Power module assembly

Abstract

Power module assembly, comprising: - at least one power module (200) with a base plate (210), an electronic component (230) mounted on a printed circuit board (250) arranged on an upper surface of the base plate (210), wherein a cast body (220) encapsulating at least one electronic component (230) and the printed circuit board (250) and encapsulating the upper surface and the side surface of the base plate (210), with at least one opening (221) such that a part of the upper surface of the base plate (210) is accessible from the opening; - a substrate (400) on which the power module (200) is arranged; and - at least one clamping device (300) which is designed to clamp on the accessible part of the upper surface of the mounting-hole-free base plate (210) and to fix the power module (200) to the substrate (400), wherein the clamping device (300) clamps on the part of the upper surface of the base plate (210) that is accessible externally from the body (220).

Description

Technical field

[0001] The present invention relates to an electrical device and in particular to a power module assembly and an electrical device comprising the power module. background

[0002] Electrical and mechanical requirements for customers in industrial and automotive applications are increasing. Power modules are used in various types of electrical equipment. The space available for cast power modules in electrical equipment such as inverters is becoming increasingly limited.

[0003] Conventionally, power modules are fixed to a substrate using fixing elements such as screws or bolts. These fixing elements typically pass through the corresponding fixing parts of the power module to secure it to the substrate. The fixing parts take up space, thus requiring more room in the electrical installation. Furthermore, if a large number of power modules are required, they cannot be arranged compactly due to the fixing parts.

[0004] US 6,122,170 A discloses a power module with a ceramic base plate mounted on a heat sink for heat dissipation. A metal film is arranged between the heat sink and the ceramic base plate. An IGBT chip or similar component is attached to the ceramic base plate by means of a conductive layer. This allows the ceramic plate to be mounted on the heat sink without soldering and without cracking due to thermal expansion, thus improving heat dissipation.

[0005] EP 0 609 528 A1 shows a semiconductor package for holding at least two semiconductor chips. The package includes a heat sink, an insulating material, a variety of package terminals, a frame, a cap, and an encapsulation material. Metal strips attached to the surface of the insulating material electrically connect the semiconductor chips.

[0006] US Patent 2017 / 0077044A1 discloses a semiconductor device with a plurality of main terminals extending from one end of a base plate toward the other end. One group of semiconductor chips is arranged on one side of the main terminal and mounted on the base plate. Another group of semiconductor chips is mounted on the other side of the main terminal on the base plate.

[0007] A solution is in the Fig. 1 and Fig. Figure 2 shows a power module 100 comprising a base plate 110 and a cast body 120, which is provided on the base plate 100. Sealing or encapsulating electronic elements, such as chips (not shown), are arranged on the base plate 110. To fix the power modules to a substrate (not shown), fixing parts 130, which may be integrated into the base plate 110, can be provided. Each of the fixing parts 130 can be provided with a hole through which a fixing element 140 can pass. The fixing element 140 can then be fixed to the substrate such that the power module is fixed to the substrate.

[0008] To mount a large number of power modules 100 compactly on the substrate, the fixing parts 130 are arranged in an offset configuration along two sides of the base plate 110. In this way, when the large number of power modules 100 are fixed on the substrate, the fixing parts of one power module 100 can alternate with fixing parts of an adjacent power module 100, as shown in Fig. 2 shown, arranged.

[0009] However, including the fixing components significantly increases the manufacturing costs of the base plate and the power module. Furthermore, each power module requires multiple fixing components to ensure secure mounting on the substrate, making assembly time-consuming.

[0010] A solution is needed that allows power modules to be mounted conveniently and compactly. Summary

[0011] The present invention has been made to overcome or eliminate at least one aspect of the aforementioned disadvantages.

[0012] In one aspect of the invention, a power module assembly comprising at least one power module is provided.

[0013] In one embodiment, the power module may comprise: a base plate; an electronic element mounted on the top surface of the base plate; and a body encapsulating the electronic element and the base plate. A portion of the top surface of the base plate is externally accessible. "Externally accessible" means that the exposed portion of the top surface of the base plate can be accessed from outside the aforementioned power module by means of another element or component that is not part of the power module itself.

[0014] In another embodiment, the body can be cast on the base plate and provided with at least one opening in the body such that the part of the upper surface of the base plate is accessible from the opening.

[0015] In another embodiment, the opening can have a depression formed in an edge of the body or a hole formed in the body.

[0016] In yet another embodiment, the multitude of openings can be distributed symmetrically in the body.

[0017] In one embodiment, the power module assembly may comprise: at least one power module according to one of the aforementioned embodiments; a substrate on which the power module is arranged; and at least one clamping device designed for clamping onto the part of the upper surface of the base plate and for fixing the power module to the substrate.

[0018] In a further embodiment, the body can be cast on the base plate and provided with at least one opening in the body such that the part of the upper surface of the base plate is accessible from the opening; and the clamping device can have a clamping element with a projection extending into the opening and be clamped to the accessible part of the upper surface of the base plate.

[0019] In another embodiment, the clamping device further comprises a fixing element which is designed to fix the clamping element to the substrate.

[0020] In yet another embodiment, the multitude of power modules are arranged side by side, and the clamping device is arranged between two adjacent power modules and clamped onto the accessible parts of the two adjacent power modules.

[0021] In yet another embodiment, the plurality of power modules is arranged in a field, the clamping device is arranged between two adjacent columns of the power modules, and the clamping device extends along the two adjacent columns and is clamped to the accessible parts of the power modules in the two adjacent columns. Brief description of the drawings

[0022] The above and other features of the present invention will become clearer by a detailed description of its embodiments with reference to the accompanying drawings, in which: Fig. 1 is an illustrative perspective view of an existing performance module; Fig. 2 is an illustrative perspective view, which shows an arrangement of a large number of performance modules according to Fig. 1 shows; Fig. 3 an illustrative top view of a power module for a power module assembly according to an embodiment of the invention; Fig. 4 an illustrative enlarged cross-sectional view along line AA according to Fig. 3 is; Fig. Figure 5 is an illustrative top view showing two performance modules according to Fig. 3 shows which sides are mounted side by side; Fig. 6 is an illustrative cross-sectional view, which is drawn along line BB according to Fig. 5 is; Fig. 7 is an illustrative top view showing four power modules arranged in a field according to an embodiment of the present invention; Fig. 8 is an illustrative top view of a power module for a power module assembly according to a further embodiment of the present invention; Fig. 9 an illustrative top view of a power module for a power module assembly according to yet another embodiment of the present invention; Fig. 10 an illustrative cross-sectional view along line CC according to Fig. 9 is; Fig. 11 an illustrative perspective view of the performance module according to the Fig. 9 and Fig. Figure 10 shows a clamping element mounted with the power module; and Fig. 12 an illustrative cross-sectional view along line DD according to Fig. 11 is. Detailed description of implementation examples

[0023] Exemplary embodiments of the present invention are described in detail below with reference to the accompanying drawings, in which the same reference numerals refer to the same elements. However, the present invention can be implemented in many different forms and should not be considered limited to the exemplary embodiment described below; rather, these exemplary embodiments are provided in such a way that the present invention is carefully and completely conveyed to the average person skilled in the art.

[0024] The Fig. 3 and Fig. Figure 4 shows a power module for a power module assembly in an embodiment of the present invention. The power module 200 comprises a base plate 210, an electronic component 230 mounted on an upper surface of the base plate 210, and a body 220 encapsulating the electronic component 230 and the base plate 210. As shown in the Fig. 3 and Fig. As shown in Figure 4, a portion of the upper surface of the base plate is exposed by the body 220 and thus externally accessible. The term "externally accessible" means that the exposed portion of the upper surface of the base plate can be accessed from outside the power module 200 by another component or tool that is not part of the power module itself. Utilizing this feature, a clamping device, which is described in detail below, can be used to clamp onto the exposed or accessible portion of the upper surface of the base plate 220, and the power module 200 can thereby be attached to a substrate 400 ( Fig. 6), a cooler, a printed circuit board or other mounting surface.

[0025] In order to expose the part of the upper surface of the base plate 200, the body which is usually cast onto the base plate and encapsulates the upper surface and the side surface of the base plate can be provided with at least one opening 221 such that the part of the upper surface of the base plate is accessible from the opening 221.

[0026] The opening 221 can be in the form of a depression 2211 formed in an edge of the body 220. In another embodiment, the opening 221 can be in the form of a hole 2212 formed in the body 220, which is described in detail below. A person skilled in the art can expect that the depression or hole can be formed while the body is being cast onto the base plate. Therefore, a suitable mold can be used to form the cast body with the depression or hole. It is understood that there can be one or more depressions 2211 formed in the body, depending on the practical situations or requirements. In the embodiment described below, the opening 221 is formed in the body. Fig. 3 and Fig. In the embodiment shown in Figure 4, four recesses 2211 are provided. Two of the recesses 2211 are formed in one side or edge of the body 220, and the other two of the recesses 2211 are formed in an opposite side or edge of the body 220. The four recesses 2211 are formed symmetrically in the two opposite sides of the body 220. In the embodiment shown in Figure 4, the recesses 2211 are formed in the opposite sides of the body 220. Fig. In the further embodiment shown in Figure 8, two recesses 2211 are provided in each of two opposite edges of the body 220. It should be noted that a power module with connections or terminals 240, which are connected to a circuit, other modules, other components or the like, as is the case in Figure 8, is usually provided in the body 220. Fig. Figure 3 shows that the recesses are provided on one or two opposite sides. In such a state, the recesses on one side or two opposite sides of the body may be shaped differently from the sides where the connections or terminals are provided.

[0027] The recesses 2211 can be formed in various shapes. For example, each recess 2211 can be in the shape of a rounded rectangle, as seen in the Fig. Figures 3 to 4 and 8 show the recess. In other examples, each recess can be in the shape of a semicircle, a semi-ellipse, a rectangle, or the like. The shape of the recess 2211 can be determined according to the shape of the electronic component 230, which is encapsulated in the body or area claimed by the electronic component 230.

[0028] It is to be established that one or more electronic components 230 are encapsulated in the body 220, depending on the practical requirements. The electronic component may be in the form of a semiconductor power switch, such as a bipolar insulated-gate transistor (IBGT), a metal-oxide-semiconductor field-effect transistor (MOSFET), or other active or passive components known in the prior art. Such components 230 may be mounted on a specific type of printed circuit board 250, such as a direct copper-bonded substrate (DCB) or a direct aluminum-bonded substrate (DAB), a printed circuit board, or by other mounting methods known in the prior art. As described in Fig. As shown in Figure 4, the circuit board 250 is also arranged on the upper surface of the base plate 210 and encapsulated by the body 220.

[0029] With the power module described in the exemplary embodiment, there is no longer a need to equip the base plate with mounting parts that have mounting holes, thus reducing the lateral dimensions of the power module. This reduction in lateral dimensions is a significant advantage when the application requires mounting more than one power module side by side. Furthermore, it is easier to seal small base plates than larger ones because a small side plate is less likely to warp. Additionally, the base plate can be manufactured more easily without mounting holes.

[0030] The Fig. 5 and Fig. Figure 6 shows that two power modules are mounted side by side by clamping devices 300. As shown, each clamping device 300 has a clamping element 310 and a fixing element 320. The clamping element 310 can have a plate-shaped body which is provided with at least one projection 311. The projection 311 extends into a corresponding recess 2211 and is pressed against a corresponding exposed part of the upper surface of the base plate 210. The clamping element 310 is provided with a hole through which the fixing element 320 can pass and fix the clamping element 310 to the substrate 400. The fixing element 320 can, for example, be a screw or a bolt which passes through the hole in the clamping element 310 and is fixed to a hole formed in the substrate 400.

[0031] It is understood that the projection 311 can have different shapes, but preferably the shape of the projection 311 is in accordance with or corresponds to the shape of the recess 2211.

[0032] With further reference to the Fig. 5 and Fig. Figure 6 shows that the central clamping device 300 is used to clamp the two power modules 200, which are arranged side by side. The clamping element 310 of the central clamping device 300 is provided with four projections 311, which extend into four recesses 2211, two of which are formed in the upper power module 200 and the other two in the lower power module 22. The upper and lower clamping devices 300 can have a different design than the central clamping device 300. As shown in Fig. As shown in Figure 5, each of the upper and lower clamping devices 300 has only two projections 311 on one side.

[0033] It goes without saying that an average professional would understand that this is in the Fig. 5 and Fig. The concept shown in Figure 6 can also be applied when a large number of power modules are arranged in a row or in a field. For the sake of simplicity, the power modules 200 are represented as rectangular blocks. Fig. Figure 7 shows four 200 power modules arranged in a 2x2 array. As in Fig. As shown in Figure 7, a clamping device 300 is arranged between two adjacent columns of the power modules 200, and the clamping device 300 has a clamping element 310 which extends along the columns. Each power module 200 is provided with two recesses on one side adjacent to the clamping device 300, and the clamping device 310 is provided with eight projections 311 which extend into eight recesses and is clamped to corresponding exposed portions of the base plates of the power modules 200 adjacent to the clamping element 310. The clamping element 310 is attached to a substrate (not shown) by means of two fixing elements 320, each of which is arranged between two adjacent power modules 200.

[0034] It is understood by a person skilled in the art that an upper clamping device, arranged on an upper side of the upper column of the power module, and a lower clamping device, arranged on a lower side of the lower column of the power modules, may be provided, and each of the upper and lower clamping devices may be designed to function similarly to that shown in Fig. The one shown in 7, however, has protrusions which are only provided on one side of it.

[0035] With the in Fig. In the arrangement shown in Figure 7, the number of clamping devices for the power modules can be significantly reduced, thereby lowering the cost of the clamping device. Furthermore, the power modules can be positioned closer together and fixed in place using the clamping device, resulting in a more compact system.

[0036] The Fig. 9 and Fig. Figure 10 shows a power module for a power module assembly according to a further embodiment of the present invention, and the Fig. 11 and Fig. Figure 12 shows that the power module is mounted with a clamping element.

[0037] With reference to the Fig. 9 and Fig. 10 shows a power module 200, which is from the one in Fig. The type shown in section 3 differs. However, the general training for performance module 200 is similar to that in Fig. 3 shown. One difference between the two power modules is that the openings 221 of power module 200 according to the Fig. 9 and Fig. 10 in different forms. As in the Fig. 9 and Fig. As shown in Figure 10, six holes 2212 are provided in the body 220, and parts of the upper surface of the base plate 210 are accessible from the holes 2212. Although the holes 2212, which are in Fig. As shown in Figure 9, the holes are round; it is clear to the average professional that the holes can have different shapes. Furthermore, there can be more or fewer holes, depending on practical factors such as the size of the power module.

[0038] Six holes 2212 are symmetrically arranged adjacent to two opposite sides of the body 220 of the power module 200. However, the positions of the holes can vary. For example, if four electronic components encapsulated in the body 220 are arranged in four quadrants of the body, and there is sufficient spacing between them, then one or more holes can be located at the center of the body 220. The positions of the holes can be determined based on practical considerations.

[0039] The clamping device 300 is then designed to be adapted to the configuration of the power module. As in the Fig. 11 and Fig. As shown in Figure 12, the clamping element 310 is designed to extend over the edge section of the body 220 and cover the holes 212. The clamping element 310 is provided with projections 311 that extend downwards from a lower surface of the clamping element 310 to positions aligned with the positions of the holes 2212, and passes through the holes 2212 and presses against the upper surface of the base plate 210 of the power module 200. It is understood that another clamping element may be provided on an opposite side of the power module 200.

[0040] It goes without saying for the average expert that the in the Fig. The concepts shown in sections 5 to 7 can also be applied to the embodiment described in the Fig. shown in 9 to 12. In particular, this can be seen in Fig.The clamping element shown in Figure 10 is configured to extend over the edge sections of two adjacent power modules arranged side by side and to cover the holes of the two power modules. The clamping element 310 can be provided with downward-facing projections on its lower surface, which extend into the holes of the two power modules. Furthermore, the clamping element can be configured to extend along two columns of a power module array and can be used to clamp power modules arranged in the columns. List of reference numbers 100 power module 110 Base plate 120 cast bodies 130 Fixing part 140 fixing element 200 power module 210 Base plate 220 cast bodies 221 Opening 2211 In-depth study 2212 holes 230 electronic components 240 connection / connection 250 printed circuit boards 300 clamping device 310 clamping element 311 lead 320 fixing element 400 substrate

Claims

[1] Power module assembly comprising: - at least one power module (200) with a base plate (210), an electronic component (230) mounted on a printed circuit board (250) arranged on an upper surface of the base plate (210), wherein a cast body (220) encapsulating at least one electronic component (230) and the printed circuit board (250) and encapsulating the upper surface and the side surface of the base plate (210), with at least one opening (221) such that a part of the upper surface of the base plate (210) is accessible from the opening; - a substrate (400) on which the power module (200) is arranged; and - at least one clamping device (300) which is designed to clamp on the accessible part of the upper surface of the mounting-hole-free base plate (210) and to fix the power module (200) to the substrate (400), wherein the clamping device (300) clamps on the part of the upper surface of the base plate (210) that is accessible externally from the body (220). [2] Power module assembly according to claim 1, wherein the power module (200) has an opening (221) in the body (220) with a recess (2211) formed in an edge of the body (220), or a hole (2212) formed in the body. [3] Power module assembly according to claim 2, wherein the body (220) of the power module (200) has a plurality of openings (221) distributed symmetrically in the body (220). [4] Power module assembly according to claim 1, in which the body (220) is cast onto the base plate (210) and is provided with at least one opening (221) in the body such that the externally accessible part of the upper surface of the base plate (210) is accessible from the opening (221); and the clamping device (300) has a clamping element (310) which has a projection (311) which extends into the opening (221) and is clamped on the accessible part of the upper surface of the base plate (210). [5] Power module assembly according to claim 4, wherein the clamping device (300) further comprises a fixing element (320) which is designed to fix the clamping element (310) to the substrate (400). [6] Power module assembly according to claim 1, in which a plurality of the power modules (200) are arranged side by side and the clamping device (300) is arranged between two adjacent power modules (200) and is clamped to the accessible parts of the two adjacent power modules (200). [7] Power module assembly according to claim 1, in which a plurality of the power modules (200) are arranged in a field, the clamping device (300) is arranged between two adjacent columns of the power modules (200) and wherein the clamping device (300) extends along the two adjacent columns and is clamped to the accessible parts of the power modules (200) in the two adjacent columns.

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