Method for treating components cut with laser beams, in particular plastic components

DE102016110489B4Active Publication Date: 2026-05-21DIELEKTRA HLDG GMBH
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Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
DIELEKTRA HLDG GMBH
Filing Date
2016-06-07
Publication Date
2026-05-21
Patent Text Reader

Abstract

Method for treating components and their cut edges, in particular plastic components, cut with laser beams against burn marks caused by the use of laser beams, characterized in that the components are placed in a bath with dissolved chlorine after cutting with the laser beams.
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Description

[0001] The invention relates to a method for treating components and their cut edges, particularly plastic components, cut with laser beams to prevent burn marks caused by the laser beams. When components are cut with laser beams, heat is generated at the point where the laser beam strikes the component being cut. Laser beams have varying energies, and the resulting heat generation can differ in intensity. In certain cases, this can lead to burn marks that prevent or impair the further use of the components.

[0002] Plastic components, in particular, are cut with laser beams. These plastic components can be films or thermoformed parts with thin walls. After laser cutting, burn marks containing carbon remain. This makes the surface of the cut component electrically conductive, which is detrimental.

[0003] Especially when these films are components for electrical circuit boards, conductivity is detrimental. On the contrary, films used in circuit board construction must have high tracking resistance to ensure the necessary resistances resulting from insulation.

[0004] A method for treating components cut with laser beams is known from AT 012 322 U1. EP 1 572 788 B1 describes a method for etching the surface of polyacetal objects. In contrast, DE 25 38 569 A1 describes a method for metallizing thermosets.

[0005] The invention is based on the objective of demonstrating a method of the aforementioned type with which burn marks caused by laser beams can be eliminated.

[0006] This problem is solved according to the invention by placing the components in a bath with dissolved chlorine after cutting them with the laser beams.

[0007] After laser cutting, the components are in their cut form. They may have burn marks. Following this process, the components are not immediately processed further, but are instead immersed in a bath of dissolved chlorine. Once immersed in this bath, the dissolved chlorine reacts with the burn marks and dissolves them. A chemical reaction occurs between the chlorine and the carbon.

[0008] The inventive method eliminates the need for any mechanical processing, particularly machining, of the cut edges. The fineness of the laser-cut components and their cut edges is preserved. The inventive method also imparts high tracking resistance to these components.

[0009] The bath preferably uses water with a dissolved chlorine content of 10% to 20%, more preferably 13% to 18%. At this chlorine concentration, effective removal of burn marks is achieved.

[0010] The components are immersed in the bath containing dissolved chlorine, preferably for a period of 1 to 120 minutes. This duration depends on the type of plastic and the laser beam energy used during cutting.

[0011] After the cut components have been treated with chlorine according to the invention, they can be placed in a second bath of water for rinsing.

Claims

[1] Method for treating components and their cut edges, especially plastic components, cut with laser beams against burn marks caused by the use of laser beams, characterized by that the components are placed in a bath of dissolved chlorine after being cut with laser beams. [2] Method according to claim 1, characterized by that water with a dissolved chlorine content of 10% to 20%, preferably 13% to 18%, is used for the bath. [3] Method according to one of claims 1 or 2, characterized by that the components are immersed in the bath with dissolved chlorine for a period of time from 1 min to 120 min. [4] Method according to any one of the preceding claims, characterized by that the components are then placed in a second bath of water.