low-voltage area, thus protecting the components from overheating. In a further advantageous embodiment, a temperature sensor is thermally connected to the heat sink. The advantage here is that the temperature of the heat sink can be measured and controlled. In a further advantageous embodiment, the temperature sensor is arranged on the printed circuit board, in particular wherein the printed circuit board has a first and a second printed circuit board section, and in particular wherein the first printed circuit board section is connected to the second printed circuit board section via such a small connection area that it is elastically deflectable relative to it, and in particular is elastically deflected, wherein the temperature sensor is mounted on the first printed circuit board section. An advantage of this is that good thermal contact with the sensor is enabled while simultaneously enabling cost-effective mounting of the sensor. As a result of the elastic deflection, mechanical tolerances, which can arise in particular from thermal expansion or as manufacturing tolerances, can be compensated for.Because the sensor is mounted on an elastically deflectable section, which is held at a distance defined by the mounting device towards the heat sink, the circuit board can be fixed to a housing part that is rigidly connected to the heat sink. Tolerances and / or thermally induced expansion of the housing part, the circuit board, and / or the heat sink therefore only result in a corresponding elastic deflection of the circuit board section accommodating the sensor. Furthermore, sufficient electrical insulation between the temperature sensor and other electrical components can be achieved by separating the first from the second circuit board section. This can be easily accomplished by an intermediate recess and a suitably designed connecting section. In a further advantageous embodiment, a holding device is arranged between the heat sink and the first circuit board section. The advantage here is that the heat from the heat sink is conducted to the sensor via the holding device, and the temperature of the heat sink can be determined. In this way, the risk of overheating is reduced, thus increasing safety. In a further advantageous embodiment, the connection area and a second recess separate the first and second printed circuit board sections, particularly where the recess is designed as a milled-out section in the printed circuit board. An advantage of this design is that a milled-out recess is easy to manufacture. In a further advantageous embodiment, the recess with the connection area at least partially encloses or frames the second printed circuit board section, particularly in that the recess is completely embedded in the printed circuit board. The advantage here is that the second printed circuit board section is elastically deflectable, but the embedding reduces the risk of breakage compared to when the recess opens into the edge of the printed circuit board. In a further advantageous embodiment, the recess is formed from the edge of the printed circuit board or opens into the edge of the printed circuit board. The advantage here is that the recess is easy and inexpensive to manufacture from the edge. In a further advantageous embodiment, the recess extends deeper into the printed circuit board than the width of the first circuit board section. The advantage here is that a particularly elastic deflection of the first circuit board section is enabled, meaning a deflection can be achieved with less force and thus lower stresses in the circuit board. In a further advantageous embodiment, the thermal resistance from the heat sink via the mounting device to the sensor is lower than via all other existing heat conduction paths between the heat sink and the sensor, particularly via air arranged between the heat sink and the first printed circuit board section, especially wherein the heat sink and / or the mounting device is / are metallic, particularly made of aluminum. An advantage of this is that, due to the good thermal connection, an accurate determination of the heat sink temperature is possible thanks to the low thermal conductivity losses. In a further advantageous embodiment, the printed circuit board is designed with multiple layers, in particular as a multilayer printed circuit board, and / or has inner layers. An advantage here is that vias are possible, connecting the individual layers. Vias, in this context, mean that the inside of the recess, for example, a hole, is completely metallized. In this way, electrically and / or thermally advantageous conditions can be achieved, in particular a lower thermal resistance between the heat sink and the sensor. In a further advantageous embodiment, the circuit board is populated using SMD technology and / or through-hole mounting; in particular, the temperature sensor is mounted using SMD technology. An advantage of this is that mass production is possible. In a further advantageous embodiment, metallic areas, in particular layers, are arranged in the first printed circuit board section, especially on the top and / or bottom and / or the inner layers of the printed circuit board. The advantage here is that the metallic areas improve heat transfer along the printed circuit board, thus enabling a lower thermal resistance from the heat sink to the sensor. In a further advantageous embodiment, the metallic areas are designed as conductor tracks of the printed circuit board, in particular conductor tracks made of copper-containing material, especially tinned copper conductor tracks. The advantage here is that high electrical and thermal conductivity can be achieved with a single material. In a further advantageous embodiment, the holding device contacts one of the metallic areas. The advantage here is that precise temperature determination of the heat sink is enabled due to low heat conduction losses via the holding device and the metallic area. In a further advantageous embodiment, a recess is provided in the first printed circuit board section, in particular a via through which the holding device is inserted or passed, in particular a metallic via, especially made of copper-containing material, in particular of tin-plated copper. It is advantageous that the via perpendicular to the conductor tracks, i.e., in the normal direction to the conductor track plane and / or printed circuit board plane, enables heat transfer through the printed circuit board. In a further advantageous embodiment, a metallic area of ​​the printed circuit board is connected to the wall of the via. The advantage here is that the via electrically and thermally connects metallic areas of the printed circuit board and enables good thermal contact of the heat sink via the mounting device. In a further advantageous embodiment, the holding device contacts the wall of the via. The advantage here is that the via electrically and thermally connects the holding device to the circuit board. In a further advantageous embodiment, the connection between the holding device and the first circuit board section is detachable, in particular by means of screws; in particular, a threaded bore is provided in the holding device which accommodates a fastening screw, in particular whose screw head contacts a metallic area of ​​the circuit board. It is advantageous that the heat sink can be easily mounted on the circuit board with the holding device. In a further advantageous embodiment, the holding device is firmly connected to the heat sink and / or bonded in a manner inert to the material, in particular via a rivet. An advantage of this is that the connection between the holding device and the heat sink is compact and does not obstruct the cooling airflow between the cooling fins of the heat sink. In a further advantageous embodiment, the holding device is detachably connected to the heat sink via a screw-toothed part. The advantage here is that the holding device can be easily mounted on the heat sink. In a further advantageous embodiment, a frame mechanically, and in particular rigidly, connects the heat sink to the circuit board. The advantage here is that the electrical components on the surface of the circuit board are protected against mechanical damage. In a further advantageous embodiment, the frame and heat sink are detachably connected, in particular wherein the frame is designed as a housing part and / or wherein the frame at least partially forms part of the housing, and wherein the frame is mechanically connected to the printed circuit board in the area of ​​the second printed circuit board section, in particular rigidly connected. An advantage of this is that the heat sink, frame, and printed circuit board form a compact unit and can be easily inserted into a housing. In a further advantageous embodiment, the temperature sensor is arranged on the surface of the printed circuit board facing the heat sink. An advantage of this is that the heat sink protects the sensor from mechanical damage, particularly if the first section of the printed circuit board is elastically deflected. In a further advantageous embodiment, the temperature sensor is connected to the circuit board via soldered connections. The advantage here is that the contacting and mounting of the sensor can be carried out in a single manufacturing step and with a single material. In a further advantageous embodiment, the sensor has contact surfaces for electrical contact and a temperature sensing surface, wherein the temperature sensing surface of the sensor is soldered to a metallic area on the circuit board that extends into the wall of the via. The advantage here is that the electrical contact can be implemented simply and cost-effectively by means of a soldered connection, and the temperature sensing surface of the sensor is thermally connected to the via via the metallic area by means of a soldered connection and thus to the heat sink via the mounting device. In a further advantageous embodiment, the holding device is designed as a bolt. The advantage here is that a bolt is easy to install. In a further advantageous embodiment, a spacer sleeve and / or a metallic washer are arranged between the heat sink and the first printed circuit board section. The advantage here is that a defined distance between the heat sink and the first printed circuit board section can be set, and mechanical stresses on the printed circuit board can be reduced. Important features of the invention in the electrical device, in particular a converter for supplying an electric motor, especially an asynchronous motor and / or synchronous motor, are that the electrical device has a aforementioned arrangement for cooling. An advantage of this is that the heat-generating components of a printed circuit board can be cooled by means of a thermally conductive connection with the heat sink or a cooling medium flow directed along the component, whereby the cooling medium flow is only directed along a selected component; all other components are separated from the cooling medium flow, in particular kept away from impurities contained in the cooling medium flow. Key features of the invention when using a heat sink to guide a cooling medium flow are that the cooling medium flow is guided along air guides of the heat sink, wherein a first heat-generating component thermally connected to the heat sink is cooled, wherein at least intermittently the cooling medium flow is guided along a second heat-generating component, wherein the first and the second heat-generating component are arranged on a printed circuit board, in particular wherein the heat sink is arranged between the printed circuit board and the cooling medium flow. An advantage of this is that the heat sink is used both to cool the first heat-generating component, which is thermally connected to the heat sink, and to cool the second heat-generating component located in the cooling medium flow, whereby the cooling medium flow is only directed along one selected component; all other components are separated from the cooling medium flow, in particular from impurities contained in the cooling medium flow. Further advantages arise from the dependent claims. The invention is not limited to the combination of features of the claims. For those skilled in the art, further meaningful combinations of claims and / or individual claim features and / or features of the description and / or the figures will become apparent, in particular from the problem statement and / or the problem arising from a comparison with the prior art. The invention will now be explained in more detail with reference to the figures: Figure 1 shows a schematic cross-sectional sketch of an arrangement for detecting the temperature of a heat sink with a temperature sensor. Figure 2 shows a schematic top view of a printed circuit board section comprising the arrangement for detecting the temperature of a heat sink. Figure 3 shows an enlarged section of a cross-section of the arrangement for detecting the temperature of a heat sink. Figure 4 shows an oblique view of the front of a printed circuit board and a heat sink connected to it of an electrical device according to the invention, excluding the housing of the arrangement. Figure 5 shows an oblique view of the back of the printed circuit board. Figure 6 shows a top view of the front of the printed circuit board with the heat sink and a frame connected to it.Figure 7 shows the front of the printed circuit board without a heat sink in a top view. Figure 8 shows the conductor track structure, in particular the layout, of the printed circuit board in a top view. Fig. 1 shows an arrangement for sensing the temperature of a heat sink 1. The arrangement includes a holding device 2 that thermally and / or electrically connects the heat sink 1 to a first printed circuit board section 3. The holding device 2 is, for example, designed as a bolt or pin. The heat transfer between the heat sink 1 and the holding device 2 has a low thermal resistance. The heat sink 1 and the holding device 2 are made of metal, preferably aluminum. The holding device 2 is riveted to the heat sink 1. The connection of the holding device 2 to the first printed circuit board section 3 is detachable, in particular via a screw 4, the thread of which is screwed into a threaded hole in the holding device 2. A sensor, preferably a temperature sensor 5, is arranged on the first printed circuit board section 3 in close proximity to the holding device 2. In this context, "thermally conductive connection" means that two objects have a lower thermal resistance to each other via this connection than via any other thermal conduction path between the objects. The printed circuit board 12 is a multilayer printed circuit board, in particular with inner layers. The printed circuit board 12 can therefore also be described as a multilayer printed circuit board. Preferably, copper-containing material or copper is used as the material for the conductor tracks 13: Tinned copper is advantageous for outer layers. The electrical components, in particular the temperature sensor 5, are soldered to the printed circuit board 12. Preferably, the components are mounted on the printed circuit board 12 using surface-mount technology and / or through-hole mounting, preferably on both sides or on one side only on the side of the printed circuit board 12 facing the heat sink 1. In particular, the temperature sensor 5 is arranged on the side of the first printed circuit board section 3 facing the heat sink 1, in particular at the connection point between the mounting device and the heat sink. Fig. 2 shows the first printed circuit board section 3, on which the temperature sensor 5 and a third recess of the printed circuit board section 3 are arranged. In particular, the third recess is designed as a via 14. A via here means that the inner wall of the third recess is completely metallized; in particular, copper or tinned copper is used for the metallization. A metallic contact surface 11, i.e., a conductor track section, adjoins the wall of the via 14. In particular, the metallic contact surface 11 radially surrounds the third recess, through which the holding device 2 is inserted and / or passed, in the plane of the conductor track section. Preferably, such a metallic contact surface 11 is provided in several or all conductor track sections.The holding device 2 touches the wall of the via 14 and / or the metallic contact surface 11, for example with the screw head of the screw 4. The first printed circuit board section 3 is thermally, mechanically, and electrically separated from the rest of the printed circuit board 12 by a further second recess 10 and a small connection area. This allows the first printed circuit board section 3 to deflect elastically relative to the rest of the printed circuit board 12. In particular, the first printed circuit board section 3 is deflected elastically due to manufacturing-related and / or thermally induced length tolerances of the holding device 2 compared to the rigid connection of the rest of the printed circuit board 12 to the heat sink 1. The second recess 10, which separates the first printed circuit board section 3 from the rest of the printed circuit board 12, is preferably arranged completely within the printed circuit board 12. The small connection area is designed such that the second recess 10 encloses at least 75% of the first printed circuit board section 3. In particular, the contact area of ​​the connection area with the first printed circuit board section 3 is smaller than the length of the connection area, so that the first printed circuit board section 3 can be elastically deflected relative to the rest of the printed circuit board 12. The metallic contact surface 11 extends to the second recess 10 and is configured as a conductor track 13 on the top and / or bottom and / or inner layers of the first printed circuit board section 3. The temperature sensor 5 is located on the side of the first printed circuit board section 3 facing the heat sink 1 and is electrically and / or thermally connected to the holding device 2. In particular, the temperature sensor 5 has contact surfaces for electrical contact and a temperature sensing surface which is connected to the metallic contact surface 11. The heat sink 1 is mechanically connected to the circuit board 12 via a frame 42. In particular, this connection is mechanically rigid. Preferably, the connection is designed to be detachable, for example by means of a screw connection. In further embodiments according to the invention, the second recess 10 is formed from the edge of the circuit board 12, wherein the second recess 10 extends deeper into the circuit board 12 than the first circuit board section 3 is wide. In further embodiments according to the invention, a spacer sleeve is arranged between the heat sink 1 and the first printed circuit board section 3. By pressing the first printed circuit board section 3 against the sleeve with the screw 4 screwed into the holding device 2, in particular the spacer sleeve, a defined distance between the heat sink 1 and the printed circuit board 3 is set. In further embodiments according to the invention, the connection of the holding device 2 to the circuit board 3 is made firmly, for example by means of a rivet. In further embodiments according to the invention, the mechanical connection of the holding device 2 with the cooling element 1 is detachable, preferably by means of a screw connection. In further embodiments of the invention, a washer is arranged between the screw head and the first printed circuit board section 3 and / or between the spacer sleeve and the first printed circuit board section 3 in order to mechanically relieve the first printed circuit board section 3. Preferably, the washer is made of a metallic material, which reduces the thermal resistance between the holding device 2 and the metallic contact surface 11. Figure 4 shows an electrical device according to the invention, in particular an inverter, with a heat sink 1 arranged above the top, i.e., front, of the circuit board 12, with the housing removed. The electrical device can be connected to the electrical supply network via a first connector 27. A second connector 31 provides the electrical connection to the load, in particular a motor, preferably an asynchronous motor and / or a synchronous motor. The circuit board 12 is divided into two areas: a low-voltage area with signal electronics, which includes, for example, a microcontroller 20, as well as a first connection device 32 for an adapter for secure mounting, a second connection device 33 as a signal connection, a third connection device 36 for connection to field distribution systems and a fourth connection device 37 for an external operating unit. The second area is a high-voltage section with power electronics. The following components are arranged within the power electronics section: an inverter 61 as the first heat-generating component; a first mains filter 22 with an inductor 28 as the second heat-generating component for suppressing interference in the input signal; a second mains filter 52 for suppressing interference in the output signal; a galvanically isolated resistor 50; and shunt resistors 51. The inverter 61 has power semiconductor switches, preferably IGBT or MOSFET switches, arranged in half-bridges. In the area between the inverter and the control electronics, there is a first capacitor 21 of an intermediate circuit and a second capacitor 29 as an auxiliary capacitor. This arrangement, in particular, achieves a large spatial distance between the inverter 61 and the control electronics. Signal transmission between the control electronics and the power electronics is achieved via galvanically isolated first optocouplers 34 for control signals and galvanically isolated second optocouplers 35 for measurement signals. In particular, the circuit board 12 in the area between the control electronics and the power electronics is free of conductive traces, i.e., metallic layers, on all levels. The optocouplers 34 and 35 are connected to the inverter 61 via parallel lines 60. The switching network is powered by a transformer 30. The heat sink 1 is located in the power electronics area; it covers the mains filters 22 and 52, as well as the resistor 50, the shunt resistors 51, and the inverter 61. The heat sink 1 extends over the entire length of the circuit board 12 from the first connector part 27 to the second connector part 31. The heat sink 1 is connected to the circuit board 12, on which the connector parts 27 and 31 are arranged, in a vibration-damping manner. The connection of the heat sink 1 to the first circuit board section 3 is particularly advantageous, as vibrations are compensated for by the tongue-like design of the first circuit board section 3. The vibration-damping connection of the heat sink 1 to the circuit board also improves the operational reliability of the connector parts 27 and 31, as they are subjected to less vibration during operational vibrations of the electrical device, thus reducing the risk of contact loss. Furthermore, the circuit board 12 is made of flexible, sound-absorbing material, so that the structure-borne noise coupled via the heat sink 1, especially from the fan, is dampened and thus the connectors with the connector parts 27 and 31 are vibrationally relieved. As described above, the temperature sensor 5 is also vibrationally decoupled from the noise-inducing part, i.e., the vibration-inducing heat sink 1 with the rigidly connected fan. In this way, the electrical contacts of the supply lines and motor leads, as well as the sensors, are vibrationally decoupled from the sound source, in particular the vibration source. The basic form of the heat sink 1 is produced by continuous casting, and the heat sink 1 is then manufactured from it by further processing. In particular, the heat sink is manufactured in one piece. The continuously cast profile has a base plate to which air guides extending in the direction of the continuous casting, which function as cooling fins 26, and a plate-like back wall, i.e., back plate 25, extending in the direction of the continuous casting, are formed in one piece. Preferably, the back plate 25 is formed perpendicular to the base plate. The heat sink 1 has one or more cooling channels, which are at least partially bounded by the cooling fins 26. The cooling channels convey a flow of cooling medium, for example, a cooling airflow driven by a fan. Preferably, two substantially parallel sides of a cooling channel are bounded by the cooling fins 26. A base plate of the heat sink 1 bounds a third side of the cooling channel. A fourth side of the cooling channel is open and / or bounded by a housing part. In the area of ​​the inductor 28, a first recess 40 is provided in the heat sink 1. This first recess 40, preferably a round bore machined into the continuous casting profile transversely to the direction of the continuous casting, divides the base plate of the heat sink 1 into two areas: a first base plate section 24 and a second base plate section 41. The first recess 40 is provided not only in the base plate but also in central cooling fins 26. In particular, the inductor 28 arranged on the circuit board 12 projects into the first recess 40 of the heat sink 1. Specifically, the first recess 40 is formed after the continuous casting of the heat sink 1, preferably by drilling and / or milling. The heat sink 1 therefore has a first recess 40 for receiving the inductor 28. During the flow of the cooling medium along the heat sink 1 or along at least one cooling channel, a volume element of the cooling medium flow cools the inverter 61 by means of heat conduction via the heat sink 1 and at least part of the time also the inductance 28, in that the volume element of the cooling medium flow flows directly along the inductance 28 or the part of the inductance 28 that protrudes into the heat sink 1. The heat sink 1 is laterally enclosed by a first cooling fin 23 and a rear plate 25 of the electrical device. The electrical device is thermally connected via the rear plate 25 to a control cabinet (not shown in the figures) and can be cooled via a cooling plate (not shown in the figures), in particular a cold plate. This cooling plate has, for example, channels through which a cooling medium can be conveyed, whereby, for example, water, compressed air, or oil can be used as the cooling medium. The cooling fins 26 are preferably arranged on the side of the heat sink 1 facing away from the circuit board 12. Thus, the base plate of the heat sink 1 is positioned between the cooling fins 26 and the circuit board 12. The heat sink 1 is therefore located between the flow of the cooling medium, which is guided by the cooling fins 26 acting as an air guide, and the circuit board. In further embodiments according to the invention, the cooling plate has surface-enlarging structures, for example cooling fins and / or cooling fingers, on the side facing away from the electrical device, which are cooled by convection. In further embodiments according to the invention, the heat sink is electrically connected to an earthed element of the control cabinet. In further embodiments of the invention, instead of manufacturing the cooling element 1 as a continuous casting, the cooling element 1 is manufactured as a casting, with the first recess 40 being provided during the casting process. Thus, the cooling element 1 is produced in one piece and no post-processing is necessary. Preferably, a die-casting process is used for casting. In particular, this makes it easy to design the cooling element 1 with cooling fingers as surface-enlarging structures. In further embodiments according to the invention, an insulating medium is arranged between the heat sink 1 and the first heat-generating component, in particular the inverter 61, wherein the insulating medium electrically insulates the electrical components from the heat sink 1 and has a lower thermal resistance from the electrical components to the heat sink 1 than all other heat conduction paths between the electrical components and the heat sink 1. For example, thermal pads or thermal paste can be used as the electrical insulating medium. In further embodiments of the invention, a further electrical insulating element, which has a higher thermal resistance between the electrical components and the heat sink 1 than all other heat conduction paths between the electrical components and the heat sink 1, has a recess corresponding to the first recess 40 in the heat sink 1. Thus, the first and second heat-generating components, in particular an inductor 28 and / or an inverter 61, can pass through the insulating element. This insulating element thermally insulates the underlying components from the heat sink 1, preventing them from being heated by the heat of the heat sink 1. Such an insulating element can be made in one piece. Additionally, the insulating element can be electrically insulating, thereby preventing voltage flashovers from the electrical components via the heat sink 1. In further embodiments according to the invention, the heat sink 1 is made of anodized aluminum, which increases the heat emissivity of the heat sink 1. In further embodiments of the invention, the circuit board 12 and the heat sink 1, which are connected by means of a frame part 42, are arranged in a housing. This housing has a housing wall which is preferably made of electrically non-conductive material, in particular plastic. In further embodiments according to the invention, the housing has circulation devices such as ventilation slots and flow channels to increase heat dissipation to the surrounding medium. These ventilation slots also allow for the cooling of components located in the low-voltage section. The heat from these components is radiated to the air inside the housing. This air is then convectively exchanged with the cooler outside air through the ventilation slots. The invention thus teaches a cooling concept encompassing the entire electrical device, which includes cooling the inverter 61 and the inductor 28 by means of the heat sink and cooling the microcontroller 20 by convection through the ventilation slots. In further embodiments according to the invention, the electrical device is air-cooled by a fan. For this purpose, the airflow of the fan is directed over the cooling fins 26 and thereby the heat is dissipated to the ambient air. In further embodiments of the invention, the electrical device is mounted vertically, in particular such that the cooling fins extend in a vertical direction, thus improving air circulation through the cooling fins by a chimney effect. "Vertical" here means that the direction of the cooling medium flow is essentially parallel to the gravitational field vector. The deviation from parallelism is less than 20°, in particular less than 10°, preferably less than 5°. Reference symbol list 1 Heat sink 2 Mounting bracket 3 First PCB section 4 Screw 5 Temperature sensor 10 Second recess 11 Contact pad 12 PCB 13 Traces 14 Via 20 Microcontroller 21 First capacitor 22 First mains filter 23 First heat sink 24 First base plate section 25 Backplate 26 Heat sink 27 First connector part 28 Inductor 29 Second capacitor 30 Transformer 31 Second connector part 32 First terminal 33 Second terminal 34 First optocoupler 35 Second optocoupler 36 Third terminal 37 Fourth terminal 40 First recess 41 Second base plate section 42 Frame part 50 Resistor 51 Shunt resistor 52 Second mains filter 60 Wires 61 Inverter

Claims

An arrangement, in particular a cooling arrangement, for cooling heat-generating components, comprising: a printed circuit board (12) on which a first and a second heat-generating component are arranged, and a heat sink (1) with air guides which at least partially delimit one or more cooling channels, wherein the heat sink (1) is thermally connected to the first heat-generating component, wherein the second heat-generating component projects at least partially into a partial area of ​​the cooling channel or into a respective partial area of ​​the several or all cooling channels, wherein the air guides are arranged on the side of the heat sink (1) facing away from the printed circuit board (12), characterized in that the first heat-generating component is arranged between the printed circuit board (12) and the heat sink (1), wherein thermal paste is arranged between the heat sink (1) and the first heat-generating component.wherein the heat sink (1) has a first recess (40) for receiving the second heat-generating component, in particular for receiving an inductor (28), wherein the heat sink (1) is designed as a continuous cast profile, wherein the heat sink (1) has a plate-like back plate (25) extending in the continuous casting direction, in particular which is designed perpendicular to the base plate, wherein the back plate (25) is thermally connected to a cooling plate, in particular to a cooling plate arranged in a control cabinet, in particular wherein the cooling plate has cooling channels through which a further cooling medium, in particular water, compressed air or oil, can be guided. An arrangement, in particular a cooling arrangement, for cooling heat-generating components, comprising: - a printed circuit board (12) on which a first heat-generating component and a second heat-generating component are arranged, the board being equipped with a first and a second heat-generating component, and - a heat sink (1) with air guides for guiding a cooling medium flow, wherein the heat sink (1) is thermally connected to the first heat-generating component, the air guides being arranged to guide the cooling medium flow along the second heat-generating component for dissipating the heat generated by the second heat-generating component to the environment, - wherein the heat sink (1) is arranged between the cooling medium flow and the printed circuit board (12), in particular wherein the printed circuit board (12) is arranged on the side of the heat sink (1) that faces away from the side of the heat sink (1) facing the cooling medium flow.- and / or wherein the first heat-generating component is arranged on the side of the heat sink (1) facing away from the flow of the cooling medium, wherein the flow of the cooling medium is separated from the circuit board (12) by means of the heat sink (1),- and / or wherein the air guides are arranged on the side of the heat sink (1) facing away from the circuit board (12). Arrangement according to claim 2, characterized in that the arrangement, in particular the heat sink (1) of the arrangement, has one or more cooling channels which are at least partially limited by means of air guides of the heat sink (1), wherein one or more or all cooling channels are arranged and / or configured such that the cooling medium flow in the cooling channel or cooling channels, in particular during flow along the cooling channel, dissipates heat from the first heat-generating component and dissipates heat from the second heat-generating component at least intermittently. Arrangement according to claim 2, characterized in that the arrangement, in particular the heat sink (1) of the arrangement, has one or more cooling channels which are at least partially limited by means of air guides of the heat sink (1), wherein the second heat-generating component projects into a partial area of ​​the cooling channel or into a respective partial area of ​​the several or all cooling channels. Arrangement according to one of the preceding claims, characterized in that the first heat-generating component is thermally connected to the heat sink (1) on the side of the heat sink (1) facing away from the cooling medium flow. Arrangement according to one of the preceding claims, characterized in that the second heat-generating component projects into the cooling medium flow through a first recess (40) of the heat sink (1), in particular wherein the second heat-generating component is designed as an inductor (28), in particular as a choke and / or that the heat sink (1) is arranged at a distance from the second heat-generating component. Arrangement according to one of the preceding claims, characterized in that the heat sink (1) has a base plate on which cooling fins (26) are formed as air guides, in particular in one piece or in two pieces, and / or that the heat sink (1) has cooling fingers, in particular which function as surface-enlarging structures, and / or that the heat sink (1) is made of metal, in particular of aluminum, in particular of anodized aluminum. Arrangement according to one of the preceding claims, characterized in that the first recess (40) extends through the base plate and also into a first cooling fin (23), wherein a second cooling fin is spaced apart from the first recess (40), in particular wherein the first recess (40) is a round hole provided in the cooling body (1), in particular a milled or drilled round bore. Arrangement according to one of the preceding claims, characterized in that the first recess (40) is a round hole introduced into the continuous casting profile transversely to the continuous casting direction, in particular a milled or drilled round bore. Arrangement according to one of the preceding claims, characterized in that the arrangement comprises a printed circuit board (12), in particular a single printed circuit board (12), wherein the printed circuit board (12) has a low voltage area and a high voltage area, wherein the heat sink (1) is arranged in the high voltage area. An arrangement according to one of the preceding claims, characterized in that an insulating means is arranged between the heat sink (1) and the circuit board (12), which has at least two recesses through which the first and the second heat-generating component project, in particular wherein the insulating means has an electrical insulating effect, in particular having a higher electrical insulation strength and / or dielectric strength than air, in particular wherein each recess of the insulating means can be aligned with the respective recess of the heat sink (1), wherein the insulating means has a lower thermal conductivity than air, in particular thus improving the heat dissipation of the circuit board (12) to the environment, in particular via a housing of the arrangement. Arrangement according to one of the preceding claims, characterized in that a frame mechanically, in particular mechanically rigidly, connects the heat sink (1) to the circuit board (12), in particular wherein the frame is designed as a housing part and / or wherein the frame is at least partially housing-forming, wherein the frame is mechanically connected to the circuit board (12), in particular mechanically rigidly connected. An arrangement according to one of claims 10 to 12, characterized in that a cooling medium flow driven by a fan flows past a surface area of ​​the heat sink (1) for heat dissipation to the ambient air, and / or that the cooling medium flow directed by the heat sink (1) is convectively driven and vertically oriented, in particular wherein the cooling fins (26) extend vertically, and / or that the heat sink (1) and the circuit board (12) are at least partially surrounded by a housing part, in particular a housing part made of electrically non-conductive material, in particular wherein the housing part has circulation devices, in particular ventilation slots and / or flow channels, and / or mounting devices for a device for increasing heat dissipation to the surrounding medium, in particular a fan, in particular wherein the heat of a component arranged in the low-voltage range is dissipated by means of the air located in the interior of the housing part,which is exchangeable with the surrounding medium through the circulation devices in the housing part, and can be dissipated to the environment. An arrangement according to one of the preceding claims, characterized in that a temperature sensor (5) is thermally connected to the heat sink (1), and that the temperature sensor (5) is arranged on the printed circuit board (12), and that the printed circuit board (12) has a first (3) and a second printed circuit board section, in particular wherein the first printed circuit board section (3) is connected to the second printed circuit board section via such a small connection area that it is elastically deflectable relative to it, in particular is deflected, and that the temperature sensor (5) is arranged on the first printed circuit board section (3), and that a holding device (2) is arranged between the heat sink (1) and the first printed circuit board section (3), and that the connection area and a second recess (10) separate the first (3) and second printed circuit board sections, in particular wherein the second recess (10) is designed as a milled recess in the printed circuit board (12).and that the second recess (10) with the connection area at least partially encloses and / or frames the first printed circuit board section (3), in particular wherein the second recess (10) is arranged completely in the printed circuit board (12) and / or the second recess (10) is formed from the edge of the printed circuit board (12) and / or the second recess (10) opens into the edge of the printed circuit board (12) and / or the second recess (10) extends deeper into the printed circuit board (12) than the width of the first printed circuit board section, and that the heat sink (1) and the holding device (2) are thermally connected, in particular wherein the holding device (2) is made of metal, preferably aluminum. Arrangement according to claim 14, characterized in that the printed circuit board (12) is designed in multiple layers, in particular as a multilayer printed circuit board and / or has inner layers, in particular wherein the printed circuit board (12) is mounted using SMD technology and / or through-hole mounting, and / or the temperature sensor (5) is mounted using SMD technology, and / or that metallic areas, in particular layers, are arranged in the first printed circuit board section (3), in particular on the top and / or bottom and / or the inner layers of the printed circuit board (12), in particular wherein the metallic areas are designed as conductors (13) of the printed circuit board (12), in particular conductors (13) made of copper-containing material, in particular tinned copper conductors, wherein the holding device (2) contacts one of the metallic areas, and / or that a third recess is provided in the first printed circuit board section (3), in particular a metallic via.in particular made of copper-containing material, in particular tinned copper, in particular wherein a metallic area of ​​the printed circuit board (12) is connected to the wall of the via, in particular wherein the holding device (2) contacts the wall of the via, and / or that the temperature sensor (5) is arranged on the side of the printed circuit board (12) facing the heat sink (1), wherein the temperature sensor (5) is connected to the printed circuit board (12) via solder connections, and / or that the temperature sensor (5) has contact surfaces for electrical contact and a temperature sensing surface, in particular wherein the temperature sensing surface of the temperature sensor (5) is soldered to a metallic area on the printed circuit board (12) which extends into the wall of the via, and / or that the connection of the holding device (2) to the first printed circuit board section (3) is detachable, in particular screw connection,in particular a threaded bore is provided in the holding device (2) which receives a fastening screw, in particular the screw head of which contacts a metallic area of ​​the circuit board (12), and / or that the holding device (2) is firmly connected and / or metallurgically connected to the heat sink (1), in particular via a rivet, or that the holding device (2) is detachably connected to the heat sink (1) via a screw-toothed part, and / or that the holding device (2) is designed as a bolt and / or a spacer sleeve and / or a metallic washer is or are arranged between the heat sink (1) and the first circuit board section (3). Electrical device, in particular a converter for supplying an electric motor, in particular an asynchronous motor and / or synchronous motor, comprising an arrangement according to one of the preceding claims. Use of a heat sink (1) for guiding a cooling medium flow in an electrical device, wherein the cooling medium flow is guided along air guides of the heat sink (1), wherein a first heat-generating component thermally connected to the heat sink (1) is cooled, wherein at least periodically the cooling medium flow is guided along a second heat-generating component, wherein the first and the second heat-generating component are arranged on a printed circuit board (12), in particular wherein the heat sink (1) is arranged between the printed circuit board (12) and the cooling medium flow, wherein the heat sink (1) is used for an arrangement according to one of claims 1 to 15.

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