Device comprising a cooking hob device and an energy system for storing, absorbing and distributing thermal energy, and a method for operating it

Abstract

The present invention relates to a device comprising at least one hob assembly, the hob assembly comprising at least one support plate for receiving cookware, at least one heating unit arranged below the support plate and by means of which the cookware can be heated, at least one support unit on which the at least one heating unit is arranged, at least one power electronics unit connected to the at least one heating unit, wherein the power electronics unit comprises at least one power semiconductor component (1) by means of which an electrical power suitable for operating the at least one heating unit can be controlled, and at least one cooling unit (2, 7) by means of which the at least one power semiconductor component (1) can be cooled.In order to provide a device that can be operated reliably regardless of external circumstances, especially under full load, the at least one cooling unit (2) comprises at least one heat exchanger unit (3, 11) which is connected to the at least one power semiconductor component (1) for heat transfer and at least one conduit element (6) by means of which the at least one heat exchanger unit (3, 11) can be supplied with a heat transfer fluid that is at least partially liquid.

Description

[0001] The present invention relates to a device comprising at least one cooking surface. The cooking surface can be, for example, an induction cooktop or another electrically operated stove. One or more cookware items can be placed on a support plate of the cooking surface and heated by means of at least one heating element. The heating element is controlled by power electronics, which convert a portion of the energy supplied to it into heat. This heat is dissipated by means of at least one cooling element.

[0002] A cooktop device of the described type is already known in the prior art. The power electronics of a known cooktop device comprise a power semiconductor component responsible for controlling a heating element. Such power semiconductor components control comparatively high electrical powers, and while they exhibit high efficiency, this efficiency does not reach 100%. This results in a portion of the power controlled by the power semiconductor component being converted into heat. Due to the particularly high powers controlled by the power semiconductor component, the amount of waste heat energy generated is so high that cooling of the power semiconductor component is necessary. For this purpose, the component has a cooling unit comprising a finned body and a fan that forces an airflow along the finned body ("forced convection").

[0003] In practice, it has been found that the cooling capacity of the known cooling unit is insufficient to reliably cool the power semiconductor component, depending on the cooktop's installation and the power output. If the cooling capacity is inadequate, the power electronics are forced to reduce the power controlled by the power semiconductor component to prevent damage. Consequently, the cooktop user cannot utilize its full power, and cooking processes may not function as intended.

[0004] The present invention therefore aims to provide a device that can be operated reliably regardless of external circumstances, especially under full load.

[0005] This problem is solved by a device having the features of claim 1 and by a method having the features of claim 10. Preferred embodiments of the invention are the subject of the dependent claims. Further advantages and features of the invention will become apparent from the exemplary embodiments.

[0006] The device according to the invention comprises at least one cooktop assembly. This assembly comprises at least one support plate for receiving cookware and at least one heating unit arranged below the support plate, by means of which the cookware can be heated. Furthermore, the cooktop assembly comprises at least one support unit on which the at least one heating unit is arranged and at least one power electronics unit connected to the at least one heating unit, wherein the power electronics unit comprises at least one power semiconductor component by means of which an electrical power can be controlled. The electrical power that can be controlled by means of the at least one power semiconductor component is of at least such an amount that it is suitable for operating the at least one heating unit.Furthermore, the cooktop device comprises at least one cooling unit by means of which the at least one power semiconductor component can be cooled. The device according to the invention is characterized in that the at least one cooling unit comprises at least one heat exchanger unit, which is at least partially connected to the at least one power semiconductor component in a heat-transferring manner and has at least one conduit element by means of which the at least one heat exchanger unit can be supplied with a heat transfer fluid that is at least partially liquid.

[0007] The device according to the invention has many advantages. A particular advantage is that, compared to known cooling units for such power semiconductor devices, the proposed cooling unit can dissipate particularly large heat loads. This is achieved by means of the at least partially liquid heat transfer fluid with which the at least one cooling unit or its heat exchanger unit is supplied. Compared to air, which is used to supply the known cooling unit, the at least partially liquid heat transfer fluid has an increased heat storage capacity, so that the heat transfer fluid can absorb and dissipate more waste heat energy from the power semiconductor device than is possible according to the prior art. As a result, even with large amounts of waste heat, reliable dissipation is possible, and consequently, continuous full-load operation of the cooktop device can be ensured.

[0008] A "carrier plate" within the meaning of the present application is a component suitable for holding cookware. Such a carrier plate is typically formed from a glass-ceramic, with one or more heating elements arranged beneath the glass-ceramic.

[0009] A "heating unit" is suitable for at least partially heating at least one piece of cookware. Whether this heating is direct or indirect is generally irrelevant. For example, a heating unit can be designed as a heating coil based on the principle of an electric resistance heater, which heats up when an electrical voltage is applied. The heating of such a unit also heats the support plate above it and any cookware placed on it. Alternatively, the heating unit could be an inductor, which induces eddy currents in the cookware. In this case, it is not the heating unit itself that is heated, but only the cookware. The size of the heating unit is also irrelevant.Thus, heating coils with a diameter of several centimeters up to several decimeters are just as conceivable as small inductors with a diameter of less than centimeters.

[0010] The "power electronics" as defined in the present application are suitable for supplying at least one heating unit with electrical power. Initially, it is conceivable that the power is simply switched ("on / off"), with a periodicity that can be adjusted as desired. Using such a method, a desired power level, ranging from zero to full load, can be achieved by setting a suitable time interval after which the heating unit is alternately switched on and off. A power semiconductor component, which is part of the power electronics, is particularly well-suited for rapid switching of high power. So-called "IG-BTs" are especially useful in this context. Furthermore, it is conceivable that the power electronics are suitable for directly "setting" a desired electrical power level and continuously supplying the heating unit with it.In this case, the power semiconductor device must be suitably equipped for this purpose. Other operating modes of the power electronics are also conceivable, so that the latter can generally be considered "power electronics" within the meaning of the present application, provided they are in any way suitable for supplying at least one heating unit with electrical power.

[0011] For the purposes of this application, a "heat exchanger unit" is understood to be a component by means of which thermal energy can be dissipated. The thermal energy to be dissipated is generated at or within the at least one power semiconductor device. This thermal energy, or waste heat, can be absorbed and dissipated by means of the at least one heat exchanger unit, wherein, according to the invention, the at least partially liquid heat transfer fluid is used.

[0012] The latter is usually water, which is a completely liquid heat transfer fluid. Likewise, all other liquids are conceivable, with oil being a viable alternative in practice, depending on the application. In addition to completely liquid heat transfer fluids, partially liquid heat transfer fluids are also conceivable. These are fluids that exist in either a liquid or gaseous state, depending on the stage of their cycle. This principle is particularly well-known from refrigeration units and heat pumps, whose heat transfer fluid absorbs or releases thermal energy through the enthalpy of vaporization and condensation, respectively. Such a change between states of matter is known in the heat exchangers of so-called "heat pipes."

[0013] A heat-transferring connection between the cooling unit and the power semiconductor device encompasses all conceivable types of thermal energy transfer. These include conduction, radiation, and convection. Conduction is of particular importance for the present invention because the cooling unit is generally directly connected to the power semiconductor device, and consequently, a large part, preferably all, of the energy transfer from the power semiconductor device to the at least one cooling unit occurs via conduction. A heat-transferring connection includes both direct and indirect connections.

[0014] The use of a heat transfer fluid that is at least partially liquid offers a further significant advantage over the prior art. This advantage arises from the fact that the heat transfer fluid used according to the invention, which is at least partially, and preferably completely, liquid, is suitable for dissipating absorbed thermal energy from the immediate vicinity of the power semiconductor device. In other words, the thermal energy dissipated by the power semiconductor device does not necessarily reoccur in the immediate vicinity of the power semiconductor device and, for example, heat the ambient air around the power semiconductor device. This is because, in an installed state of the cooktop unit, the latter is typically located within a kitchen cabinet.The interior of a kitchen cabinet is typically concealed by decorative moldings or similar elements, creating a visually uniform kitchen front. This visual enclosure of the cabinet's interior hinders air exchange between the cabinet and the rest of the kitchen. Consequently, during operation of the cooktop and the associated heat generated by the power semiconductor component, a significant heat buildup can occur within the cabinet if the thermal energy is not dissipated. In prior art designs, using only air cooling could therefore quickly lead to overheating of the ambient air, which simultaneously serves as cooling for the power semiconductor component.The cooling capacity consequently dropped, resulting in rapid overheating of the power semiconductor device. With the device according to the invention, it is now possible to reliably dissipate the accumulating thermal energy and avoid the described heat buildup. The transfer of thermal energy from the heat transfer fluid to an environment can then take place, for example, at a destination that is not critical for the thermal state of the at least one power semiconductor device.

[0015] Furthermore, a particular advantage arises from the fact that the thermal energy generated by the at least one power semiconductor device can be transported not only from the environment directly surrounding the device, but rather to any location. This is based on the consideration that modern buildings today have particularly good thermal insulation and are also constructed to be very airtight. This means that natural air exchange between the interior of a building and the environment is comparatively low. These properties have a positive effect on a building's heating energy demand during the heating season. In addition to the normal heating demand, so-called "internal heat gains," i.e., waste heat generated by machines and equipment located within the building's thermal envelope, become increasingly significant the better the building insulation.However, during periods when heating the building is undesirable due to external circumstances, these internal heat gains can be undesirable, as they contribute to the building's heating. At such times, there is an interest in dissipating the waste heat from appliances within the building envelope. This is often achieved using mechanical ventilation systems that utilize electrical energy to dissipate the building's cooling load. The device according to the invention now makes it possible to directly dissipate the thermal energy generated by the at least one power semiconductor component, preventing it from accumulating in the kitchen in the first place. In this way, the building's cooling load is at least not further increased during the warmer months, thus reducing the corresponding energy input for cooling – particularly for cooling the kitchen – compared to the prior art.

[0016] A further particular advantage of the device according to the invention has proven to be that the discharged heat transfer fluid can be used particularly well to supply other devices or equipment with thermal energy. It is essentially irrelevant whether the discharged, heated heat transfer fluid or its thermal energy is used directly elsewhere or is first temporarily stored in an energy storage device. In principle, the waste heat from the at least one power semiconductor component can be used to heat water for a dishwasher, a washing machine, or other household appliances. By utilizing the generated thermal energy, the energy demand of the respective building can be further reduced.

[0017] The targeted removal of thermal energy according to the invention, using the heat exchanger unit and its heat transfer fluid, makes this possible.

[0018] Depending on the installation situation, it can be advantageous if the at least one heat exchanger unit is connected to the at least one power semiconductor device via at least one heat transfer device, wherein the heat transfer device is preferably formed by at least one heat pipe. Thermal energy generated at the power semiconductor device can be transported to the at least one heat exchanger unit particularly efficiently by means of one, or preferably several, heat pipes. This can be especially useful if the installation space for the device is confined and a direct connection of the heat exchanger unit to a power semiconductor device is not possible or at least difficult.

[0019] In a further advantageous embodiment of the device according to the invention, the cooktop assembly comprises an induction cooktop, wherein the at least one heating unit has at least one inductor. In particular, it is conceivable that the cooktop assembly is formed by an induction cooktop.

[0020] Furthermore, it can be advantageous if the device according to the invention has at least one temperature sensor by means of which the temperature of the at least partially liquid heat transfer fluid can be measured, wherein the at least one temperature sensor is preferably located downstream of the at least one heat exchanger unit. A temperature sensor is generally useful for monitoring the temperature of the heat transfer fluid. Information about the temperature of the heat transfer fluid allows a conclusion to be drawn as to whether the volume flow rate of the heat transfer fluid needs to be changed. Arranging the temperature sensor downstream of the at least one heat exchanger unit, viewed in the direction of flow, is advantageous insofar as the effect of the at least one power semiconductor component on the heat transfer fluid can be better assessed.

[0021] When using at least one temperature sensor, it is particularly advantageous if the device includes at least one logic unit by which at least one pump for pumping the at least partially liquid heat transfer fluid can be controlled as a function of the temperature of the heat transfer fluid measured by the at least one temperature sensor, and in particular if the at least one pump can be activated and deactivated as needed and / or at intervals. The logic unit allows an automated assessment of the situation of the at least one power semiconductor device, whereby this assessment is based on temperature information that the logic unit receives from the at least one temperature sensor. Depending on the waste heat generated by the at least one power semiconductor device, it is therefore possible to supply the at least one heat exchanger unit with the heat transfer fluid, with the logic unit controlling the at least one pump.

[0022] In a further advantageous embodiment, the device according to the invention comprises, in addition to the at least one cooktop unit, at least one energy system for storing, absorbing, and distributing thermal energy, wherein the at least one energy system has at least one storage unit for energy storage, and wherein the at least one heat exchanger unit of the at least one cooling unit of the cooktop unit is fluidically connected to the at least one storage unit of the energy system such that the heat transfer fluid is at least indirectly conductible between the at least one heat exchanger unit and the at least one storage unit. Such an energy system is particularly well suited to absorbing and transferring thermal energy derived from the at least one power semiconductor component.For this purpose, the energy system can comprise a heat transfer fluid that is at least partially liquid and advantageously corresponds to the heat transfer fluid of the cooktop device. Preferably, the thermal energy is further stored in the form of the at least partially liquid heat transfer fluid, which is advantageously water.

[0023] The described device is particularly well suited to realizing the aforementioned advantage of reusing the thermal energy generated at the at least one power semiconductor device. For this purpose, the heat transfer fluid is supplied either directly or indirectly to a consumer of thermal energy, whereby, as a rule, the energy system's storage unit is first supplied with the heat transfer fluid.

[0024] If the device according to the invention comprises the at least one energy system, it is particularly advantageous if the at least one storage unit of the energy system comprises a stratified storage tank for the stratified storage of water, at least one pipeline for conveying the water, and at least one pump unit for pumping the water through the pipelines. Such a stratified storage tank is particularly well suited to accommodate the heat transfer fluid of the cooktop device. In particular, it can be assumed that the temperature level of the heat transfer fluid will not be constant, but will vary depending on the controlled power of the power semiconductor device, specifically depending on the waste heat generated at the power semiconductor device. By means of a stratified storage tank, it is possible to introduce the heat transfer fluid into the stratified storage tank at a specific level, depending on its temperature.In this way, mixing of comparatively cool with warmer heat transfer fluid can be avoided, so that an energetically efficient use of the heat transfer fluid derived from the power semiconductor device is possible even if its temperature is below the temperature of a heat transfer medium that is present in the upper layers of the stratified storage tank.

[0025] Regardless of whether an energy system is present, such a device according to the invention can be particularly advantageous, the cooktop assembly of which comprises at least one further cooling unit formed by at least one finned unit, wherein the finned unit is preferably directly connected to the at least one power semiconductor device, and wherein the further cooling unit preferably also comprises at least one fan by means of which air movement along individual fins of the at least one finned unit can be forced. The finned unit generally comprises a plurality of cooling fins (also called "cooling ribs") which are suitable for distributing the heat energy accumulating at the at least one power semiconductor device over the largest possible area, so that convective heat transfer can take place as efficiently as possible.The combination of such a cooling unit with one that includes at least one heat exchanger unit is particularly well-suited for cooling the at least one power semiconductor device. In particular, it is conceivable to cool the power semiconductor device simultaneously by means of a convective airflow and by means of the at least one heat exchanger unit, thereby maximizing cooling capacity. This ensures maximum operational reliability for the at least one power semiconductor device, as even maximum amounts of waste heat energy can be reliably dissipated. Such amounts can occur, in particular, when several power semiconductor devices are operating at full load in close proximity.

[0026] Using at least one additional cooling unit, it is particularly advantageous if at least the cooling units formed by the at least one heat exchanger unit and the at least one fin unit are combined into a single cooling device, wherein the at least one fin unit is directly connected to a heat sink of the at least one heat exchanger unit through which the at least partially liquid heat transfer fluid flows, and wherein the heat sink is directly connected to the at least one power semiconductor device. Such a cooling device can be designed to be particularly compact and can therefore also be used in confined spaces. The direct connection of the heat sink to the at least one heat exchanger unit ensures efficient heat exchange between the at least one heat exchanger unit, the at least one fin unit, and the at least one power semiconductor device.

[0027] A further embodiment of the method involves providing a fan in the cooktop unit to circulate an airflow. This airflow is guided along the finned unit, and in the event of a liquid cooling failure (particularly water as the heat transfer fluid), the fan is preferably switched on as needed. This ensures the safe operation of the cooktop in the event of a water cooling failure, thanks to the fan's on-demand activation.

[0028] The method according to the invention serves to operate a device comprising at least one cooktop unit and at least one energy system. The cooktop unit comprises at least one support plate for receiving cookware, at least one heating unit arranged below the support plate by means of which the cookware can be heated, at least one support unit on which the at least one heating unit is arranged, at least one power electronics unit connected to the at least one heating unit, and at least one cooling unit by means of which the at least one power semiconductor component can be cooled. The power electronics unit comprises a power semiconductor component by means of which an electrical power suitable for operating the at least one heating unit can be controlled. The method according to the invention comprises the following process steps: a. Starting from a storage unit of the energy system, a heat transfer fluid that is at least partially liquid is fed at least indirectly to the at least one cooling unit formed by at least one heat exchanger unit of the at least one cooktop device. b. The heat transfer fluid flows through the at least one heat exchanger unit and in the process absorbs thermal energy that was previously generated as a result of the operation of the at least one power semiconductor component of the at least one cooktop device and was transferred at least indirectly from the at least one power semiconductor component to the at least one heat exchanger unit. c. Starting from the at least one heat exchanger unit, the heat transfer fluid is fed at least indirectly to the at least one storage unit of the energy system, whereby the thermal energy contained in the heat transfer fluid is fed into the storage unit.

[0029] The described method has many advantages. In particular, it allows the thermal energy generated during the operation of the at least one power semiconductor component to be used for other purposes. The resulting advantages for the overall energy balance of a building have already been explained above. It goes without saying that energy stored in the storage system can then be used to power a wide variety of devices and equipment, insofar as this appears sensible to a person skilled in the art.

[0030] In an advantageous embodiment of the method, the flow rate of the at least partially liquid heat transfer fluid through the at least one heat exchanger unit is controlled as a function of the heat transfer fluid's temperature, the temperature preferably being measured by means of a temperature sensor located downstream of at least one of the heat exchanger units. Such control allows the at least one power semiconductor device to receive only the volumetric flow rate of the heat transfer medium required for cooling the device. This has the advantage that the heat transfer fluid used to cool the at least one power semiconductor device is heated to a comparatively high temperature. This increases the usability of the heated heat transfer fluid, as it can be used for a greater number of external processes.For example, it is conceivable to use the heat transfer fluid to heat drinking water for the respective building by means of a water / water heat exchanger.

[0031] Furthermore, such a method is advantageous in which the at least one power semiconductor component of the at least one cooktop device is cooled by means of at least two cooling units, wherein a second cooling unit is formed by a finned unit that is connected to the at least one power semiconductor component in a heat-transferring manner. The advantages of a possible parallel use of the cooling unit comprising the at least one heat exchanger unit and the at least one further cooling unit have already been explained above.

[0032] Furthermore, such a process can be advantageous in which the thermal energy dissipated from the at least one power semiconductor device by means of the at least partially liquid heat transfer fluid is used to at least partially cover the thermal energy needs of at least one household appliance. In this context, a household appliance is understood to be any type of appliance that can be installed in a household. In particular, appliances not related to the kitchen are also conceivable, for example, bathroom appliances (shower, bathtub, sink, etc.). Such household appliances are particularly well suited to making efficient use of the thermal energy dissipated by the at least one power semiconductor device. This is evident from the comparable temperature levels: domestic hot water typically has a temperature between 35°C and 45°C.Such temperatures can certainly be achieved by cooling a power semiconductor component of a cooktop device, so that at least a portion of the energy required for hot water preparation can be replaced by the waste heat from power semiconductor components.

[0033] Further advantages and features of the present invention will become apparent from the exemplary embodiments, which are explained below with reference to the accompanying figures.

[0034] The figures show:

[0035] Fig. 1 a cross-section through a power semiconductor device interacting with a cooling unit according to the invention, which is formed by a heat exchanger unit,

[0036] Fig. 2 a cross-section through a power semiconductor device interacting with another cooling unit formed by a finned unit,

[0037] Fig. 3 a cross-section through a power semiconductor device that interacts with a first cooling unit according to the invention, comprising a heat transfer device, and with a second cooling unit formed by a finned unit, and

[0038] Fig. 4 a top view of the arrangement according to Fig. 3.

[0039] A first embodiment, which in Fig. Figure 1 shows a cooktop unit (not shown) which includes power electronics. The power electronics comprise a variety of power semiconductor components. 1 , of which in Fig. 1 of one shown in a cross-section. The power semiconductor device 1 is directly connected to a cooling unit 2 connected. The cooling unit 2 includes a heat exchanger unit 3 The heat exchanger unit 3 is from a heat sink 4formed, which has a through hole 5 exhibits. The bore 5 is equipped with a conductor element at its ends 6 connected. The heat exchanger unit 3 is in a cooling operation of the cooling unit 2 It is supplied with water as a liquid heat transfer medium. The water flows through the pipe elements. 6 into the heat sink 4 , where it can absorb thermal energy supplied by the power semiconductor device 1 via heat conduction to the heat sink 4 transitions. The power semiconductor device 1 This is done by means of the cooling unit 2 cooled. Overheating resulting from the control of high electrical power can be prevented in this way.

[0040] A second embodiment, which is described in Fig. The element shown in 2 also includes a power semiconductor component. 1 and a cooling unit 2, which is a heat exchanger unit 3 includes. In contrast to the embodiment according to Fig. 1 The cooktop unit also includes a second cooling unit 7 The cooling unit 7 includes a lamella unit 8 The louver unit 8 features seven cooling fins 9 on, which are directly and thermally conductive to the heat sink 4 are connected. The heat exchanger unit 3 and the slat unit 8 together they form a cooling device 10 Compared to the embodiment shown above Fig. 1 can be achieved using the cooling device 10 according to Fig. 2. A larger amount of thermal energy is dissipated, since the energy dissipation via the heat exchanger unit 3 This is achieved through convective removal of thermal energy via the lamella unit. 8 will be added.

[0041] Another embodiment, which is described in the Fig. 3 and Fig. As shown in section 4, a cooling unit is included. 2 , which is a heat exchanger unit 11 includes the heat exchanger unit. 11 is indirectly related to power semiconductor devices 1 connected. This indirect connection is achieved by means of a heat transfer device. 12 , the thermal energy from a heat sink 13 to the heat exchanger unit 3 transported. The heat sink 13 is directly related to the power semiconductor components 1 connected and includes a total of four heat pipes 14 The heat pipes 14 are thus thermally conductive with the power semiconductor components 1 connected. The heat pipes 14 are filled with a heat transfer medium that is partly liquid and partly gaseous. During the absorption of thermal energy by the power semiconductor components.1 The initially liquid heat transfer medium evaporates, absorbing its evaporation energy (enthalpy of vaporization) in the process. The now gaseous heat transfer medium then flows from the heat sink. 13 to the heat exchanger unit 11 , which is supplied with a liquid heat transfer medium. The liquid heat transfer medium of the heat exchanger unit 11 absorbs thermal energy from the gaseous heat transfer medium of the heat pipes 14 As a result, the gaseous heat transfer medium condenses and releases its condensation energy. The now liquefied heat transfer medium then flows through the respective heat pipes. 14 back to the heat sink 13 so that the cycle can begin again. The described structure of the cooling unit 2 is particularly suitable when space is limited around the power semiconductor components 1are so cramped around that a heat exchanger unit 11 not directly related to the power semiconductor components 1 can be connected.

[0042] In addition to the cooling unit 2 The power semiconductor components have 1 furthermore, a second cooling unit 7 , which is designed in a manner comparable to that shown in the second embodiment and operates according to the same mechanism.

[0043] It goes without saying that the heat transfer medium that powers the heat exchanger units 3 , 11 The thermal energy is transferred through the heat transfer medium, which then absorbs the energy and can be transferred to an energy storage device, subsequently making it available for other purposes. Furthermore, it is understood that the thermal energy transferred from the power semiconductor components via the heat transfer medium... 1 was transported away, not to an immediate vicinity of the power semiconductor components 1is released. In this way, overheating of the power semiconductor components is prevented. 1 , as sometimes occurs in the prior art, prevented. Reference symbol list 1 Power semiconductor device 2 cooling units 3 Heat exchanger unit 4 heat sinks 5 holes 6 Conductor element 7 Cooling unit 8 slat unit 9 cooling fins 10 Cooling device 11 Heat exchanger unit 12 Heat transfer device 13 heat sinks 14 Heatpipe

Claims

[1] Device comprising at least one hob unit, the hob unit comprising at least one support plate for holding cookware, at least one heating unit located below the base plate, by means of which the cookware can be heated, at least one support unit on which at least one heating unit is arranged, at least one power electronics unit connected to the at least one heating unit, wherein the power electronics unit is at least one power semiconductor component ( 1 ) includes, by means of which an electrical power can be controlled that is suitable for operating at least one heating unit, as well as at least one cooling unit ( 2 , 7 ), by means of which the at least one power semiconductor device ( 1 ) is coolable, characterized by that which at least one cooling unit ( 2) at least one heat exchanger unit ( 3 , 11 ) includes, which is heat-transferring with the at least one power semiconductor component ( 1 ) is connected and at least one conductor element ( 6 ) has, by means of which the at least one heat exchanger unit ( 3 , 11 ) can be supplied with a heat transfer fluid that is at least partially liquid. [2] Device according to the preceding claim, characterized by that the at least one heat exchanger unit ( 11 ) with at least one heat transfer device interposed ( 12 ) with at least one power semiconductor device ( 1 ) is connected, wherein the heat transfer device is preferably connected by at least one heat pipe ( 14 ) is formed. [3] Device according to one of the preceding claims, characterized bythat the cooktop device comprises an induction cooktop, wherein the at least one heating unit has at least one inductor. [4] Device according to one of the preceding claims, characterized by at least one temperature sensor by means of which a temperature of the at least partially liquid heat transfer fluid can be measured, wherein the at least one temperature sensor is preferably of the at least one heat exchanger unit ( 3 , 11 ) is downstream in terms of fluid dynamics. [5] Device according to the preceding claim, characterized by at least one logic unit by means of which at least one pump for pumping the at least partially liquid heat transfer fluid can be controlled as a function of a temperature of the heat transfer fluid measured by means of the at least one temperature sensor, in particular which the at least one pump can be activated and deactivated as required and / or at intervals. [6] Device according to one of the preceding claims, characterized by at least one energy system for storing, absorbing and distributing thermal energy, wherein the at least one energy system has at least one storage unit for energy storage and wherein the at least one heat exchanger unit ( 3 , 11 ) of at least one cooling unit ( 2 , 7 ) the cooktop unit is fluidically connected to the at least one storage unit of the energy system in such a way that the heat transfer fluid is at least indirectly transferred between the at least one heat exchanger unit ( 3 , 11 ) and at least one storage device is conductive. [7] Device according to the preceding claim, characterized bythat the at least one storage unit of the energy system comprises a stratified storage unit for the stratified storage of water, at least one pipeline for conveying the water, and at least one pumping unit for conveying the water through the pipelines. [8] Device according to one of the preceding claims, characterized by at least one further cooling unit ( 7 ), which are made up of at least one lamella unit ( 8 ) is formed, which is preferably directly connected to the at least one power semiconductor component ( 1 ) is connected, with the additional cooling unit ( 7 ) preferably further comprising at least one fan by means of which an air movement is created along individual slats of the at least one slat unit ( 8 ) is enforceable. [9] Device according to the preceding claim, characterized by that at least those of the at least one heat exchanger unit ( 11) and at least one slat unit ( 8 ) formed cooling units ( 2 , 7 ) to a cooling device ( 10 ) are united, wherein the at least one lamella unit ( 8 ) directly to a cooling element through which the heat transfer fluid, at least partially liquid, flows ( 13 ) of at least one heat exchanger unit ( 11 ) is connected and wherein the heat sink ( 13 ) directly with the at least one power semiconductor component ( 1 ) is connected. [10] Method for operating a device comprising at least one cooking hob device and at least one energy system, the cooktop equipment comprehensive at least one support plate for holding cookware, at least one heating unit located below the base plate, by means of which the cookware can be heated, at least one support unit on which at least one heating unit is arranged, at least one power electronics unit connected to the at least one heating unit, wherein the power electronics unit is at least one power semiconductor component ( 1 ) includes, by means of which an electrical power can be controlled that is suitable for operating the at least one heating unit, as well as at least one cooling unit ( 2 , 7 ), by means of which the at least one power semiconductor device ( 1 ) is coolable, comprising the following process steps: a. Starting from a storage point of the energy system, a heat transfer fluid that is at least partially liquid is transferred at least indirectly to at least one of at least one heat exchanger units ( 3 , 11 ) formed cooling unit ( 2 ) which is supplied to at least one cooktop unit. b. The heat transfer fluid flows through at least one heat exchanger unit ( 3 , 11 ) and in the process absorbs thermal energy that was previously generated as a result of the operation of at least one power semiconductor device ( 1 ) of at least one cooktop device and at least indirectly from the at least one power semiconductor component ( 1 ) on the at least one heat exchanger unit ( 3 , 11 ) has been transferred. c. Starting from the at least one heat exchanger unit ( 3 , 11 ) the heat transfer fluid is at least indirectly fed to the at least one storage unit of the energy system, whereby the thermal energy contained in the heat transfer fluid is fed into the storage unit. [11] Method according to the preceding claim, characterized bythat a flow rate of the at least partially liquid heat transfer fluid through the at least one heat exchanger unit ( 3 , 11 ) is controlled as a function of the temperature of the heat transfer fluid, wherein the temperature is preferably controlled by means of at least one of the at least one heat exchanger unit ( 3 , 11 ) measured by a downstream temperature sensor in terms of fluid dynamics. [12] Method according to one of the two preceding claims, characterized by that at least one power semiconductor device ( 1 ) the at least one cooktop unit by means of at least two cooling units ( 2 , 7 ) is cooled, with a second cooling unit ( 7 ) from a lamella unit ( 8 ) is formed, which is connected in a heat-transferring manner to the at least one power semiconductor component ( 1 ) is connected. [13] Method according to any one of the three preceding claims, characterized by that the at least one power semiconductor device ( 1 ) thermal energy removed by means of the at least partially liquid heat transfer fluid is used to at least partially cover the thermal energy needs of at least one household facility.

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