Optoelectronic component

Abstract

Optoelectronic component (16) comprising: a molded body (5), a semiconductor chip (2), an electrical via (3) which forms an electrically conductive connection through the molded body (5), wherein the via (3) and the semiconductor chip (2) are embedded side by side and spaced apart in the molded body (5), wherein an electrical contact (13) of the semiconductor chip (2) is formed on a top side of the semiconductor chip (2), wherein a first contact surface of the via (3) is arranged on the underside of the molded body (5), wherein a second contact surface of the via (3) is arranged on a top side of the molded body (5), wherein the second contact surface (9) is electrically connected to the electrical contact (13) of the semiconductor chip, wherein the via (3) is formed such that at least in a section between the first and the second contact surface (7,9) a shaped body (5, 50) is arranged on a straight line between the first and the second contact surface, wherein the through-hole has a spiral shape (33), wherein either a first end (34) of the spiral shape (33) forms the first contact surface and a second end (35) of the spiral shape (33) forms the second contact surface, and wherein the spiral shape (33) is arranged with a longitudinal axis perpendicular between the first and the second contact surface (7, 9), or wherein the spiral shape is arranged parallel with a longitudinal axis transverse, in particular parallel, to a top surface of the shaped body (5), wherein upper winding sections (36) of the spiral shape (33) form a first contact surface of the through-hole, and wherein lower winding sections (37) of the spiral shape (33), which are arranged opposite the upper winding sections (36), form a second contact surface of the through-hole.

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