Optoelectronic device and method for manufacturing an optoelectronic device

Abstract

Optoelectronic device (500) comprising a printed circuit board (600) configured as a DCB (direct copper bonding) printed circuit board with a layered composite of copper, an insulator and a further layer of copper or as a metal core board, and comprising a plurality of optoelectronic components (100), wherein the optoelectronic components (100) each comprise a housing (110) comprising a base (200) with a top (201) and a bottom (202) and a cap (300), wherein the optoelectronic components (100) each comprise a laser chip (400) arranged between the top (201) of the base (200) and the cap (300), wherein a first solder contact surface (210) and a second solder contact surface (220) are formed on the bottom (202) of the base (200) of each optoelectronic component (100),wherein the optoelectronic components (100) are arranged in an electrical series circuit (630) on a surface (601) of the printed circuit board (600), wherein the base (200) of each optoelectronic component (100) has an approximately rectangular shape and the housings (110) of the optoelectronic components (100) are arranged close together.

Images