Organic optoelectronic component

Abstract

Organic optoelectronic component comprising - an organic functional layer stack (S) between a first electrode (1) and a second electrode (2) comprising a light-emitting layer which is designed to emit radiation during operation of the component, - a coupling-out layer (3) above the first electrode (1) and / or the second electrode (2), which is arranged in the beam path (R) of the radiation of the light-emitting layer, a protective layer (4) above the coupling-out layer (3), wherein the coupling-out layer (3) comprises a structured layer (3a) and a planarization layer (3b) arranged thereover, and the structured layer (3a) has a surface (A) which is structured at least in places, and wherein the planarization layer (3b) planarizes the structured surface (A) of the structured layer (3a), and wherein the difference between the refractive indices of the structured layer (3a) and the planarization layer (3b) is at least in places less than 0.3, wherein the protective layer (4) is irreversibly bonded to the planarization layer (3b), and wherein the adhesion of the structured layer (3a) to the planarization layer (3b) is lower than the adhesion of the protective layer (4) to the planarization layer (3b).

Description

[0001] The invention relates to an organic optoelectronic component.

[0002] In organic optoelectronic components, such as organic light-emitting diodes (OLEDs), only a portion of the electromagnetic radiation generated in the light-emitting layer is coupled out to the environment. The remaining portion of the radiation is distributed among various loss channels, for example, radiation guided in the substrate or in organic layers by waveguiding effects. Without technical measures, only about a quarter of the generated radiation is coupled out to the environment, while the remainder is lost through waveguiding effects and total internal reflection. Manufacturers of such components are encouraged to keep the technical measures used to increase radiation coupling, and thus the coupling technology used, secret, so that the organic optoelectronic components cannot be analyzed, copied, or counterfeited, or can only be copied with difficulty.

[0003] The publication WO 2015 / 143 102 A1 describes nanostructures for a color-through-white OLED display.

[0004] The document DE 10 2012 200 084 A1 discloses a radiation-emitting organic component.

[0005] The document DE 10 2014 218 667 A1 is directed to an optoelectronic assembly and to a method for producing an optoelectronic assembly.

[0006] The publication WO 2014 / 022 482 A1 relates to a solvent-free enyne metathesis polymerization.

[0007] The document EP 2 278 852 A1 discloses a substrate for an electronic component, a layered body for an organic LED element and a method for its production, as well as an organic LED element and a method for its production.

[0008] The document US 2014 / 0 264 293 A1 is directed to a coated element and / or component with an optical output stack comprising a vacuum deposited index-matched layer over a scattering matrix and / or associated methods.

[0009] The document US 2013 / 0 285 088 A1 relates to an output layer comprising a particle-polymer composite.

[0010] The document US 2012 / 0 112 225 A1 teaches a method for producing an organic light-emitting diode with a structure comprising a textured surface and a corresponding OLED comprising a structure with a textured surface.

[0011] The object of the invention is to provide an organic optoelectronic component whose decoupling technology cannot be analyzed or is difficult to analyze and which is copy-protected.

[0012] These objects are achieved by an organic optoelectronic component according to independent claim 1. Advantageous embodiments and further developments of the invention are the subject of the dependent claims.

[0013] An organic optoelectronic component comprising an organic functional layer stack is specified. The organic functional layer stack is arranged between a first electrode and a second electrode. The organic functional layer stack comprises a light-emitting layer configured to emit radiation or light during operation of the component. The light-emitting layer is preferably configured to emit light in the visible range of the electromagnetic spectrum, for example, white light, during operation of the component.

[0014] The fact that a layer or element is arranged "between" two other layers or elements can mean here and below that one layer or element is arranged in direct mechanical and / or electrical contact or in indirect contact with one of the two other layers or elements, or in direct mechanical and / or electrical contact or in indirect contact with other layers or elements. In the case of indirect contact, further layers and / or elements can then be arranged between one and at least one of the two other layers or between one and at least one of the two other elements.

[0015] The organic optoelectronic component comprises an outcoupling layer arranged in the beam path of the radiation from the light-emitting layer. In particular, the outcoupling layer is arranged above the first and / or second electrode.

[0016] The fact that a layer or element is arranged or applied "on" or "over" another layer or element can mean here and below that one layer or element is arranged in direct mechanical and / or electrical contact with the other layer or element. Furthermore, it can also mean that one layer or element is arranged indirectly on or over the other layer or element. In this case, further layers and / or elements can be arranged between one and the other layer or between one or the other element.

[0017] The coupling-out layer comprises a structured layer and a planarization layer arranged above it, or consists of these layers. The coupling-out layer serves to increase the coupling-out of the radiation or light generated in the light-emitting layer.

[0018] The structured layer has a surface that is structured at least in places, and the planarization layer planarizes the structured surface of the structured layer. The fact that the planarization layer planarizes the structured surface of the structured layer means, in particular, that the planarization layer adapts to the surface of the structured layer. In particular, the planarization layer fills depressions in the surface of the structured layer, which arise from the structuring of the surface of the structured layer, seamlessly, in a form-fitting manner, and / or completely. The coupling-out layer comprising the structured layer and the planarization layer arranged above it, in particular, has a smooth surface.In this embodiment, the thicknesses of the planarization layer and the structured layer can vary across their surface, while the thickness of the coupling-out layer remains constant or constant within the manufacturing conditions. In particular, the planarization layer completely covers the structured layer.

[0019] The fact that the structured layer has a surface that is structured at least in places can mean that the surface is structured only in places or over the entire surface. For example, the surface of the structured layer can only be structured laterally, i.e., in a top view of this layer, on the outer sides.

[0020] A difference between the refractive indices of the structured layer and the planarization layer is at least locally less than 0.3, preferably less than 0.2, particularly preferably less than 0.1. In particular, the difference between the refractive indices of the structured layer and the planarization layer at the locations where the planarization layer is arranged above the structures of the structured layer is less than 0.3, preferably less than 0.2, particularly preferably less than 0.1. Very particularly preferably, the refractive index of the structured layer and the planarization layer is at least locally the same. With the small differences in the refractive indices, the structuring of the structured layer is not visible to a viewer from outside the organic optoelectronic component.Since the structuring of the surface of the structured layer within the outcoupling layer contributes significantly to increasing light outcoupling, an external observer cannot detect the structuring, thus obscuring the outcoupling technology used. This makes it difficult or even impossible to replicate the organic optoelectronic component. In other words, reverse engineering can be prevented, thus providing a form of copy protection.

[0021] According to at least one embodiment, the organic optoelectronic component comprises a substrate. The substrate can, for example, comprise one or more materials in the form of a layer, a plate, a film, or a laminate selected from quartz, glass, plastic, metal, or silicon wafer. In particular, the substrate comprises or consists of glass.

[0022] According to at least one embodiment, the first electrode is arranged on the substrate, in particular in direct mechanical contact with the substrate. The first electrode is designed, in particular, as an anode.

[0023] According to at least one embodiment, at least one of the electrodes is transparent. Here and below, transparent refers to a layer that is transparent to the radiation generated in the light-emitting layer, in particular to visible light. The transparent layer can be clearly translucent or at least partially light-scattering or partially light-absorbing, so that the transparent layer can, for example, also be diffusely or milkily translucent. Particularly preferably, a layer referred to here as transparent is as light-transmissive as possible, so that in particular the absorption of the radiation generated in the light-emitting layer of the organic functional layer stack during operation of the component is as low as possible.

[0024] In the organic optoelectronic component, for example, the first electrode can be transparent and the second electrode reflective. The organic optoelectronic component can thus be designed as a bottom emitter. Alternatively, the first electrode can be reflective and the second electrode transparent. The organic optoelectronic component can thus be designed as a top emitter.

[0025] According to at least one embodiment, both electrodes are transparent. This allows the radiation generated in the light-emitting layer of the organic functional layer stack to be emitted in both directions, i.e., through both electrodes. If the organic optoelectronic component has a substrate, this means that the radiation can be emitted both through the substrate, which is then also transparent, and in the direction away from the substrate. Furthermore, in this case, all layers of the organic optoelectronic component can be transparent, so that the organic optoelectronic component forms a transparent organic light-emitting diode.

[0026] In particular, the coupling-out layer is arranged above the electrode, which is transparent. If the OLED is a transparent one, i.e., if the first and second electrodes are transparent, the coupling-out layer can be formed above both electrodes. The coupling-out layer is preferably located on the main surface of the first and / or second electrode facing away from the organic layer stack.

[0027] According to one embodiment, the coupling-out layer is transparent.

[0028] A transparent conductive oxide, for example, can be used as a material for a transparent electrode. Transparent conductive oxides (TCOs) are transparent electrically conductive materials, usually metal oxides such as zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide, or indium tin oxide (ITO). In addition to binary metal-oxygen compounds such as ZnO, SnO2, or In2O3, ternary metal-oxygen compounds such as Zn2SnO4, CdSnO3, ZnSnO3, MgIn2O4, GaInO3, Zn2In2O5, or In4SnO are also included. 12 , or mixtures of different transparent conducting oxides belong to the group of TCOs. Furthermore, it is possible that the TCOs do not necessarily have a stoichiometric composition and can also be p- or n-doped.

[0029] Aluminum, barium, indium, silver, gold, magnesium, calcium, copper, or lithium, as well as compounds, combinations, and alloys thereof, may prove particularly advantageous as materials for a reflective electrode. These materials can also be used for transparent electrodes. The transparency can be adjusted by changing the thickness of the electrode layer. Silver nanowires can also be used for transparent electrodes.

[0030] According to one embodiment, the organic functional layer stack is arranged on the first electrode. The first electrode can be arranged on a substrate.

[0031] The organic functional layer stack comprises at least one light-emitting layer. The light-emitting layer can comprise organic polymers, organic oligomers, organic monomers, organic small non-polymeric molecules ("small molecules"), or combinations thereof. Furthermore, the light-emitting layer can be embodied as an electroluminescent layer. Suitable materials for this purpose are materials that exhibit radiation emission due to fluorescence or phosphorescence, for example, polyfluorene, polythiophene, or polyphenylene, or derivatives, compounds, mixtures, or copolymers thereof.

[0032] According to at least one embodiment, the organic functional layer stack comprises further functional layers, such as hole injection layers, hole transport layers, hole blocking layers, electron transport layers, electron blocking layers and / or electron injection layers.

[0033] According to at least one embodiment, the organic optoelectronic component is formed as an organic light-emitting diode (OLED).

[0034] According to at least one embodiment, the organic optoelectronic component has at least one encapsulation layer. In the present case, an encapsulation layer is understood to be a device configured to form a barrier against atmospheric substances, in particular against moisture and oxygen. In other words, the encapsulation layer is designed such that atmospheric substances, such as water or oxygen, penetrate it only to a very small extent.

[0035] The encapsulation layer can be a thin-film encapsulation layer. The thin-film encapsulation layer can comprise one or more thin layers, which are applied, for example, by means of chemical vapor deposition (CVD) or PECVD (plasma-enhanced chemical vapor deposition) and / or an atomic layer deposition (ALD) process and which comprise, for example, one or more materials such as silicon oxide, silicon carbide, silicon nitride, aluminum oxide, tin oxide, zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide, and tantalum oxide. The encapsulation layer can further comprise mechanical protection in the form of a plastic layer and / or a laminated glass layer and / or a laminated metal foil, for example made of aluminum. This can provide, for example, scratch protection.

[0036] Alternatively, other encapsulation layers are also possible, for example, in the form of a glued-on glass lid. In particular, the glass lid or the glass is arranged on a thin-film encapsulation using an adhesive or adhesive layer.

[0037] With regard to the basic structure of an organic optoelectronic component, for example with regard to the structure, the layer composition and the materials, reference is made to the document WO 2010 / 066 245 A1, which is expressly incorporated by reference, in particular with regard to the structure, the layer composition and the materials.

[0038] The organic optoelectronic component comprises a protective layer arranged above the coupling-out layer. The protective layer is, in particular, transparent.

[0039] According to at least one embodiment, the planarization layer is formed from a material with adhesive properties, for example an adhesive.

[0040] The protective layer is irreversibly bonded to the planarization layer. This means that the protective layer cannot be removed from the component without destroying the coupling-out layer, as the planarization layer is at least partially, preferably completely, removed along with it.

[0041] The adhesion of the planarization layer to the patterned layer is lower than the adhesion of the planarization layer to the protective layer. In other words, the planarization layer adheres more strongly to the protective layer than to the patterned layer.

[0042] In one embodiment, the protective layer is irreversibly bonded to the planarization layer, and the patterned layer is reversibly bonded to the planarization layer. This means that the protective layer cannot be removed from the component without destroying the coupling-out layer, since the planarization layer is at least partially, preferably completely, removed along with the planarization layer, but the patterned layer is preferably not removed and thus remains above the first and / or second electrode.

[0043] If the protective layer is removed from the outside, the planarization layer is also removed at the same time, making the structures of the structured layer irreversibly visible. Irreversible here means that the planarization layer can no longer be applied precisely to the structured layer again, or can only be applied with difficulty. As a result, the organic optoelectronic component can no longer be meaningfully examined optically after the protective layer has been removed in conjunction with the planarization layer. The emission spectrum of the component is altered compared to the emission spectrum of the component in its original state due to the irreversible destruction of the output coupling layer. Measuring the spectrum of the organic optoelectronic component is therefore no longer possible, and the output coupling technology can thus be obscured. Furthermore, technical benchmarking by competitors is made more difficult.The inventive combination of the decoupling layer with the protective layer thus forms an easily detectable copy protection.

[0044] According to at least one embodiment, the structuring of the structured layer can be periodic or non-periodic. The structures can be lens-shaped, i.e., with convex or concave curved surfaces, pyramid-shaped, truncated pyramid-shaped, truncated cone-shaped, rectangular, square, or similar. These can be, for example, photolithographically produced structures, microlenses, holographic grating structures, or structures for generating coherent optical effects. It is also possible for the structures to be created by embossing, printing, or laser engraving. Printing can be done, for example, using inkjet printing. Structuring can improve light extraction, for example, through light scattering.

[0045] According to at least one embodiment, the structured layer has structures, in particular topographic structures, which have structure sizes in the range from 1 nm to 100 µm, preferably 0.5 µm to 100 µm, particularly preferably 5 to 50 µm. The structure sizes can be the lateral and / or vertical extent. The spaces between the topographic structures are filled by the planarization layer, in particular seamlessly, positively and / or completely, and the structures and the structured layer are completely covered by the planarization layer. The structures can also differ in particular in their structure sizes, i.e. structures of different structure sizes can be present.

[0046] According to one embodiment, the coupling-out layer has, at least in places, a refractive index that is matched to the refractive index of the functional layers of the organic functional layer stack. In particular, the refractive index of the coupling-out layer and the refractive index of the functional layers of the organic functional layer stack can be the same. This allows the maximum possible light coupling to be achieved.

[0047] According to one embodiment, the coupling-out layer has a refractive index of approximately 1.8 at least in places. In particular, both the structured layer and the planarization layer thus have a refractive index of approximately 1.8 at least in places, wherein the difference between the refractive indices of the structured layer and the planarization layer can be less than 0.3, preferably less than 0.2, particularly preferably less than 0.1, at least in places. Compared to direct coupling-out of the radiation generated in the light-emitting layer into air with a refractive index of approximately 1, the loss of radiation due to waveguiding effects or total internal reflection at the electrode / coupling-out layer interface can be reduced compared to electrode / air, and thus light coupling can be improved.

[0048] According to one embodiment, the planarization layer and / or the structured layer and / or the protective layer comprises or consists of a polymer, wherein the polymer is preferably selected from a group comprising polyimides, polyacrylates, epoxy resins, and silicones. For example, it can be polymethyl methacrylate. These polymers in particular have a refractive index of approximately 1.5. These polymers have adhesive properties. This allows both the structured layer and the protective layer to adhere to the planarization layer.

[0049] According to at least one embodiment, the planarization layer and / or structured layer and / or protective layer comprises nanoparticles, in particular high-index nanoparticles. The nanoparticles make it possible to increase the refractive index of the layer. For example, the refractive index of the planarization layer and / or structured layer and / or protective layer comprising a polymer and nanoparticles can be 1.8.

[0050] According to at least one embodiment, the nanoparticles have a size of 1 nm to 100 nm, preferably 5 nm to 50 nm.

[0051] According to at least one embodiment, the nanoparticles, in particular the high-refractive-index nanoparticles, are formed from a metal oxide, for example from TiO2 or ZrO2.

[0052] According to one embodiment, the planarization layer and the structured layer comprise the same materials or are made of the same materials. This ensures that the refractive index is identical, so that the structuring is not visible from the outside.

[0053] The polymers can be applied to the structured layer in liquid form so that a gapless, form-fitting and / or complete filling of the spaces between the structures of the structured layer can be achieved and thus guaranteed.

[0054] According to one embodiment, a self-assembling monolayer, so-called self-assembly monolayer (SAM), is arranged between the structured layer and the planarization layer. The self-assembling monolayer can reduce the adhesion between the structured layer and the planarization layer. This can result in, for example, when the structured layer and the protective layer comprise the same material or consist of the same material, the adhesion of the structured layer to the planarization layer being lower than the adhesion of the protective layer to the planarization layer. Consequently, when the protective layer is removed, the planarization layer is also removed simultaneously, thus destroying the coupling-out layer.

[0055] According to one embodiment, the coupling-out layer consists of the structured layer, the self-organizing monolayer and the planarization layer.

[0056] According to one embodiment, the self-assembled monolayer consists of only one molecular layer. Depending on the material used, it can, for example, have a layer thickness between 0.1 nm and 10 nm. Thus, the optical properties of the organic optoelectronic component are not or hardly influenced by this layer.

[0057] According to at least one embodiment, the self-assembling monolayer is formed from thiols, silanes, silanols, or phosphonates. For example, the self-assembling monolayer is formed from methyltrichlorosilane or methylthiol.

[0058] In at least one embodiment, the structured layer is a substrate, a scattering layer, and / or an encapsulation layer. For example, it is the substrate on which the first electrode is arranged. However, it can also be a scattering layer or an encapsulation layer arranged on the substrate, preferably on the main surface of the substrate facing away from the layer stack.

[0059] If the structured layer is a scattering layer, according to one embodiment, scattering particles can be embedded in the structured layer. For example, the scattering particles can be SiO2, TiO2, or ZrO2 particles. It is possible for the structured layer to differ from the planarization layer only in the scattering particles. Thus, the structured layer may comprise a polymer, scattering particles, and optionally nanoparticles, or consist of these materials, and the planarization layer may comprise the same polymer and optionally the same nanoparticles, or consist of these materials.

[0060] According to one embodiment, the encapsulation layer is a thin-film encapsulation layer, a cover film, or a resist layer. The thin-film encapsulation can be implemented as described above and comprise, for example, silicon oxide, silicon carbide, silicon nitride, aluminum oxide, tin oxide, zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide, and tantalum oxide.

[0061] According to at least one embodiment, the cover film or lacquer layer can comprise the same materials as the planarization layer. Thus, they can comprise a polymer or consist of a polymer. The polymer is preferably selected from a group consisting of polyimides, polyacrylates, epoxy resins, and silicones.

[0062] According to one embodiment, the structured layer comprises or consists of quartz, glass, or plastic, preferably glass. Glass has a refractive index of approximately 1.5, preferably 1.8. For example, the structured layer can comprise or consist of glass, and the planarization layer can comprise or consist of polymethyl methacrylate. Both glass and polymethyl methacrylate can have a refractive index of approximately 1.5. A glass with a refractive index of 1.8 can also be selected for the structured layer, and the planarization layer can comprise polymethyl methacrylate and nanoparticles, wherein the refractive index of the planarization layer can be increased to 1.8 by adding the nanoparticles.

[0063] In one embodiment, the protective layer comprises or consists of quartz, glass, or plastic. The protective layer can optionally contain scattering particles such as TiO2 and thus be light-scattering.

[0064] In one embodiment, the difference between the refractive indices of the structured layer and the planarization layer is locally equal to or greater than 0.1, preferably greater than 0.2, particularly preferably greater than 0.3. This makes it possible, particularly in conjunction with suitable feature sizes, to make the structuring of the structured layer partially visible to a viewer from outside the organic optoelectronic component. For example, lettering with the manufacturer's logo can be made visible. The greater the refractive index difference for a given feature size, the more clearly the structures can be made visible from the outside.

[0065] According to one embodiment, the refractive index of the planarization layer can be increased, at least in places, by adding nanoparticles, in particular high-index nanoparticles. The effective refractive index results from the arithmetic mean of the volume fractions of the individual components when the size of the components / particles is significantly smaller than the wavelength, preferably less than 100 nm.

[0066] According to at least one embodiment, the planarization layer comprises nanoparticles, in particular high-index nanoparticles, at least in places. The nanoparticles make it possible to increase the refractive index of the layer in places. For example, the refractive index of the planarization layer comprising a polymer and nanoparticles can be 1.8 in places. For example, the structured layer can comprise glass and have a refractive index of 1.5. The planarization layer can be formed from polymethyl methacrylate in places and thus have a refractive index of 1.5 at these places, and can comprise polymethyl methacrylate and nanoparticles in places and thus have a refractive index higher than 1.5 at these places, for example 1.8.Structures over which the planarization layer with a refractive index of 1.5 is applied are then not visible from the outside, while the structures over which the planarization layer with a refractive index of 1.8 is applied are visible from the outside.

[0067] According to at least one embodiment, the nanoparticles have a size of 1 nm to 100 nm, preferably 5 nm to 50 nm.

[0068] According to at least one embodiment, the nanoparticles are formed from a metal oxide, for example from TiO2 or ZrO2.

[0069] According to at least one embodiment, the planarization layer comprises pores or low-refractive-index nanoparticles in places. Low-refractive-index nanoparticles are understood here to mean that they have a lower refractive index than the polymer used for the planarization layer. This makes it possible to lower the refractive index of the layer in places. In one embodiment, the planarization layer can be arranged only centrally or laterally with a difference in refractive indices from the structured layer of greater than 0.1, preferably greater than 0.2, particularly preferably greater than 0.3. A lateral arrangement means that, in a plan view from above, for example on an outer side of the surface, the planarization layer is applied with a difference in refractive indices from the structured layer of greater than 0.1, preferably greater than 0.2, particularly preferably greater than 0.3.This makes it possible to make a structuring of the structured layer visible to a viewer from outside the organic optoelectronic component in the center of the plan view or on at least one outer side.

[0070] Further advantages, advantageous embodiments and further developments emerge from the exemplary embodiments described below in conjunction with the figures. Fig. 1A, Fig. 2, Fig. 3 and Fig. 4A show schematic side views of embodiments of organic optoelectronic components described here, Fig. 1B shows a side view of an embodiment of an organic optoelectronic component described here during removal of the protective layer, Fig. 4B shows a top view of an embodiment of an organic optoelectronic component described here.

[0071] In the exemplary embodiments and figures, identical, similar, or similarly functioning elements may be provided with the same reference numerals. The illustrated elements and their relative sizes are not to be considered to scale. Rather, individual elements, such as layers, components, structural elements, and regions, may be exaggerated for clarity and / or clarity.

[0072] Fig. 1A shows a schematic side view of an embodiment of an organic optoelectronic component. The organic optoelectronic component comprises a layer sequence S arranged between a first electrode 1 and a second electrode 2. The layer sequence S comprises a light-emitting layer (not shown) which, during operation of the component, emits electromagnetic radiation in the visible range of the electromagnetic spectrum. The first electrode 1 is reflective and consists, for example, of aluminum; the second electrode 2 is transparent and consists of ITO. The optoelectronic component is designed as a top emitter. The first electrode 1 can be arranged on a substrate (not shown here). An outcoupling layer 3 is arranged above the second electrode 2.The coupling-out layer 3 is transparent to the radiation generated in the light-emitting layer and consists of a structured layer 3a and a planarization layer 3b. The structured layer 3a has a structured surface A. The structured layer 3a has structures 5 with structure sizes in the range from 1 nm to 100 µm. The structures can, for example, have a lateral extent of 50 nm and a vertical extent, i.e. a height, of 1 µm. The structured layer 3a consists of glass with a refractive index of approximately 1.8. The planarization layer 3b is arranged above the structured layer 3a. The planarization layer 3b covers the structured layer 3a completely or over its entire surface; in particular, the planarization layer 3b fills the spaces between the structures 5 seamlessly, positively, and completely.The planarization layer 3b is formed from polymethyl methacrylate and nanoparticles and has a refractive index of approximately 1.8. Thus, the structures 5 are not visible to an observer from outside the organic optoelectronic component. Thus, the structure of the coupling-out layer 3 cannot be recognized from the outside. This makes replicating the organic optoelectronic component difficult or impossible. A protective layer 4 is arranged above the coupling-out layer 3. The coupling-out layer 3 and the protective layer 4 are located in the beam path R of the radiation generated by the light-emitting layer in the organic functional layer stack S. The protective layer 4 can, for example, be a thin-film encapsulation layer made of silicon nitride. The protective layer 4 is irreversibly bonded to the planarization layer 3b, while the structured layer 3a is reversibly bonded to the planarization layer 3b.The adhesion of the planarization layer 3b to the structured layer 3a is thus lower than the adhesion of the planarization layer 3b to the protective layer 4. If the protective layer 4 is removed, which is shown in . Fig. 1B, the planarization layer 3b is simultaneously removed, so that the structures 5 of the structured layer 3a become irreversibly visible. After removal, the planarization layer 3b can no longer be applied to the structured layer 3a in a precise fit, or only with great difficulty. As a result, the organic optoelectronic component can no longer be meaningfully examined optically after removal of the protective layer 4 in conjunction with the planarization layer 3b. Due to the irreversible destruction of the coupling-out layer 3, the emission spectrum of the component is significantly different from the emission spectrum of the component in its original state, as shown in Fig. 1A. Measurement of the spectrum of the organic optoelectronic component is therefore no longer possible, and the coupling-out technology can be concealed. The inventive combination of the coupling-out layer 3 with the protective layer 4 thus forms an easily detectable copy protection.

[0073] Fig. Figure 2 shows a schematic side view of an embodiment of an organic optoelectronic component. Compared to the optoelectronic component in Fig. 1A is the optoelectronic component in Fig. 2 as a bottom emitter. The coupling-out layer 3 is arranged above the first electrode 1, in particular above the main surface of the first electrode 1 facing away from the organic functional layer stack S. The first electrode 1 can be designed as an anode and consist of ITO. The structured layer 3a is the substrate over which the first electrode 1 is arranged and consists, for example, of glass. The second electrode 2 is designed as a reflective cathode and consists, for example, of silver. The coupling-out layer 3 and the protective layer 4 are as under Fig. 1A described.

[0074] In Fig. Figure 3 shows a schematic side view of an embodiment of an optoelectronic component. The optoelectronic component is designed as a transparent OLED. This means that the radiation is emitted outward to the environment via the first electrode 1 and the second electrode 2. Compared to the Fig. 1A and Fig. 2, the coupling-out layer 3 and the protective layer 4 are located above the first electrode 1 and above the second electrode 2. The two electrodes 1 and 2 are transparent.

[0075] Fig. Figure 4A shows a schematic side view of an organic optoelectronic device. Compared to the device of Fig. 1A, the difference between the refractive indices of the structured layer 3a and the planarization layer 3b is in places equal to or greater than 0.1, preferably greater than 0.2, particularly preferably greater than 0.3. In the illustration, the hatched area of ​​the planarization layer 3b has a refractive index that is at least 0.1 different from that of the structured layer 3a. For example, the structured layer 3a comprises a glass with a refractive index of 1.5. The planarization layer 3b consists of polymethyl methacrylate with a refractive index of 1.5 and, in the hatched area, of polymethyl methacrylate and nanoparticles with a refractive index of 1.8. Thus, the structuring in the hatched area can be made visible to a viewer from outside the organic optoelectronic component. This is shown in Fig.4B, which shows a plan view from above of an optoelectronic component, in particular of the protective layer 4, and in which lettering is visible in the center. List of reference symbols 1 first electrode 2 second electrode 3 Decoupling layer 3a structured layer 3b Planarization layer 4 protective layer 5 Structure A structured surface S organic layer stack R beam path

Claims

[1] Organic optoelectronic device comprising - an organic functional layer stack (S) between a first electrode (1) and a second electrode (2) comprising a light-emitting layer which is designed to emit radiation during operation of the component, - a coupling-out layer (3) above the first electrode (1) and / or the second electrode (2), which is arranged in the beam path (R) of the radiation of the light-emitting layer, a protective layer (4) above the coupling-out layer (3), wherein the coupling-out layer (3) comprises a structured layer (3a) and a planarization layer (3b) arranged thereover, and the structured layer (3a) has a surface (A) which is structured at least in places, and wherein the planarization layer (3b) planarizes the structured surface (A) of the structured layer (3a), and wherein the difference between the refractive indices of the structured layer (3a) and the planarization layer (3b) is at least in places less than 0.3, wherein the protective layer (4) is irreversibly bonded to the planarization layer (3b), and wherein the adhesion of the structured layer (3a) to the planarization layer (3b) is lower than the adhesion of the protective layer (4) to the planarization layer (3b). [2] Organic optoelectronic component according to claim 1, wherein the refractive index of the structured layer (3a) and the refractive index of the planarization layer (3b) are at least partially the same. [3] Organic optoelectronic component according to one of the preceding claims, wherein the structured layer (3a) has structures (5) which are at least partially invisible to a viewer from outside the organic optoelectronic component. [4] Organic optoelectronic component according to one of the preceding claims, wherein the structured layer (3a) has structures (5) which have structure sizes in the range from 1 nm to 100 µm, preferably 0.5 µm to 100 µm, particularly preferably 5 µm to 50 µm. [5] Organic optoelectronic component according to one of the preceding claims, wherein the structuring is periodic or non-periodic. [6] Organic optoelectronic component according to one of the preceding claims, wherein the planarization layer (3b) comprises a polymer or consists of a polymer and the polymer is selected from a group comprising polyimides, polyacrylates, epoxy resins and silicones. [7] Organic optoelectronic component according to one of the preceding claims, wherein the difference in the refractive indices of the structured layer (3a) and the planarization layer (3b) is locally equal to or greater than 0.

1. [8] Organic optoelectronic component according to one of the preceding claims, wherein the difference in the refractive indices of the structured layer (3a) and the planarization layer (3b) is locally equal to or greater than 0.1, so that the structures (5) at these locations are visible to a viewer from outside the organic optoelectronic component. [9] Organic optoelectronic component according to one of the preceding claims, wherein the planarization layer comprises at least partially nanoparticles of a metal oxide. [10] Organic optoelectronic component according to one of the preceding claims, wherein the structured layer (3a) is a substrate, a scattering layer or an encapsulation layer. [11] Organic optoelectronic component according to one of the preceding claims, wherein the structured layer (3a) comprises glass or consists of glass. [12] Organic optoelectronic component according to one of the preceding claims, wherein a self-organizing monolayer is arranged between the structured layer (3a) and the planarization layer (3b). [13] Organic optoelectronic component according to the preceding claim, wherein the self-assembling monolayer is formed from thiols, silanes, silanols or phosphonates.

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