Organic light-emitting diode

Abstract

Organic light-emitting diode (1) comprising: - a substrate (2), - an organic layer sequence (3) for light generation, which is attached to a substrate top surface (20) of the substrate (2), - electrical contact lines (4) for external electrical contacting of the light-emitting diode (1), and - a stabilizing structure (5), wherein: - the electrical contact lines (4) are attached to or in the stabilizing structure (5), - a plug connection for electrical contacting of the light-emitting diode (1) is realized through the stabilizing structure (5) along a connection direction (M) parallel to the substrate top surface (20), which is located next to the organic layer sequence (3) when viewed from above, - the light-emitting diode (1) has a greater thickness in the region of the stabilizing structure (5) than the substrate (2) in the region of the organic layer sequence (3), wherein the stabilizing structure (5) comprises at least one stabilizing socket (63),which is attached to the substrate (2) in the area of ​​the stabilizing structure (5), wherein the stabilizing bushing (63) is located on both sides of the electrical contact lines (4) when viewed in cross-section parallel to the connection direction (M), so that the electrical contact lines (4) are at least partially housed within the stabilizing bushing (63).

Description

[0001] An organic light-emitting diode and a method for connecting such an organic light-emitting diode are described.

[0002] One task to be solved is to specify an organic light-emitting diode that can be efficiently electrically connected.

[0003] This problem is solved, among other things, by an organic light-emitting diode and by a method with the features of the independent claims. Preferred embodiments are the subject of the dependent claims.

[0004] According to at least one embodiment, the organic light-emitting diode (OLED) comprises a substrate. The substrate can be the component that mechanically holds the OLED together. The substrate can be mechanically flexible, so that the OLED as a whole is mechanically flexible. Alternatively, the substrate can be mechanically rigid, so that the OLED does not deform, or does not deform significantly, during intended use.

[0005] According to at least one embodiment, an organic layer sequence for light generation is located on the upper surface of the substrate. The organic layer sequence comprises one or more active zones in which light is generated via charge carrier recombination. In addition to the active zone, light generation via photoluminescence is also possible, either directly within the organic layer sequence or in an additional photoluminescent layer.

[0006] According to at least one embodiment, the organic light-emitting diode comprises one or more electrical contact lines. The LED can be externally electrically contacted via these preferably multiple electrical contact lines. That is, the LED is preferably energized exclusively via these electrical contact lines. Electrical contact surfaces are also preferably implemented via these electrical contact lines.

[0007] According to at least one embodiment, the organic light-emitting diode (OLED) comprises one or more stabilizing structures. Due to the at least one stabilizing structure, the OLED is locally stiffened. That is, outside the area where the stabilizing structure is located, the OLED can be mechanically flexible and bendable, whereas at the stabilizing structure, the OLED is rigid and not designed to change shape.

[0008] According to at least one embodiment, the electrical contact lines are attached at least to and / or within the stabilizing structure. In particular, the electrical contact lines are freely accessible on or within the stabilizing structure, such that the electrical contact lines are accessible there, and in particular only there.

[0009] According to at least one embodiment, the stabilizing structure, along a connection direction oriented parallel to the substrate surface, provides a plug connection for electrically contacting the LED. In other words, the stabilizing structure, together with the electrical contact lines and optionally with the substrate, can form an electrical plug or socket through which the organic light-emitting diode can preferably be electrically and optionally mechanically connected to a standard component. Particularly preferably, the stabilizing structure is located directly and in direct physical contact with the substrate and / or the electrical contact lines.

[0010] According to at least one embodiment, the stabilizing structure is located adjacent to the organic layer sequence when viewed from above. This means, for example, that the stabilizing structure and the organic layer sequence do not overlap when viewed from above. Particularly preferably, the organic layer sequence and the stabilizing structure are spaced apart from each other. For example, the distance between the organic layer sequence and the stabilizing structure is at least 1 cm, 5 cm, or 10 cm and / or at least 10%, 30%, or 50% of a mean diagonal length of the organic layer sequence. In other words, the distance between the layer sequence and the stabilizing structure, when viewed from above, can be of the same order of magnitude as a dimension of the organic layer sequence.

[0011] According to at least one embodiment, the light-emitting diode has a greater thickness or a greater average thickness in the region of the stabilizing structure than the substrate in the region of the organic layer sequence. Furthermore, the light-emitting diode can have its greatest overall thickness in the region of the stabilizing structure, such that the thickness of the stabilizing structure or its average thickness is greater than the thickness of the substrate together with the organic layer sequence and together with electrodes and encapsulation layers for the organic layer sequence.

[0012] When assessing the aforementioned thicknesses, the electrical contact lines are disregarded. The thickness of the electrical contact lines is only approximately 10% of the substrate thickness, so their contribution to the overall thickness is negligible.

[0013] In at least one embodiment, the organic light-emitting diode (OLED) comprises a substrate and an organic layer sequence for light generation on the substrate's upper surface. It also includes electrical contact lines for external electrical contacting of the LED and at least one stabilizing structure. The electrical contact lines are attached to or within the stabilizing structure. The stabilizing structure provides a connector for electrical contacting the LED along a connection direction parallel to the substrate's upper surface, which, viewed from above, is located next to the organic layer sequence. The LED has a greater thickness in the region of the stabilizing structure than the substrate in the region of the organic layer sequence.

[0014] Conventional organic light-emitting diodes (OLEDs) are electrically connected via a flexible printed circuit board (PCB), also known as a flex PCB, which is attached to the substrate. The flexible PCB is bonded to the substrate using an anisotropic conductive bond, such as an anisotropic adhesive or an anisotropic conductive film, also known as ACF bonding. The flexible PCB has a connector through which the PCB, and thus indirectly the OLED, can be connected. A separate flexible PCB must be designed for each OLED design. Furthermore, the ACF bond introduces heat into the OLED. This can damage the organic layer sequence, especially on thermally conductive substrates like metal foils.

[0015] Alternatively, organic light-emitting diodes (OLEDs) can be electrically contacted directly at their contact surfaces on a substrate, for example, using spring contacts. This is particularly relevant for testing and characterization purposes, but less so for the final application of the LED. Such spring contacts are generally not suitable for a permanent and reliable electrical connection of the OLED. Furthermore, damage to the substrate and the contact surfaces can occur, for example, due to scratching.

[0016] In the organic light-emitting diode (OLED) described here, a connector is created directly on the LED itself and, in particular, directly on the substrate. The necessary mechanical stability is provided by the stabilizing structure. This allows for standardized contact directly on the OLED and / or directly on the substrate. Zero-force connectors, so-called ZIF connectors, or PCB edge connectors, also known as card-edge connectors, are preferably used for this purpose.

[0017] In summary, the organic light-emitting diode (OLED) described here eliminates the need for a flexible printed circuit board and the associated ACF bonding by incorporating a portion of the OLED itself as a connector. The electrical contact lines and the external geometry of the OLED are designed according to the connector manufacturer's specifications. This involves, in particular, metallization of the contact lines accessible for clamping or plugging to create a male connector. Alternatively, a female connector can be produced on the substrate, for example, using a 3D printing process.

[0018] The electrical contact lines, and thus the contact surfaces, can be located on a thickened area and / or covered with a layer of a particularly stable conductive material such as ITO to make the surface mechanically robust and to provide corrosion protection. Additionally, a stiffener can be bonded on to achieve the necessary thickness and rigidity for the connector. Such stabilizing structures can be based on polymers and produced by two-dimensional printing, such as screen printing.

[0019] Electrical contact surfaces can be generated from the electrical contact lines, for example, by targeted deposition of metals or transparent conductive oxides, or by sputtering and back-etching after the creation of the organic layer sequence, or by structured printing of metal traces, for example, via inkjet printing. If several separately controllable light surfaces are present, different cathode contacts can be combined, for example, via an electrically conductive substrate. A force-fit connection can be achieved in the connector. To achieve locking or coding, holes and / or grooves can be created, for example, by lasers, punching, drilling, or milling.

[0020] Such an organic light-emitting diode (OLED) can be manufactured cost-effectively because no design-specific purchased components such as flexible printed circuit boards are required, and ACF bonding can also be avoided. Adhesive bonding processes for stiffening the stabilizing structure necessitate a comparatively simple mechanical connection, for example, using common adhesive methods and materials, which represents a cost saving compared to ACF bonding. The electrical contact lines and contact surfaces can be efficiently processed on the OLED, and more complex mechanical geometries can be achieved cost-effectively using standard processes such as laser cutting.

[0021] Thermal decoupling between the connector and the organic layer sequence can be achieved. By using mechanically flexible substrates, the connector can be designed to be mechanically flexible, at least in certain areas. For example, meandering structures can provide a degree of elasticity. An opening in a thin-film encapsulation for the organic layer sequence, through which the electrical contact lines emerge, can be located far from the organic layer sequence itself, thus significantly reducing the ingress of moisture.

[0022] The contact surface design can be generic, allowing the use of standard components for further contacting. For example, only a relatively short first area can be attached to the organic light-emitting diode (OLED), to which a second area can be attached via a standard component such as a flexible printed circuit board or an electrical cable connection. This second area then serves for the final contacting of the OLED.

[0023] According to at least one embodiment, the stabilizing structure is partially or completely formed by the substrate. For this purpose, the substrate can be folded so that different areas of the substrate lie on top of each other when viewed from above. Such folded areas of the substrate exhibit, for example, a 180° bend, so that the substrate in the area of ​​the stabilizing structure can have antiparallel regions. Such substrate regions can be glued together.

[0024] According to at least one embodiment, the substrate is formed by glass, metal, plastic, or composite materials. The substrate can be electrically conductive or electrically insulating. Furthermore, the substrate can be transparent or, alternatively, opaque and / or reflective.

[0025] According to at least one embodiment, the electrical contact lines in the area of ​​the stabilizing structure extend across an edge of the LED. In other words, the electrical contact lines can extend continuously and uninterrupted from the top of the substrate to an opposite bottom of the substrate.

[0026] According to at least one embodiment, the stabilizing structure comprises or consists of one or more stabilizing plates. The at least one stabilizing plate is attached to the substrate in the area of ​​the stabilizing structure, for example, by gluing. Preferably, the stabilizing plate is mechanically rigid so that it does not deform, or does not deform significantly, during intended use.

[0027] According to at least one embodiment, the stabilizing plate is made of a plastic, glass, metal, or composite material. It is possible that the function of the stabilizing plate is limited to mechanical stabilization, so that the stabilizing plate does not perform any electrical and / or optical function.

[0028] According to at least one embodiment, the stabilizing plate is at least as thick as, or twice or three times as thick as, the substrate. Such a stabilizing plate allows for thickness adjustment to match, for example, standardized card-edge connectors.

[0029] According to at least one embodiment, the stabilizing plate is wrapped by the substrate in the area of ​​the stabilizing structure. That is, the substrate can be located over both main sides of the stabilizing plate. Thus, the substrate can be folded around the stabilizing structure. For example, the stabilizing structure is glued to the substrate on both sides.

[0030] According to at least one embodiment, the stabilizing structure comprises or consists of at least one stabilizing component. The one or more stabilizing components are preferably directly molded onto the substrate in the area of ​​the stabilizing structure, for example by casting, injection molding, or a printing process.

[0031] According to at least one embodiment, the stabilizing component and / or the stabilizing structure has a complex shape when viewed in cross-section parallel to the connection direction. This means that the stabilizing structure and / or the stabilizing component is not simply formed by a circle, an ellipse, a rectangle, or a square. In particular, the stabilizing component and / or the stabilizing structure has at least five or eight corners and / or at least one, three, or five radii when viewed in cross-section.

[0032] According to at least one embodiment, the stabilizing structure comprises one or more stabilizing sockets. The at least one stabilizing socket is attached to the substrate in the area of ​​the stabilizing structure. The stabilizing socket is preferably designed to receive an electrical connector for electrically contacting the organic light-emitting diode.

[0033] According to at least one embodiment, the stabilizing bushing is located on both sides of the electrical contact lines when viewed in cross-section parallel to the connection direction. That is, the electrical contact lines are partially or completely housed within the stabilizing bushing.

[0034] According to at least one embodiment, the stabilizing structure has one or more anchoring openings. Viewed from above, the at least one anchoring opening is preferably located completely within the substrate and / or the stabilizing structure. That is, viewed from above, the anchoring opening can be completely surrounded by material from the substrate and / or the stabilizing structure. The anchoring opening can be a latching hole into which a locking pin of an electrical connector engages. This prevents unintentional detachment of a connector from the organic light-emitting diode.

[0035] According to at least one embodiment, the stabilizing structure comprises one or more anchoring notches. Viewed from above, the at least one anchoring notch is located along the connection direction at an outer edge of the substrate and / or the stabilizing structure. Such a notch provides reverse polarity protection and / or prevents unintentional disconnection of the connector. Viewed from above, the anchoring notch is not completely surrounded by material from the substrate and / or the stabilizing structure.

[0036] According to at least one embodiment, the organic light-emitting diode comprises a support body. The support body is, for example, made of a metal, a plastic, or a ceramic. Preferably, the support body is mechanically rigid so that it does not deform, or does not deform significantly, during the intended use of the organic light-emitting diode.

[0037] According to at least one embodiment, the substrate is designed to be partially or completely mechanically flexible, at least outside the area of ​​the stabilizing structure. Furthermore, in the area outside the stabilizing structure, the substrate is attached to the support body either partially or over its entire surface. Thus, the geometric shape of the organic light-emitting diode can be determined by the support body.

[0038] According to at least one embodiment, the stabilizing structure is formed partially or completely by the support body, optionally together with the substrate. The support body can have a different thickness in the area of ​​the stabilizing structure, particularly in the direction perpendicular to the substrate, than in the remaining areas of the organic light-emitting diode.

[0039] According to at least one embodiment, the light-emitting diode, when viewed from above, is narrower in the area of ​​the stabilizing structure than in the area of ​​the organic layer sequence. In other words, the organic light-emitting diode tapers towards the stabilizing structure.

[0040] According to at least one embodiment, the connector is designed for reversible electrical connection of the organic light-emitting diode. Alternatively, it can be an irreversible connector.

[0041] According to at least one embodiment, the thermal resistance between the organic layer sequence and the connector is at least 200 K / W, 300 K / W, or 500 K / W. In other words, the organic layer sequence is poorly thermally coupled to the connector.

[0042] According to at least one embodiment, a meandering structure of the substrate and / or a reversibly stretchable expansion zone is located between the connector and the organic layer sequence. The expansion zone is, for example, reversibly stretchable by at least 5 mm, 1 cm, or 5 cm. Such an expansion zone or meandering structure mechanically decouples the connector from the organic layer sequence with respect to bending.

[0043] According to at least one embodiment, the connector is a zero-force connection, ZIF connection, or a PCB edge connector, also known as a card-edge connector. This preferably makes the connector a standard connection, allowing the organic light-emitting diode to be electrically connected via cost-effective, commercially available connectors.

[0044] Furthermore, a method for electrically connecting such an organic light-emitting diode is described. Features of the organic light-emitting diode are also disclosed for the method, and vice versa.

[0045] In at least one embodiment, the method comprises the following steps, in particular in the order shown: - Providing the substrate with the organic layer sequence, - Creating the stabilizing structure, and - Connecting the plug to a contact plug.

[0046] According to at least one embodiment, the electrical contact of the organic light-emitting diode is achieved by plugging it into the connector. This is preferably possible without tools.

[0047] According to at least one embodiment, the stabilizing structure is created by bending the substrate. The substrate can be bent once or several times.

[0048] According to at least one embodiment, the stabilizing structure is achieved by gluing or melting. Melting means that the stabilizing plate and / or the support body and / or the substrate is liquefied in certain areas by heating, thereby creating a strong mechanical bond.

[0049] According to at least one embodiment, the stabilizing structure is produced by injection molding onto the substrate. Injection molding, compression molding, or compression molding can be used for this purpose. The stabilizing component is preferably manufactured in this way.

[0050] According to at least one embodiment, the stabilizing structure is produced by three-dimensional printing, or 3D printing for short. This applies in particular to the stabilizing bushing, which can be located directly on the substrate.

[0051] The organic light-emitting diode (OLED) and the method described herein are explained in more detail below with reference to the drawing and examples of their embodiment. Identical reference symbols indicate identical elements in the individual figures. However, the figures are not to scale; rather, individual elements may be exaggerated for clarity.

[0052] They show: Fig. 1, Fig. 7 and Fig. 8 schematic three-dimensional and sectional views of exemplary embodiments of the methods described herein for the organic light-emitting diodes described herein, and Fig. 2 to Fig. 6 and Fig. 9 to Fig. 11 schematic sectional views, perspective views and top views of exemplary embodiments of the organic light-emitting diodes described herein.

[0053] In Fig. Figure 1A shows an embodiment of an organic light-emitting diode in a perspective view. 1 shown. The light-emitting diode 1 includes a substrate 2 with a substrate top 20 and a substrate underside 22 The substrate 2 It is, for example, made of a metal foil or a plastic film. The thickness of the substrate 2 For example, it is at least 50 µm and / or at most 250 µm, especially around 100 µm.

[0054] On the substrate surface 20 is an organic layer sequence 3 Attached for light generation. Electrodes not shown for the organic layer sequence. 3 are via partially exposed electrical contact lines 4 connected. Via the electrical contact lines 4 , which also form electrical contact surfaces, is the organic light-emitting diode 1Electrically connectable. The electrical contact wires 4 are preferably formed by one or more metal layers and can include a transparent conductive oxide such as ITO as a protective layer. The thickness of the electrical contact conductors 4 is approximately at least 2 µm and / or at most 8 µm.

[0055] Viewed from above, next to the organic layer sequence 3 There is a stabilization structure 5 The stabilization structure 5 It is designed as a plug connection, for example for a ZIF connector. To achieve a sufficient thickness of approximately 300 µm for such a connection, the substrate is 2 on a bending curve B curved, see the perspective drawing in Fig. 1B. The bending curve B is perpendicular to a connection direction M , which are in a direction of insertion through the stabilizing structure 5formed plug connection of the organic light-emitting diode 1 corresponds, oriented. The electrical contact lines extend to this point. 4 about the area of ​​the stabilization structure 5 formed edge of the organic light-emitting diode 1 away. In the still unbent organic light-emitting diode 1 Are the electrical contact lines sufficient? 4 preferably not extending to an outer edge of the substrate 2 .

[0056] In the area of ​​the stabilization structure 5 is the substrate 2 to create a stabilizing plate 61 bent around. This means both main sides of the stabilizing plate are bent. 61 to the underside of the substrate 22 with an adhesive 67 attached. The stabilizing plate 61 for example, it is made of a metal or a plastic.

[0057] Optionally, there is a space between the electrical contact lines.4 an anchoring opening designed as an elongated hole 71 In addition, a round-shaped anchoring opening can be used. 71 for example, next to the contact lines 4 be present. Such anchoring openings 71 provide a locking mechanism for contact plugs, in Fig. 1 not drawn, reachable.

[0058] Because the contact lines 4 on both main sides of the organic light-emitting diode 1 If the contacts are exposed, card-edge connectors can be used, which typically have contact springs on both sides. This allows for contact on both sides and, due to the redundancy, also provides greater robustness against faults. With card-edge connectors as contact plugs, the thickness of the stabilizing structure is [missing information]. 5 preferably at 1.4 mm. That is, the stabilizing structure 5 In this case, it has approximately ten times the thickness of the substrate. 2on. The organic layer sequence contributes to this. 3 as well as the undrawn electrodes and encapsulation layers do not contribute significantly to the overall thickness of the organic light-emitting diode.

[0059] In Fig. Figure 2 illustrates schematic sectional views of further embodiments. Fig. 2A is the substrate 2 on the stabilization structure 5 bent over so that there is a gap 64 is formed. When the organic light-emitting diode is plugged in 1 Is it possible that the gap 64 in a direction perpendicular to the connection direction M It is compressed. This allows it to be locked in place.

[0060] In contrast, the facing undersides are 22 of the substrate 2 in the stabilization structure 5 the Fig. 2B are attached to each other flat and without gaps, for example via the adhesive. 67 .

[0061] In Fig. 2C shows that both the stabilizing plate 61 as well as the substrate 2 are folded. Fold edges show according to Fig. 2C in opposite directions. In contrast, the folding edges of the stabilizing plate can be... 61 as well as the substrate 2 also point in the same direction. As in all other embodiments, it is possible that the contact lines 4 not on both main sides of the organic light-emitting diode 1 extend.

[0062] According to Fig. 2D is the substrate 2 around the stabilizing plate 61 wrapped around. In a direction perpendicular to the connection direction. M is the substrate 2 thus stacked three high on top of each other, with the stabilizing plate in between. 61 . Also mixed forms of the Fig. 2C and Fig. 2D is possible.

[0063] In the Fig. 3A and Fig. 3B are shown in sectional views of further embodiments of the light-emitting diode. 1 illustrated. The light-emitting diode includes 1 Each additional carrier body 66. The carrier body 66 is mechanically rigid and is the shape-giving component of the light-emitting diode. 1 , since the substrate 2 preferably mechanically flexible.

[0064] According to Fig. 3A will be the stabilization structure 5 through the carrier body 66 together with the bent substrate 2 formed. The carrier body exhibits 66 approximately a constant thickness.

[0065] In contrast, in Fig. 3B of the support body 66 in the area of ​​the stabilization structure 5 It is made thicker. This makes it possible to achieve the following in the stabilizing structure: 5a mechanically rigid and well-defined shape is present. The remaining areas of the organic light-emitting diode 1 The carrier body is 66 thinner, and therefore the light-emitting diode 1 less bending-resistant.

[0066] A connection of the substrate 2 The carrier body 66 can be used via the adhesive 67 This can be done. Alternatively, the carrier body can be used. 66 directly on the substrate 2 be produced, for example via a printing process.

[0067] Contrary to the representations in Fig. 3. It is not absolutely necessary that the substrate 2 is folded or bent. That is to say, the substrate 2 can refer to a main page of the carrier body 66 limit. This is evident in the perspective representation of the Fig. 4 in connection with the planar stabilization plate 61 shown, which together with the substrate 2the stabilization structure 5 educates.

[0068] In the sectional view of the Fig. 5A and the top views of the Fig. 5B and Fig. 5C is another embodiment of the light-emitting diode. 1 illustrated. The stabilization structure 5 is through a stabilizing molded part 62 Formed from a polymer. This requires an opening in the substrate. 2 completely made of a material of the stabilizing molded part 62 filled. In cross-section, the stabilizing molded part 62 shaped as an octagon, with the substrate top 20 in addition to the organic layer sequence 3 partially from the stabilizing molded part 62 is covered. The contact lines 4 are on the stabilizing molded part 62 upset.

[0069] In comparison to the area with the organic layer sequence 3The stabilization structure 5 In plan view, it appears narrower, see in particular Fig. 5B. The substrate is 2 for manufacturing the light-emitting diode 1 preferably via a temporary connecting element 92 entire surface on an intermediate support 91 applied to the intermediate support 91 are complex forms of the light-emitting diode 1 as well as the organic layer sequence 3 Feasible. Along singulation lines. S The pieces are then cut to create the finished LEDs. 1 , as in Fig. 5C illustrates.

[0070] Organic light-emitting diode 1 , as shown in the section view in Fig. 6A and in the top view in Fig. Figure 6B shows the stabilizing structure. 5 through a stabilizing bushing 63 formed, which are attached to the substrate via an additive process such as 2D printing or 3D printing 2is molded in place. The electrical contact lines are located there. 4 in certain areas of the stabilizing bushing 63 , at least in the area of ​​the stabilization structure 5 .

[0071] Remaining areas of the contact lines 4 are preferably covered by an electrical passivation layer, contrary to the simplified representation. Likewise, an encapsulation of the organic layer sequence (not shown) is preferred. 3 present, extending to the stabilizing socket 63 can reach and are partially connected to the stabilizing socket 63 It may be covered. The same applies to all other embodiments.

[0072] In the sectional views of the Fig. 7A and Fig. 7B shows that the organic light-emitting diode 1 via a contact plug 8 , which is, for example, a clamp connector, and is electrically connected. The stabilizing structure is part of this. 5through the stabilizing molded part 62 formed, which has a greater thickness than the substrate 2 The stabilizing molded part 62 can be flush with the underside of the substrate 22 To lock the contact plug. 8 at the light-emitting diode 1 The anchoring opening is optional. 71 available.

[0073] Regarding the contact plug 8 Is it perhaps a Card Edge Connector from the manufacturer Stocko, MF series? 7238 , as is possible in all other embodiments.

[0074] In the sectional views of the Fig. Figure 8 shows that the contact plug 8 a hinge 81 exhibits, so that the organic light-emitting diode 1 It can be electrically connected via a clamp. The stabilizing molded part protrudes from it. 62 over the underside of the substrate 22 outwards and is flush with the substrate surface20 off, so that the contact lines 4 can run in a straight line. For simplicity, the stabilizing component 62 in the Fig. 8B and Fig. 8C not drawn.

[0075] In the exemplary embodiments of Fig. 9 to Fig. 11, see the respective top views, shows the stabilizing structure 5 a comparatively large distance to the organic layer sequence 3 This results in a thermal and / or mechanical decoupling between the organic layer sequence. 3 and the stabilization structure 5 achievable. The organic layer sequence is involved. 3 from influences during the generation of the stabilization structure 5 protectable.

[0076] Thus, according to Fig. 9 a meandering structure 77 present. The meandering structure 77exhibits one or more serpentine bends in the substrate 2 up. This means that along the connecting direction M a mechanical decoupling of the stabilizing structure 5 from the organic layer sequence 3 Achievable. Along the connecting direction M can an expansion of the meander structure occur? 77 change without exerting much force.

[0077] In contrast, according to Fig. 10 a stretching area 78 available. The expansion range 78 is preferably reversibly stretchable and exhibits according to Fig. 10A a smaller longitudinal extent along the connection direction M on as in Fig. 10B. Even over such a stretching range 78 is a mechanical decoupling towards the organic layer sequence 3 achievable.

[0078] According to Fig. 11A is a symmetrically shaped anchoring notch. 72in the stabilization structure 5 available.

[0079] In contrast to this, in Fig. 11B two differently shaped anchoring notches 72 present. One of the notches 72 One is semicircular and the other triangular. This allows for reverse polarity protection.

[0080] Unless otherwise indicated, the components shown in the figures preferably follow one another in the specified order. Layers that do not touch each other in the figures are preferably spaced apart. Where lines are drawn parallel to each other, the corresponding surfaces are preferably also aligned parallel to each other. Likewise, unless otherwise indicated, the relative positions of the drawn components to each other are correctly represented in the figures.

[0081] The invention described here is not limited by the description based on the exemplary embodiments. Rather, the invention encompasses every new feature as well as every combination of features, which in particular includes every combination of features in the patent claims, even if this feature or combination itself is not explicitly specified in the patent claims or exemplary embodiments. Reference symbol list 1 organic light-emitting diode 2 Substrat 20 Substrate top 22 Substrate underside 3 organic layer sequence 4 electrical contact lines 5 stabilization structure 61 Stabilizing plate 62 Stabilizing molded part 63 Stabilizing bushing 64 space 66 carrier bodies 67 Adhesive 71 Anchorage opening 72 Anchoring notch 77 Meander structure 78 Stretch range 91 intermediate beams 92 temporary fastener 8 contact plugs 81 hinge B bending line M Connection direction S singulation line

Claims

[1] Organic light-emitting diode (1) with - a substrate (2), - an organic layer sequence (3) for light generation, which is attached to a substrate top surface (20) of the substrate (2), - electrical contact leads (4) for external electrical contacting of the light-emitting diode (1), and - a stabilization structure (5), wherein - the electrical contact lines (4) are attached to or in the stabilizing structure (5), - a plug connection for electrical contacting of the light-emitting diode (1) is realized by the stabilizing structure (5) along a connection direction (M) parallel to the substrate top surface (20), which is located next to the organic layer sequence (3) when viewed from above, and - the light-emitting diode (1) in the area of ​​the stabilizing structure (5) has a greater thickness than the substrate (2) in the area of ​​the organic layer sequence (3). [2] Organic light-emitting diode (1) according to the preceding claim, in which the stabilizing structure (5) is formed at least partly by the substrate (2), wherein the substrate (2) is folded on top of itself, so that in the area of ​​the stabilizing structure (5) the substrate (2) has a 180° bend. [3] Organic light-emitting diode (1) according to one of the preceding claims, wherein the electrical contact lines (4) extend over an edge of the light-emitting diode (1) in the area of ​​the stabilizing structure (5). [4] Organic light-emitting diode (1) according to any one of the preceding claims, where the stabilizing structure (5) comprises at least one stabilizing plate (61), wherein the stabilizing plate (61) is attached to the substrate (2) at least in the area of ​​the stabilizing structure (5), wherein the stabilizing plate (61) is made of a plastic or a metal. [5] Organic light-emitting diode (1) according to the preceding claim, wherein the stabilizing plate (61) is at least twice as thick as the substrate (2). [6] Organic light-emitting diode (1) according to one of the two preceding claims, wherein the stabilizing plate (61) is wrapped by the substrate (2) in the area of ​​the stabilizing structure (5). [7] Organic light-emitting diode (1) according to one of the preceding claims, wherein the stabilizing structure (5) is glued to the substrate (2). [8] Organic light-emitting diode (1) according to one of the preceding claims, wherein the stabilizing structure (5) comprises at least one stabilizing component (62) which is integrally formed with the substrate (2) in the area of ​​the stabilizing structure (5), wherein the stabilizing component (62) has at least five corners and / or at least one rounding in cross-section parallel to the connection direction (M). [9] Organic light-emitting diode (1) according to any one of the preceding claims, wherein the stabilizing structure (5) comprises at least one stabilizing bushing (63) which is attached to the substrate (2) in the area of ​​the stabilizing structure (5), wherein the stabilizing bushing (63) is located in cross-section parallel to the connection direction (M) on both sides of the electrical contact lines (4), so that the electrical contact lines (4) are at least partially housed inside the stabilizing bushing (63). [10] Organic light-emitting diode (1) according to one of the preceding claims, wherein the stabilizing structure (5) has at least one anchoring opening (71) which, viewed from above, is completely within the substrate (2) and / or the stabilizing structure (5). [11] Organic light-emitting diode (1) according to one of the preceding claims, wherein the stabilizing structure (5) has at least one anchoring notch (72) which, viewed from above, is located along the connection direction (M) at an outer edge of the substrate (2) and / or the stabilizing structure (5). [12] Organic light-emitting diode (1) according to any one of the preceding claims, furthermore comprising a rigid support body (66), wherein the substrate (2) is mechanically flexible at least outside the area of ​​the stabilizing structure (5) and is attached to the support body (66), and wherein part of the support body (66) together with the substrate (2) forms at least part of the stabilizing structure (5). [13] Organic light-emitting diode (1) according to any one of the preceding claims, where the substrate (2) is mechanically flexible at least outside the area of ​​the stabilizing structure (5), where the light-emitting diode (1) is narrower in the area of ​​the stabilizing structure (5) than in the area of ​​the organic layer sequence (3) when viewed from above, and wherein the plug connection is designed for reversible electrical connection of the light-emitting diode (1). [14] Organic light-emitting diode (1) according to any of the preceding claims, wherein the distance between the connector and the organic layer sequence (3) is at least 1 cm and / or the thermal resistance between the connector and the organic layer sequence (3) is at least 300 K / W. [15] Organic light-emitting diode (1) according to one of the preceding claims, in which a meander structure (77) of the substrate (2) and / or a reversibly stretchable area (78) of at least 1 cm is located between the connector and the organic layer sequence (3), so that the connector is mechanically decoupled from the organic layer sequence (3) with respect to bending. [16] Organic light-emitting diode (1) according to any of the preceding claims, wherein the connector is a zero-force connection or a printed circuit board edge connection. [17] Method for electrically connecting an organic light-emitting diode (1) according to any one of the preceding claims comprising the steps: - Providing the substrate (2) with the organic layer sequence (3), - Generating the stabilizing structure (5), and - Connecting the plug connector to a contact plug (8), thereby electrically contacting the light-emitting diode (1), whereby the generation of the stabilizing structure (5) is carried out by: - Bending the substrate (2), - Adhering or melting the stabilizing plate (61) or the support body (66) to the substrate (3), - Injection molding of the stabilizing component (72) onto the substrate (2), or - three-dimensional printing of the stabilizing bushing (63) on the substrate (2).

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