Pressure measuring arrangement

Abstract

Pressure measuring arrangement (100) comprising: a first MEMS pressure sensor (110) arranged on a carrier (140); a second MEMS pressure sensor (120) arranged on the carrier (140); and an integrated circuit (130) arranged on the carrier (140) and coupled to the first MEMS pressure sensor (110) and the second MEMS pressure sensor (120), wherein the first MEMS pressure sensor (110) is arranged on a first side of the carrier (140), and wherein the second MEMS pressure sensor (120) is arranged on a opposite second side of the carrier (140), wherein the integrated circuit (130) is arranged between the first MEMS pressure sensor (110) and the carrier (140), and wherein the first MEMS pressure sensor (110) is bonded to the integrated circuit (130).

Description

Technical field

[0001] Examples of embodiments deal with a pressure measuring arrangement. background

[0002] In safety-critical applications, sensors are typically redundant. The sensor signals are compared globally. For example, in the case of pressure sensors for side airbags in vehicles, the readings from pressure sensors installed in different doors or hatches are compared. Such a comparison can only yield a reliable result if the applied pressure is identical. This is the case with side doors, for instance, when the pressure inside the door is identical to the ambient pressure. However, such tests cannot be performed if the risk of an accident cannot be ruled out, in order to ensure the side airbag's readiness. Accordingly, such tests can usually only be carried out during the vehicle's start-up process. Summary

[0003] Therefore, there is a need to provide an improved concept for redundant pressure measurement.

[0004] The need can be met by the subject matter of the patent claims.

[0005] Exemplary embodiments of a pressure measurement arrangement comprise a first MEMS (micro-electromechanical system) pressure sensor mounted on a carrier, and a second MEMS pressure sensor mounted on the carrier. The pressure measurement arrangement further comprises an integrated circuit mounted on the carrier, which is coupled to the first MEMS pressure sensor and the second MEMS pressure sensor. List of characters

[0006] Examples of implementation are explained in more detail below with reference to the accompanying figures. These show: Fig. Figure 1 shows a first embodiment of a pressure measuring arrangement; Fig. Figure 2 shows a side view of a second embodiment of a pressure measuring arrangement; Fig. 3 and Fig. Figure 4 shows a front and a rear view of a third embodiment of a pressure measuring arrangement; Fig. 5 and Fig. Figure 6 shows a side and front view of a fourth embodiment of a pressure measuring arrangement; Fig. 7, Fig. 8 and Fig. Figure 9 shows a side, front and rear view of a fifth embodiment of a pressure measuring arrangement; and Fig. 10 and Fig. Figure 11 shows a side and front view of a sixth embodiment of a pressure measuring arrangement. Description

[0007] Several embodiments are now described in more detail with reference to the accompanying drawings, in which some of these embodiments are illustrated. For the sake of clarity, the thickness dimensions of lines, layers, and / or regions may be exaggerated in the figures.

[0008] In the following description of the accompanying figures, which merely show some exemplary embodiments, the same reference numerals can denote identical or comparable components. Furthermore, collective reference numerals can be used for components and objects that appear multiple times in an embodiment or in a drawing, but are described jointly with respect to one or more features. Components or objects described with the same or collective reference numerals can be identical with respect to one, several, or all features, such as their dimensions, but may also differ, unless the description explicitly or implicitly indicates otherwise.

[0009] Although embodiments can be modified and altered in various ways, they are shown in the figures as examples and are described in detail herein. It should be clarified, however, that the intention is not to limit embodiments to the forms disclosed, but rather that they are intended to cover all functional and / or structural modifications, equivalents, and alternatives within the scope of the invention. The same reference numerals throughout the figure description denote identical or similar elements.

[0010] Note that an element described as "connected" or "coupled" to another element may be directly connected or coupled to the other element, or there may be intermediate elements.

[0011] The terminology used herein serves only to describe specific embodiments and is not intended to limit the embodiments. As used herein, the singular forms "one," "an," "a," and "the" are intended to include the plural forms unless the context clearly indicates otherwise. Furthermore, it should be clarified that expressions such as "includes," "containing," "has," and / or "showing," as used herein, indicate the presence of the aforementioned features, integers, steps, processes, elements, and / or components, but do not preclude the presence or addition of one or more features, integers, steps, processes, elements, components, and / or groups thereof.

[0012] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning that a person competent in the field to which the embodiments belong would ascribe to them. Furthermore, it should be clarified that expressions, e.g., those defined in commonly used dictionaries, are to be interpreted as having the meaning consistent with their meaning in the context of the relevant technology, unless expressly defined otherwise herein.

[0013] Fig. Figure 1 shows a pressure measuring arrangement 100 comprehensively a first MEMS pressure sensor 110 , which is mounted on a carrier 140 is arranged, as well as a second MEMS pressure sensor 120 , which is on the carrier 140 is arranged. Furthermore, the pressure measuring arrangement includes 100 one on the carrier 140 arranged integrated circuit130 , which features the first MEMS pressure sensor 110 and the second MEMS pressure sensor 120 is coupled.

[0014] The pressure measuring arrangement 100 Can redundant pressure measurement be achieved using the first and second MEMS pressure sensors? 110 , 120 enable. Since the two MEMS pressure sensors 110 , 120 on the same carrier 140 are arranged so that even if one of the MEMS pressure sensors fails, it is still possible 110 , 120 A pressure measurement will be provided at the location of the pressure measuring device. Regarding the carrier 140 It can be any circuit or component carrier suitable for accommodating MEMS components as well as semiconductor components. For example, the carrier could be 140 a lead frame.

[0015] Via the integrated circuit 130 , which are equipped with both MEMS pressure sensors 110 , 120When coupled, a plausibility check of the measured values ​​from the MEMS pressure sensors is possible. 110 , 120 and thus the detection of an impairment or damage to one of the MEMS pressure sensors 110 , 120 take place.

[0016] For example, the integrated circuit 130 be trained to determine whether a measured value from the first MEMS pressure sensor 110 according to a predefined criterion, a measured value from the second MEMS pressure sensor 120 The specified criterion could, for example, be that the measured value of the first MEMS pressure sensor 110 (within the margin of error) identical to the measured value of the second MEMS pressure sensor 120 Alternatively, the specified criterion could be, for example, that there is a change in the measured value of the first MEMS pressure sensor. 110(within the margin of error) identical or opposite to a change in the measured value of the second MEMS pressure sensor 120 This is the case. In this way, the measured values ​​of the two MEMS pressure sensors can be determined. 110 , 120 be verified.

[0017] If the measured value of the first MEMS pressure sensor 110 not the measured value of the second MEMS pressure sensor 120 corresponds to the integrated circuit 130 furthermore, it will be set up to use the first MEMS pressure sensor 110 and the second MEMS pressure sensor 120 to perform a self-test. During the self-test, the MEMS pressure sensors 110 , 120 Each test routine or procedure is performed to verify the correct functioning of the MEMS pressure sensor. In other words: The integrated circuit 130 This allows verification of whether there is a defect or damage to one of the MEMS pressure sensors.110 , 120 is available.

[0018] If the integrated circuit 130 as a result of the self-tests of the MEMS pressure sensors 110 , 120 determines that one of the MEMS pressure sensors 110 , 120 The integrated circuit can no longer provide reliable measurements (e.g., due to damage). 130 It should be set up to display (only) the measured values ​​of the other of the two MEMS pressure sensors. 110 , 120 to provide the measured value from the pressure measuring arrangement at an output (not shown) for an external entity (e.g., a vehicle control unit). Furthermore, the integrated circuit can 130 be set up to use the other of the two MEMS pressure sensors 110 , 120 to control the integrated circuit according to a predetermined pattern and to perform a self-test. 130 verify whether the other of the two MEMS pressure sensors 110 ,120 continues to function properly. Furthermore, the integrated circuit can... 130 It should also be configured to provide a warning signal at the output for an external entity, containing information about the loss of redundancy in the pressure measurement and / or information about the reliability of the measured values ​​of the MEMS pressure sensors. 110 , 120 (e.g., that one of the two MEMS pressure sensors 110 , 120 (which includes situations where an error has been detected during the self-test). This prevents the external entity from operating with incorrect measurements.

[0019] Alternatively, the pressure measuring arrangement can be used 100 the measured values ​​of the two MEMS pressure sensors 110 , 120 also provide at the output for the external entity, and the external entity (e.g., a control unit or a suitably configured processor) performs the comparison described above to determine whether the measured value of the first MEMS pressure sensor110 according to a predefined criterion, the measured value of the second MEMS pressure sensor 120 corresponds to, through. If the measured value of the first MEMS pressure sensor 110 not the measured value of the second MEMS pressure sensor 120 If this corresponds, the external entity can send information about it to the integrated circuit 130 transmit so that the integrated circuit 130 again the first MEMS pressure sensor 110 and the second MEMS pressure sensor 120 can control it to perform a self-test.

[0020] The first MEMS pressure sensor 110 and the second MEMS pressure sensor 120 They can be identical in construction or have different designs. For example, MEMS pressure sensors can... 110 , 120 They can have the same or different sized diaphragms. Similarly, MEMS pressure sensors can... 110 , 120are based on different or the same measurement principle. Thus, the two MEMS pressure sensors can 110 , 120 be designed for capacitive or piezoresistive pressure measurement.

[0021] At the in Fig. 1 pressure measuring arrangement shown 100 are the two MEMS pressure sensors 110 , 120 as well as the integrated circuit 130 side by side on the same surface of the substrate 140 arranged. However, the MEMS pressure sensors can 110 , 120 as well as the integrated circuit 130 Alternatively, also on different sides of the carrier 140 or be arranged on top of each other. Various arrangement options are described below with reference to Fig. 2 to Fig. 9 described in more detail.

[0022] Fig. Figure 2 shows another pressure measurement arrangement 200 , which in turn provide a first MEMS pressure sensor 210, which is mounted on a carrier 240 is arranged, as well as a second MEMS pressure sensor 220 , which is on the carrier 240 is arranged, includes. Furthermore, it is an integrated circuit. 230 (e.g., an application-specific integrated circuit, ASIC), which is equipped with the first MEMS pressure sensor 210 and the second MEMS pressure sensor 220 is coupled, on the carrier 240 arranged. The first MEMS pressure sensor is 210 on the first side of the carrier 240 (e.g. a connection frame) arranged, and the second MEMS pressure sensor 220 is on a second, opposite side of the carrier 240 arranged. In the pressure measuring arrangement 200 is the integrated circuit 230 between the first MEMS pressure sensor 210 and the carrier 240 arranged.

[0023] The second MEMS pressure sensor is... 220to the second side of the carrier 240 glued (e.g. using a soft adhesive) 260 The first MEMS pressure sensor 210 is based on the integrated circuit 230 glued.

[0024] Due to the arrangement of the MEMS pressure sensors 210 , 220 on different sides of the carrier 240 Can simultaneous mechanical damage to both MEMS pressure sensors occur? 210 , 220 This can be virtually ruled out. Likewise, a high degree of mechanical decoupling of the two MEMS pressure sensors can be achieved. 210 , 220 through the integrated circuit 230 and the carrier 240 This is made possible – especially through the use of the soft adhesive. 260 for mounting the MEMS pressure sensors 210 , 220 .

[0025] Pressure measuring arrangement 200 It also includes one or more gel layers. 250 , which is the first MEMS pressure sensor 210and / or the second MEMS pressure sensor 220 and / or one with the first MEMS pressure sensor 210 or the second MEMS pressure sensor 220 coupled bond wire 211 or 221 at least partially covered or covering the gel layer. 250 It can, for example, include silicone. The gel can be used to protect the surfaces of the MEMS dies and the bond wires.

[0026] In Fig. 2 further indicates that the carrier 240 , the first MEMS pressure sensor 210 , the second MEMS pressure sensor 220 and / or the integrated circuit 230 at least partially from a potting compound 270 are encased. The potting compound 270 is, for example, part of a package that houses the other components of the pressure measurement system. 200 enveloped.

[0027] By appropriately shaping the casting compound 270 or the housing of the pressure measuring arrangement 200can a first pressure inlet 280 and a second pressure inlet 290 are formed, which are in Fig. 2 are only indicated. About the first pressure inlet 280 can an area in front of the first side of the carrier 240 and thus the first MEMS pressure sensor 210 with a pressure inlet at the first 280 The prevailing first pressure is brought into contact with or subjected to. Accordingly, the second pressure inlet can be used. 290 an area in front of the second side of the carrier 240 and thus the second MEMS pressure sensor 220 with one at the second pressure inlet 290 The prevailing second pressure is brought into contact with or subjected to.

[0028] Thus, the first MEMS pressure sensor 210 trained, the one at the first pressure inlet 280 to measure the prevailing first pressure, while the second MEMS pressure sensor 220 is trained to operate the second pressure inlet 290to measure the prevailing second pressure. Are both pressure inlets open? 280 , 290 For example, if they are in contact with the same volume, the first and second pressures are essentially identical. Accordingly, both MEMS pressure sensors should be... 210 , 220 output the same measured values. Using the integrated circuit 230 This can be monitored. Alternatively, the two pressure inlets can be... 280 , 290 They may also be in contact with different volumes, so the first pressure can differ from the second pressure. Accordingly, the integrated circuit can 230 from the measured values ​​of the two MEMS pressure sensors 210 , 220 e.g. a pressure difference between the pressure at the first pressure inlet 280 prevailing first pressure and the pressure at the second pressure inlet 290 measure the prevailing second pressure.

[0029] Pressure measuring arrangement 200This can therefore be understood as a multi-chip package containing an ASIC and two MEMS cells for pressure measurement. One MEMS cell is located on the ASIC, while the other MEMS cell is located on the back of the connection frame. As mentioned above, this virtually eliminates the possibility of simultaneous mechanical damage to both MEMS cells. Furthermore, the ASIC and the connection frame provide excellent mechanical decoupling of the MEMS cells, especially in combination with the soft adhesive used to mount the MEMS dies.

[0030] As already mentioned in connection with Fig. As noted in point 1, any type of MEMS pressure sensor or MEMS cell can be used (e.g., capacitive or piezoresistive). Likewise, the independence of the MEMS pressure sensors or MEMS cells can be improved by using different (i.e., not identical) MEMS pressure sensors or MEMS cells (e.g., with differently sized membranes).

[0031] As well as the ones in Fig. 1 integrated circuit shown 130 The integrated circuit can also 230 be trained to interpret the measured values ​​of the MEMS pressure sensors 210 , 220 to compare and, if necessary, control them, and to perform a self-test. This is because the MEMS pressure sensors 210 , 220 Being able to perform a self-test if needed, the readiness (availability) of the system can be checked even if one of the MEMS pressure sensors fails. 210 , 220 be maintained.

[0032] The coupling of the MEMS pressure sensors 210, 220 with the integrated circuit 230 is with more details in the Fig. 3 and Fig. Figure 4 shows a front and rear view of the pressure measuring arrangement. 200 show. For the sake of clarity, the gel layer 250 , the glue 260 and the potting compounds 270 in Fig. 3 and Fig. 4 not shown.

[0033] Fig. Figure 3 shows a front view of the pressure sensor. 200 , i.e., a top view of the first side of the support 240 , which is designed as a connection frame. The first MEMS pressure sensor 210 is based on the integrated circuit 230 glued, which in turn are attached to the first side of the carrier 240 It is glued. The integrated circuit 230 is via a plurality of bond wires 231 with the first MEMS pressure sensor 210 (Electrically) coupled. Alternatively, the first MEMS pressure sensor could 210and the integrated circuit 230 also be trained on a common die. The integrated circuit 230 It also features a plurality of bond wires with conductive areas or contacts (leads). 1 , 2 , ..., 8 of the carrier 240 linked. Via the contacts 1 , 2 , ..., 8 of the carrier 240 can the integrated circuit 230 to be coupled with or communicate with entities outside the pressure measurement setup.

[0034] Furthermore, the carrier points out 240 other conductive areas or contacts a , b , ..., e on. The integrated circuit 230 is connected via at least one first bond wire (here a plurality of bond wires) on the first side of the carrier 240 with the conductive areas or contacts a , b , ..., e conductively coupled.

[0035] Furthermore, it is from Fig. 4, which shows a rear view of the pressure measuring arrangement 200 (i.e., a top view of the second side of the support) 240 ) shows, as can be seen, that the second MEMS pressure sensor 220 via at least one second bond wire (here a plurality of bond wires) on the second side of the carrier 240 with the conductive areas or contacts a , b , ..., e carrier 240 is conductively coupled.

[0036] Via the conductive areas or contacts a , b , ..., e of the carrier 240 can the second MEMS pressure sensor 220 with minimal effort using the integrated circuit 230 on the other side of the support 240 be coupled.

[0037] In Fig. 5 is still an alternative pressure measurement arrangement 500 shown, where the first MEMS pressure sensor 310and the second MEMS pressure sensor 520 on the same side of the carrier 540 are arranged. The integrated circuit 530 is between the carrier 540 and both the first MEMS pressure sensor 510 as well as the second MEMS pressure sensor 520 arranged. For example, the first MEMS pressure sensor 510 and the second MEMS pressure sensor 520 , as in Fig. 5 shown, using a (soft) adhesive 560 on the integrated circuit 530 They could be glued. Alternatively, the MEMS pressure sensors could be used. 510 , 520 and the integrated circuit 530 also be trained on a common basis.

[0038] The integrated circuit 530 This points to the points already mentioned above in connection with integrated circuits. 130 and 230 The described properties and capabilities. Furthermore, components of the pressure measuring arrangement can500 in turn at least partially from a potting compound 570 be encased. Similarly, MEMS pressure sensors can be 510 , 520 as well as the bond wires coupled to it, at least partially covered by a gel layer 550 be covered. For details regarding the gel layer 550 or the coating with the potting compound 570 Reference is made to the above statements.

[0039] In Fig. 5 are both MEMS pressure sensors 510 , 520 on the first side (front) of the carrier 540 arranged. However, it goes without saying that the two MEMS pressure sensors 510 , 520 on the second side (back) of the carrier 540 They may be arranged.

[0040] In Fig. Figure 6 is also a front view of the pressure measuring arrangement. 500 , i.e., a top view of the first side of the support 540, shown to demonstrate the coupling of the integrated circuit 530 to the MEMS pressure sensors 510 , 520 to clarify. For the sake of clarity, the gel layer 550 , the glue 560 and the potting compounds 570 in Fig. 6 not shown.

[0041] The integrated circuit 530 is via a first majority of bond wires 531 with the first MEMS pressure sensor 510 (Electrically) coupled. Furthermore, the integrated circuit 530 is via a second plurality of bond wires 532 with the second MEMS pressure sensor 520 (Electrically) coupled. The integrated circuit 530 It also features a plurality of bond wires with conductive areas or contacts. 1 , 2 , ..., 8 of the carrier 540 linked. Via the contacts 1 , 2 , ..., 8 of the carrier 540can the integrated circuit 530 to be coupled with or communicate with entities outside the pressure measurement setup.

[0042] Pressure measuring arrangement 500 , which both MEMS cells are located on the chip surface (i.e., the integrated circuit) 530 ) carries, can in comparison to the pressure measuring arrangements 100 and 200 a reduced independence of the two MEMS pressure sensors 510 , 520 regarding mechanical damage, however the pressure measuring arrangement can 500 They can be manufactured more cost-effectively (e.g., the casing or assembly can be cheaper).

[0043] Another embodiment of a pressure measuring arrangement 700 , which differential pressure sensor cells, each in contact with a first pressure inlet on the front and a second pressure inlet on the back of the die, is in Fig. 7 shown.

[0044] The pressure measuring arrangement 700 includes a first MEMS pressure sensor 710 , which is on a first side (front) of the carrier 740 is arranged, and a second MEMS pressure sensor located on an opposite second side (rear side) of the carrier. 740 is arranged. As in Fig. As shown in section 7, the first MEMS pressure sensor can be used. 710 for example, using a (soft) adhesive 760 to the first side of the carrier 740 It may be glued. Similarly, the second MEMS pressure sensor may be... 720 using the adhesive 760 to the second side of the carrier 740 They may be glued. Alternatively, the MEMS pressure sensors can be... 710 , 720 also by any other suitable method on the carrier 740 to be attached. The first MEMS pressure sensor is... 710 partially above a first recess 741 in the carrier 740 arranged, while the second MEMS pressure sensor720 partially over a second recess 742 in the carrier 740 is arranged. As already described in connection with the preceding embodiments, the MEMS pressure sensors can be 710 , 720 as well as the bond wires coupled to it, at least partially covered by a gel layer 750 be covered.

[0045] The coupling of the MEMS pressure sensors 710 , 720 with the integrated circuit 730 is with more details in the Fig. 8 and Fig. Figure 9 shows a front and rear view of the pressure measuring arrangement. 700 show. For the sake of clarity, the gel layer 750 , the glue 760 and the potting compounds 770 in Fig. 8 and Fig. 9 not shown. Furthermore, for the sake of clarity, the following are not shown in the Fig. 8 and Fig. 9 only the recesses 742 or 741drawn, but not those on the opposite side of the support. 740 existing MEMS pressure sensors 720 or 710 .

[0046] Fig. Figure 8 shows a front view of the pressure sensor. 700 , i.e., a top view of the first side of the support 740 , which is designed as a connection frame. The first MEMS pressure sensor 710 is on the first side of the carrier 740 glued. The integrated circuit 730 is connected to the first MEMS pressure sensor via a plurality of bond wires 710 (Electrically) coupled. The integrated circuit 730 It also features a plurality of bond wires with conductive areas or contacts. 1 , 2 , ..., 8 of the carrier 740 linked. Via the contacts 1 , 2 , ..., 8 of the carrier 740 can the integrated circuit 730to be coupled with or communicate with entities outside the pressure measurement setup.

[0047] Furthermore, the carrier points out 740 other conductive areas or contacts a , b , ..., e on. The integrated circuit 730 is connected via at least one first bond wire (here a plurality of bond wires) on the first side of the carrier 740 with the conductive areas or contacts a , b , ..., e conductively coupled.

[0048] Furthermore, it is from Fig. 9, which shows a rear view of the pressure measuring arrangement 700 (i.e., a top view of the second side of the support) 740 ) shows, as can be seen, that the second MEMS pressure sensor 720 via at least one second bond wire (here a plurality of bond wires) on the second side of the carrier 740 with the conductive areas or contacts a , b , ..., ecarrier 740 is conductively coupled.

[0049] Via the conductive areas or contacts a , b , ..., e of the carrier 740 can the second MEMS pressure sensor 720 with minimal effort using the integrated circuit 730 on the other side of the support 740 be coupled.

[0050] Furthermore, the in Fig. 7 pressure measuring arrangement shown 700 a first pressure inlet 780 and a second pressure inlet 780 The pressure inlets 780 , 790 are in a housing of the pressure measuring arrangement 700 , which, for example, is made from the potting compound 770 can be educated, educated.

[0051] Via the first pressure inlet 780 can an area in front of the first side of the carrier 740 with a pressure inlet at the first 780The prevailing first pressure is brought into contact with the prevailing first pressure. Accordingly, the second pressure inlet can be used. 790 an area in front of the second side of the carrier 740 with one at the second pressure inlet 790 The prevailing second pressure is brought into contact with it. Due to the recesses 741 , 742 This will thus make the MEMS pressure sensors 710 , 720 both the first and second pressures are applied. The first MEMS pressure sensor 710 and the second MEMS pressure sensor 720 are thus each formed, creating a pressure difference between the pressure at the first pressure inlet 780 prevailing first pressure and the pressure at the second pressure inlet 790 to measure the prevailing second pressure.

[0052] Furthermore, the pressure measuring arrangement includes 700 another one on the carrier 740 arranged integrated circuit 730 , which features the first MEMS pressure sensor 710and the second MEMS pressure sensor 720 is coupled. Via the integrated circuit 730 This in turn can be used to verify the plausibility of the measured values ​​from the MEMS pressure sensors. 710 , 720 and thus the detection of an impairment or damage to one of the MEMS pressure sensors 710 , 720 take place.

[0053] For example, the integrated circuit 730 be trained to determine whether a measured value from the first MEMS pressure sensor 710 according to a predefined criterion, a measured value from the second MEMS pressure sensor 720 The specified criterion could, for example, be that the measured value of the first MEMS pressure sensor 710 (within the margin of error) identical to the measured value of the second MEMS pressure sensor 720 Alternatively, the specified criterion could be, for example, that there is a change in the measured value of the first MEMS pressure sensor. 710(within the margin of error) opposite to a change in the measured value of the second MEMS pressure sensor 720 This is the case. In this way, the measured values ​​of the two MEMS pressure sensors can be determined. 710 , 720 be verified.

[0054] If the measured value of the first MEMS pressure sensor 710 not the measured value of the second MEMS pressure sensor 720 corresponds to the integrated circuit 730 furthermore, it will be set up to use the first MEMS pressure sensor 710 and the second MEMS pressure sensor 720 to control, to perform a self-test. The integrated circuit 730 This allows verification of whether there is a defect or damage to one of the MEMS pressure sensors. 710 , 720 is available.

[0055] If the integrated circuit 730 as a result of the self-test of the MEMS pressure sensors 710 , 720 determines that one of the MEMS pressure sensors 710 , 720The integrated circuit can no longer provide reliable measurements (e.g., due to damage). 730 It must be set up to display the measured values ​​of the other of the two MEMS pressure sensors. 710 , 720 to provide the measured value from the pressure measuring arrangement at an output (not shown) for external entities (e.g., a vehicle control unit). Furthermore, the integrated circuit can 730 be set up to use the other of the two MEMS pressure sensors 710 , 720 to control the integrated circuit according to a predetermined pattern and to perform a self-test. 730 verify whether the other of the two MEMS pressure sensors 710 , 720 continues to function properly.

[0056] In Fig. 10 is yet another pressure measuring arrangement 1000 shown, where the first MEMS pressure sensor 1010 and the second MEMS pressure sensor 1020on the same side of the carrier 1040 are arranged. The first MEMS pressure sensor 1010 and the integrated circuit 1030 are based on a common The 1090 trained. The second MEMS pressure sensor 1020 is achieved using a (soft) adhesive 1060 on the integrated circuit 1030 or the 1090 glued.

[0057] The first MEMS pressure sensor 1010 is in a first area 1091 of this 1090 arranged. The first area 1091 of this 1090 is from a second area 1092 of this 1090 , in which the integrated circuit 1030 is trained, stress-decoupled. In other words: The first area 1091 of this 1090 is from the second area 1092 of this 1090 mechanically decoupled. In the first area 1091It could, for example, be an "island" made of silicon, in which the first MEMS pressure sensor is located. 1010 is formed and which has a spring-like (semiconductor) structure on the second area 1092 of this 1090 is hung up.

[0058] The two MEMS pressure sensors 1010 , 1020 the pressure measuring arrangement 1000 They are manufactured using different processes, meaning they are implemented in diverse ways. Accordingly, the susceptibility of the pressure measurement arrangement can vary. 1000 compared to systematic errors in the manufacturing processes of the two MEMS pressure sensors 1010 , 1020 be reduced.

[0059] The integrated circuit 1030 This points to the points already mentioned above in connection with integrated circuits. 130 and 230 The described properties and capabilities. Furthermore, components of the pressure measuring arrangement can 1000in turn at least partially from a potting compound 1070 be encased. Similarly, MEMS pressure sensors can be 1010 , 1020 as well as the bond wires coupled to it, at least partially covered by a gel layer 1050 be covered. For details regarding the gel layer 1050 or the coating with the potting compound 1070 Reference is made to the above statements.

[0060] In Fig. Figure 11 is also a front view of the pressure measuring arrangement. 1000 , i.e., a top view of the first side of the support 1040 , shown to demonstrate the embedding of the first MEMS pressure sensor 1010 as well as the integrated circuit 1030 in the common 1090 as well as the coupling of the integrated circuit 1030 on the second MEMS pressure sensors 1020 to clarify. For the sake of clarity, the gel layer 1050 , the glue 1060 and the potting compounds 1070 in Fig. 11 not shown.

[0061] The first MEMS pressure sensor 1010 is in the one from the rest of the 1090 stress-decoupled area 1091 trained. The MEMS pressure sensor 1010 is about the The 1090 with the integrated circuit 1030 (electrically) coupled.

[0062] The area in the second section 1092 this 1090 trained integrated circuit 1030 is via a plurality of bond wires 1031 with the second MEMS pressure sensor 1020 (Electrically) coupled. The integrated circuit 1030 It also features a plurality of bond wires with conductive areas or contacts. 1 , 2 , ..., 8 of the carrier 1040 linked. Via the contacts 1 , 2 , ..., 8 of the carrier 1040 can the integrated circuit 1030to be coupled with or communicate with entities outside the pressure measurement setup.

[0063] Alternatively, the second MEMS pressure sensor can be used 1020 also on the second side of the carrier 1040 be arranged (e.g. by means of the (soft) adhesive) 1060 to the second side of the carrier 1040 (be glued). Due to the arrangement of the MEMS pressure sensors 1010 , 1020 on different sides of the carrier 1040 This can increase the risk of simultaneous (mechanical) damage to both MEMS pressure sensors. 1010 , 1020 be reduced.

[0064] The pressure measurement arrangements described above 100 , 200 , 500 , 700 and 1000 These can be understood as exemplary implementations of a two-channel pressure measurement architecture that can enable completely redundant pressure measurement.

[0065] The features disclosed in the foregoing description, the following claims and the accompanying figures can be important and implemented individually or in any combination for the realization of an embodiment in its various configurations.

[0066] The embodiments described above merely illustrate the principles of the present invention. It is understood that modifications and variations of the arrangements and details described herein will be obvious to other people skilled in the art. Therefore, it is intended that the invention be limited only by the scope of protection set forth in the following claims and not by the specific details presented herein by way of description and explanation of the embodiments.

Claims

[1] Pressure measuring arrangement (100), comprising: a first MEMS pressure sensor (110) arranged on a carrier (140); a second MEMS pressure sensor (120) arranged on the carrier (140); and an integrated circuit (130) arranged on the carrier (140) which is coupled to the first MEMS pressure sensor (110) and the second MEMS pressure sensor (120). [2] Pressure measuring arrangement according to claim 1, wherein the first MEMS pressure sensor (110) is arranged on a first side of the carrier (140), and wherein the second MEMS pressure sensor (120) is arranged on an opposite second side of the carrier (140). [3] Pressure measuring arrangement according to claim 2, wherein the second MEMS pressure sensor (120) is glued to the second side of the carrier (140). [4] Pressure measuring arrangement according to claim 2 or claim 3, wherein the first MEMS pressure sensor (110) is glued to the first side of the carrier (140). [5] Pressure measuring arrangement according to claim 2 or claim 3, wherein the integrated circuit (130) is arranged between the first MEMS pressure sensor (110) and the carrier (140). [6] Pressure measuring arrangement according to claim 5, wherein the first MEMS pressure sensor (110) is glued onto the integrated circuit (130). [7] Pressure measuring arrangement according to claim 2 or claim 3, wherein the first MEMS pressure sensor (110) and the integrated circuit (130) are formed on a common die. [8] Pressure measuring arrangement according to any one of claims 2 to 7, further comprising: a first pressure inlet and a second pressure inlet, wherein the first MEMS pressure sensor (110) is configured to measure a first pressure prevailing at the first pressure inlet; and wherein the second MEMS pressure sensor (120) is configured to measure a second pressure prevailing at the second pressure inlet. [9] Pressure measuring arrangement according to any one of claims 2 to 4, further comprising: a first pressure inlet and a second pressure inlet, wherein the first MEMS pressure sensor (110) and the second MEMS pressure sensor (120) are each configured to measure a pressure difference between a first pressure prevailing at the first pressure inlet and a second pressure prevailing at the second pressure inlet. [10] Pressure measuring arrangement according to one of claims 2 to 9, wherein the carrier has at least one conductive area, wherein the integrated circuit (130) is conductively coupled to the at least one conductive area via at least one first bond wire on the first side of the carrier, and wherein the second MEMS pressure sensor (120) is conductively coupled to the at least one conductive area via at least one second bond wire on the second side of the carrier. [11] Pressure measuring arrangement according to claim 1, wherein the first MEMS pressure sensor (110) and the second MEMS pressure sensor (120) are arranged on the same side of the carrier (140). [12] Pressure measuring arrangement according to claim 11, wherein the integrated circuit (130) is arranged between the carrier (140) and both the first MEMS pressure sensor (110) and the second MEMS pressure sensor (120). [13] Pressure measuring arrangement according to claim 12, wherein the first MEMS pressure sensor (110) and the second MEMS pressure sensor (120) are glued onto the integrated circuit. [14] Pressure measuring arrangement according to claim 11, wherein the first MEMS pressure sensor (110) and the integrated circuit (130) are formed on a common die, and wherein the second MEMS pressure sensor (120) is glued onto the integrated circuit. [15] Pressure measuring arrangement according to claim 7 or claim 14, wherein the first MEMS pressure sensor (110) is arranged in a first region of the die which is stress-decoupled from a second region of the die, and wherein the integrated circuit (130) is formed in the second region of the die. [16] Pressure measuring arrangement according to one of the preceding claims, wherein the support (140) is a connecting frame. [17] Pressure measuring arrangement according to one of the preceding claims, further comprising a gel layer that at least partially covers the first MEMS pressure sensor (110) and / or the second MEMS pressure sensor (120) and / or a bond wire coupled to the first MEMS pressure sensor (110) or the second MEMS pressure sensor (120). [18] Pressure measuring arrangement according to one of the preceding claims, wherein the carrier (140), the first MEMS pressure sensor (110), the second MEMS pressure sensor (120) and / or the integrated circuit (130) are at least partially encased by a potting compound. [19] Pressure measuring arrangement according to one of the preceding claims, wherein the integrated circuit (130) is configured to determine whether a measured value of the first MEMS pressure sensor (110) corresponds to a measured value of the second MEMS pressure sensor (120) according to a predetermined criterion. [20] Pressure measuring arrangement according to claim 19, wherein, if the measured value of the first MEMS pressure sensor (110) does not correspond to the measured value of the second MEMS pressure sensor (120), the integrated circuit (130) is further configured to control the first MEMS pressure sensor (110) and the second MEMS pressure sensor (120) to perform a self-test. [21] Pressure measuring arrangement according to one of the preceding claims, wherein the first MEMS pressure sensor (110) and the second MEMS pressure sensor (120) are identical in construction. [22] Pressure measuring arrangement according to one of claims 1 to 20, wherein the first MEMS pressure sensor (110) and the second MEMS pressure sensor (120) are constructed differently.

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